Patents by Inventor Ji-Liang Chen

Ji-Liang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250038073
    Abstract: A package structure and a method for forming the same are provided. The package structure includes a first package structure and a second package structure. The first package structure includes a first device formed over a first substrate. The first device includes a first conductive plug connected to a through substrate via (TSV) structure formed in the first substrate. A buffer layer surrounds the first substrate. A first bonding layer is formed over the first substrate and the buffer layer. The second package structure includes a second device formed over a second substrate. A second bonding layer is formed over the second device. A hybrid bonding structure is between the first package structure and the second package structure by bonding the first bonding layer to the second bonding layer.
    Type: Application
    Filed: July 27, 2023
    Publication date: January 30, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ke-Han SHEN, Chih-Yuan CHEN, Jiung WU, Hung-Yi Kuo, Chung-Ju LEE, Tung-He CHOU, Ji CUI, Kuo-Chung YEE, Chen-Hua YU, Cheng-Chieh HSIEH, Yu-Jen LIEN, Yian-Liang KUO, Shih-Hao TSENG, Jen Yu WANG, Tzu-Chieh Chou
  • Patent number: 11648808
    Abstract: The present disclosure discloses a tire pressure sensor burning device for burning at least one tire pressure sensor having or being externally inputted an exclusive code and a joint code. The tire pressure sensor burning device includes a burning tool in which a communication protocol is stored, and the burning tool includes a transmitting unit connected with the tire pressure sensor and sending a switch command thereto for switching the mode of the tire pressure sensor from the exclusive code to the joint code. The burning tool sends a burning command to the tire pressure sensor with the transmitting unit, and unilaterally burns the communication protocol into the tire pressure sensor via the joint code.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: May 16, 2023
    Assignee: ORANGE ELECTRONIC CO., LTD
    Inventors: Ji-Liang Chen, Ching-Hsiang Chang
  • Publication number: 20210101422
    Abstract: The present disclosure discloses a tire pressure sensor burning device for burning at least one tire pressure sensor having or being externally inputted an exclusive code and a joint code. The tire pressure sensor burning device includes a burning tool in which a communication protocol is stored, and the burning tool includes a transmitting unit connected with the tire pressure sensor and sending a switch command thereto for switching the mode of the tire pressure sensor from the exclusive code to the joint code. The burning tool sends a burning command to the tire pressure sensor with the transmitting unit, and unilaterally burns the communication protocol into the tire pressure sensor via the joint code.
    Type: Application
    Filed: July 29, 2020
    Publication date: April 8, 2021
    Inventors: JI-LIANG CHEN, CHING-HSIANG CHANG
  • Patent number: 7469461
    Abstract: A method for making a diaphragm unit of a condenser microphone includes the steps of: forming a liftoff layer on a substrate; forming an insulator diaphragm film on the liftoff layer; and removing the liftoff layer from the diaphragm film and the substrate so as to separate the diaphragm film from the substrate.
    Type: Grant
    Filed: December 9, 2005
    Date of Patent: December 30, 2008
    Assignee: Taiwan Carol Electronics Co., Ltd.
    Inventors: Chao-Chih Chang, Ray-Hua Horng, Jean-Yih Tsai, Chung-Chin Lai, Ji-Liang Chen
  • Publication number: 20070134839
    Abstract: A method for making a diaphragm unit of a condenser microphone includes the steps of: forming a liftoff layer on a substrate; forming an insulator diaphragm film on the liftoff layer; and removing the liftoff layer from the diaphragm film and the substrate so as to separate the diaphragm film from the substrate.
    Type: Application
    Filed: December 9, 2005
    Publication date: June 14, 2007
    Inventors: Chao-Chih Chang, Ray-Hua Horng, Jean-Yih Tsai, Chung-Chin Lai, Ji-Liang Chen