Patents by Inventor Ji Hyung Lee

Ji Hyung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240138260
    Abstract: The present disclosure relates to a plurality of host materials, an organic electroluminescent compound, and an organic electroluminescent device comprising the same. By comprising a specific combination of host compounds and/or an organic electroluminescent compound according to the present disclosure as an organic electroluminescent material, an organic electroluminescent device having low driving voltage and/or high luminous efficiency and/or long lifespan characteristics can be provided.
    Type: Application
    Filed: September 8, 2023
    Publication date: April 25, 2024
    Inventors: Ji-Song JUN, Hong-Se OH, Dong-Hyung LEE, Sang-Hee CHO, Du-Yong PARK, Hyun-Woo KANG, Jin-Man KIM
  • Patent number: 11948752
    Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell surrounding at least a portion of the core, and a second shell surrounding at least a portion of the first shell, and a concentration of a rare earth element included in the second shell is more than 1.3 times to less than 3.8 times a concentration of a rare earth element included in the first shell.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: April 2, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Hyung Kang, Jong Hyun Cho, Ji Hong Jo, Hang Kyu Cho, Jae Shik Shim, Yong In Kim, Sang Roc Lee
  • Patent number: 11948808
    Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: April 2, 2024
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
  • Patent number: 11943985
    Abstract: Discussed are a light-emitting device and a light-emitting display device having improved efficiency and increased lifespan. A plurality of stacks is provided between an anode and a cathode for at least a subpixel to emit a predetermined color, and emissive layers in different stacks include the same color-based materials having different luminous properties.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: March 26, 2024
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Jin Ho Park, Kyu Il Han, Chang Hwan Kwak, Dong Hyeok Lim, Hwa Yong Shin, Ji Hyung Lee
  • Publication number: 20240088361
    Abstract: A lithium secondary battery includes a cathode including a cathode current collector and a cathode active material layer formed on the cathode current collector, and an anode including an anode current collector and an anode active material layer formed on the anode current collector. The anode active material layer has an area larger than that of the cathode active material layer. The cathode active material layer includes a central portion and an outer portion surrounding the central portion, and the outer portion has a specific capacity less than that of the central portion.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Ji Hyung KIM, Young Ha KIM, Sang Bin LEE, Ho Jin HWANG
  • Patent number: 11929758
    Abstract: An analog switch circuit in a successive approximation register analog-to-digital converter for a wide sampling rate includes a first PMOS switch controlled by a voltage of a second control node, second PMOS switch controlled by a control voltage, a first control switch unit controlling voltages of first and second control nodes, a first NMOS switch controlled by a voltage of a fourth control node, a second NMOS switch controlled by the control voltage und, and a second control switch unit controlling voltages of third and fourth control nodes.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: March 12, 2024
    Assignee: SEMISOLUTION CO., LTD.
    Inventors: Jung Won Lee, Ji Hyung Kim
  • Patent number: 11878003
    Abstract: This application relates to a composition for preventing, treating, and improving skeletal muscle atrophy, the composition including an organoselenium compound. The composition recovered the thickness of muscle fiber reduced by dexamethasone treatment. In addition, the treatment of mice in a muscle loss model showed that the composition had an effect of reducing damaged muscle and of restoring muscle mass. Therefore, it is expected that the composition can be effectively used for the treatment, prevention, or improvement of muscle atrophy.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: January 23, 2024
    Assignee: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Darren Reece Williams, Da-Woon Jung, Ji-Hyung Lee, Hyun-Jun Kim, Seon-Wook Kim
  • Patent number: 11877463
    Abstract: Discussed is a light emitting display device which enables a common layer having high hole conductivity among common layers in respective stacks to include a material having a high orientation factor value so as to prevent generation of leakage current between subpixels and ensure high efficiency and a long lifespan.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: January 16, 2024
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Dong Hyeok Lim, Bo Seong Kim, Hwa Yong Shin, Ji Hyung Lee
  • Patent number: 11869857
    Abstract: A semiconductor package component and a semiconductor package including the same. More particularly, the present disclosure relates to a semiconductor package component for an RF power transistor and a semiconductor package including the same. Further particularly, it relates to a semiconductor package component for an RF power transistor and a semiconductor package including the same, capable of adjusting impedance matching of an RF transistor by connecting a die chip and a lead frame with a wire so that a length of the wire is reduced as much as the protruding height of the base substrate.
    Type: Grant
    Filed: November 29, 2019
    Date of Patent: January 9, 2024
    Assignee: Amosense Co., Ltd.
    Inventor: Ji-Hyung Lee
  • Patent number: 11839127
    Abstract: Disclosed is a light emitting display device which prevents pixel shrinkage and improves reliability by changing the structure of a bank and the inner structures of light emitting devices outside an active area of the light emitting display device.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: December 5, 2023
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Kyu Il Han, Mi So Kim, Hwa Yong Shin, Ji Hyung Lee
  • Patent number: 11814735
    Abstract: The present invention is a method of manufacturing a ceramic substrate, the method including forming a mask on one surface of a metal layer, forming an inclined protrusion by etching the metal layer exposed by the mask, and bonding the metal layer on which the inclined protrusion is formed to a ceramic base material, and according to the present invention, the inclined protrusion is formed on an outer perimeter of the metal layer bonded to the ceramic base material to increase a bonding strength between the ceramic base material and the metal layer and facilitate a metal layer etching process.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: November 14, 2023
    Assignee: Amosense Co., Ltd.
