Patents by Inventor Ji Na Kwon

Ji Na Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting device package
    Patent number: 9887325
    Abstract: Disclosed is a light emitting device package including a body including a recess, first and second electrodes disposed on the body, a light emitting device provided on the first electrode, and a molding part disposed on the light emitting device. At least one of the body and the molding part includes benzotriazol (BTA).
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: February 6, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Ji Na Kwon, Jeong Hyun Na, Ho Ki Kwon
  • LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING MODULE COMPRISING SAME
    Publication number: 20170250331
    Abstract: A light emitting device package according to an embodiment comprises: a package body; a lead frame arranged on the package body; and a light emitting device arranged on the lead frame; an adhesive member arranged between the light emitting device and the lead frame; and a resin layer surrounding the light emitting device, wherein the package body comprises a resin and a volatile corrosion inhibitor which is mixed with the resin.
    Type: Application
    Filed: October 6, 2015
    Publication date: August 31, 2017
    Inventor: Ji Na KWON
  • Light emitting apparatus
    Patent number: 9705046
    Abstract: Disclosed is a light emitting apparatus which includes at least one light emitting device; a substrate under the light emitting device; a bonding member between the light emitting device and the substrate; and an adhesion member under the substrate, wherein the adhesion member includes at least one of benzotriazole and hydroxy group.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: July 11, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Ji Na Kwon, Ho Ki Kwon, Jeong Hyun Na
  • LIGHT EMITTING APPARATUS
    Publication number: 20150236217
    Abstract: Disclosed is a light emitting apparatus which includes at least one light emitting device; a substrate under the light emitting device; a bonding member between the light emitting device and the substrate; and an adhesion member under the substrate, wherein the adhesion member includes at least one of benzotriazole and hydroxy group.
    Type: Application
    Filed: February 13, 2015
    Publication date: August 20, 2015
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Ji Na KWON, Ho Ki KWON, Jeong Hyun NA
  • Light emitting device package
    Patent number: 8912560
    Abstract: Provided are a light emitting device package, a method of manufacturing the light emitting device package, and a lighting system. The light emitting device package includes a package body, an electrode layer, a reflective layer, a nanopattern metal layer, a light emitting device, and a molding part. The electrode layer is disposed on the package body. The reflective layer is disposed over the electrode layer. The nanopattern metal layer is disposed over the reflective layer. The light emitting device is displayed over the electrode layer. The molding part is disposed over the light emitting device.
    Type: Grant
    Filed: May 10, 2012
    Date of Patent: December 16, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Won Hwa Park, Ji Na Kwon, Hyun Kyong Cho, Ho Ki Kwon
  • LIGHT EMITTING DEVICE PACKAGE
    Publication number: 20140353703
    Abstract: Disclosed is a light emitting device package including a body including a recess, first and second electrodes disposed on the body, a light emitting device provided on the first electrode, and a molding part disposed on the light emitting device. At least one of the body and the molding part includes benzotriazol (BTA).
    Type: Application
    Filed: May 28, 2014
    Publication date: December 4, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Ji Na KWON, Jeong Hyun NA, Ho Ki KWON
  • LIGHT EMITTING DEVICE PACKAGE
    Publication number: 20120319152
    Abstract: Provided are a light emitting device package, a method of manufacturing the light emitting device package, and a lighting system. The light emitting device package includes a package body, an electrode layer, a reflective layer, a nanopattern metal layer, a light emitting device, and a molding part. The electrode layer is disposed on the package body. The reflective layer is disposed over the electrode layer. The nanopattern metal layer is disposed over the reflective layer. The light emitting device is displayed over the electrode layer. The molding part is disposed over the light emitting device.
    Type: Application
    Filed: May 10, 2012
    Publication date: December 20, 2012
    Inventors: Won Hwa Park, Ji Na Kwon, Hyun Kyong Cho, Ho Ki Kwon