Patents by Inventor Ji Mook Kim

Ji Mook Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED package and RFID system including the same
    Patent number: 8286886
    Abstract: The LED package comprising a substrate and a display device, stacked on the substrate, including a light emitting diode (LED), and so on. A light emitting diode (LED) package comprises a LED device configured to emit light, an electrostatic discharge (ESD) device including an ESD circuit formed under the LED device, a printed circuit board (PCB), including a power supply line, formed under the ESD device, and a heat sink substrate, formed under the PCB, configured to release a heat delivered from the LED device through the ESD device and PCB.
    Type: Grant
    Filed: June 18, 2010
    Date of Patent: October 16, 2012
    Assignee: Hynix Semiconductor Inc.
    Inventors: Hee Bok Kang, Ji Mook Kim
  • LED PACKAGE AND RFID SYSTEM INCLUDING THE SAME
    Publication number: 20110147466
    Abstract: The LED package comprising a substrate and a display device, stacked on the substrate, including a light emitting diode (LED), and so on. A light emitting diode (LED) package comprises a LED device configured to emit light, an electrostatic discharge (ESD) device including an ESD circuit formed under the LED device, a printed circuit board (PCB), including a power supply line, formed under the ESD device, and a heat sink substrate, formed under the PCB, configured to release a heat delivered from the LED device through the ESD device and PCB.
    Type: Application
    Filed: June 18, 2010
    Publication date: June 23, 2011
    Applicant: Hynix Semiconductor Inc.
    Inventors: Hee Bok Kang, Ji Mook Kim