    Inventor: Ji-Hyung Lee
  • Publication number: 20230210818
    Abstract: This application relates to a composition for preventing, treating, and improving skeletal muscle atrophy, the composition including an organoselenium compound. The composition recovered the thickness of muscle fiber reduced by dexamethasone treatment. In addition, the treatment of mice in a muscle loss model showed that the composition had an effect of reducing damaged muscle and of restoring muscle mass. Therefore, it is expected that the composition can be effectively used for the treatment, prevention, or improvement of muscle atrophy.
    Type: Application
    Filed: September 24, 2021
    Publication date: July 6, 2023
    Inventors: Darren Reece WILLIAMS, Da-Woon JUNG, Ji-Hyung LEE, Hyun-Jun KIM, Seon-Wook KIM
  • Publication number: 20230136331
    Abstract: Provided herein is an immunocytokine comprising (i) an antigen binding protein (ABP) specific to a target protein; (ii) an IL-21 domain; and (iii) an IL-21R? mutein, wherein the IL-21R? mutein has a reduced binding affinity to the IL-21 domain compared to a wild-type IL-21R?. Further provided includes a method of using the immunocytokine to selectively activate an IL-21R? on a target cell, thereby enhance immune response or treat cancer.
    Type: Application
    Filed: September 30, 2022
    Publication date: May 4, 2023
    Inventors: Hong Seok BAN, Seok-Woo YANG, Hye Mi KWON, Jea Won CHO, Suh-Youn SHON, Do Sup LEE, Ji-Hyung LEE, Seong Wook LEE, Ukjin SON, Jun Su BAN, Jihye KIM
  • Publication number: 20230070970
    Abstract: A substrate tray for accommodating at least one ceramic substrate therein including: an accommodation part including a first opening part of which the upper side is open so that the ceramic substrate can be accommodated and withdrawn; and a support part formed on the circumference of the accommodation part so as to support the side wall circumference of the ceramic substrate, wherein the support part includes: an inner wall in contact with at least one surface of the ceramic substrate; an outer wall spaced a predetermined distance from the inner wall; an upper surface for connecting the inner wall to the outer wall; and a second opening part formed to be open in the direction opposite to the first opening part at a location facing the upper surface between the inner wall and the outer wall.
    Type: Application
    Filed: January 28, 2021
    Publication date: March 9, 2023
    Applicant: AMOGREENTECH CO., LTD.
    Inventor: Ji Hyung LEE
  • Publication number: 20230023610
    Abstract: A ceramic substrate according to the present invention includes: a ceramic base material; an electrode pattern formed on the ceramic base material; and at least one spacer arranged in any one of regions in the ceramic base material and the electrode pattern, in which a semiconductor chip is mounted.
    Type: Application
    Filed: December 14, 2020
    Publication date: January 26, 2023
    Applicant: AMOSENSE CO.,LTD
    Inventor: Ji-Hyung LEE
  • Publication number: 20230008518
    Abstract: A semiconductor package of the present invention comprises a base plate, an insulating substrate, and a lead frame, wherein the base plate is made of a metallic material including Cu and Be—Cu. The present invention can ensure bonding reliability and thus prevent performance degradation of semiconductor devices.
    Type: Application
    Filed: December 16, 2020
    Publication date: January 12, 2023
    Applicant: AMOSENSE CO.,LTD
    Inventor: Ji-Hyung LEE
  • Publication number: 20220316071
    Abstract: The present invention is a method of manufacturing a ceramic substrate, the method including forming a mask on one surface of a metal layer, forming an inclined protrusion by etching the metal layer exposed by the mask, and bonding the metal layer on which the inclined protrusion is formed to a ceramic base material, and according to the present invention, the inclined protrusion is formed on an outer perimeter of the metal layer bonded to the ceramic base material to increase a bonding strength between the ceramic base material and the metal layer and facilitate a metal layer etching process.
    Type: Application
    Filed: March 25, 2020
    Publication date: October 6, 2022
    Inventor: Ji-Hyung LEE
  • Publication number: 20220240389
    Abstract: Disclosed is a ceramic substrate manufacturing method in which a copper sheet is etched and then bonded to a ceramic substrate, so that the ceramic substrate has reduced to overall processing time and improved reliability and product lifespan. The disclosed ceramic substrate manufacturing method comprises the steps of: etching a copper sheet so as to prepare a metal substrate; etching a ceramic substrate so as to prepare a unit ceramic substrate; assembling the metal substrate and the unit ceramic substrate; bonding the metal substrate and the unit ceramic substrate so as to form a stack; partially printing a metal paste on the surface of the stack; and sintering the metal paste.
    Type: Application
    Filed: May 14, 2020
    Publication date: July 28, 2022
    Applicant: AMOSENSE CO.,LTD
    Inventors: Kyung Whan WOO, Ji Hyung LEE
  • Publication number: 20220208697
    Abstract: Provided are a ceramic substrate and a method of manufacturing the same, which suppress a warpage phenomenon caused by a difference in volumes occupied by upper and lower metal layers of a ceramic base material and controls areas of the upper and lower metal layers especially when thicknesses of the upper and lower metal layers on the ceramic base material are equal to each other, thereby reducing a defect rate of the ceramic substrate.
    Type: Application
    Filed: April 28, 2020
    Publication date: June 30, 2022
    Inventor: Ji-Hyung LEE
  • Patent number: D959270
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: August 2, 2022
    Assignee: AMOGREENTECH CO., LTD.
    Inventor: Ji-Hyung Lee