Abstract: A semiconductor integrated circuit test system can include a first semiconductor integrated circuit tester configured to conduct a first test of a first characteristic of one of a plurality of semiconductor integrated circuits, wherein the first test is completed by the first semiconductor integrated circuit tester within a first test time. A second semiconductor integrated circuit tester, can be coupled to the first semiconductor integrated circuit tester, where the second semiconductor integrated circuit tester can be configured to conduct a second test of a second characteristic of each of the plurality of the semiconductor integrated circuits simultaneously, wherein the second test is completed within a second test time that is at least about two orders of magnitude more than the first test time.

Abstract: The present invention relates to a divot-detecting golf swing mat and, more particularly, to a divot-detecting golf swing mat characterized by comprising: a hitting mat (110) having artificial turf (111) formed on the upper side thereof such that a golf ball (B) can be seated thereon; a divot-detecting sensor array portion (120) installed beneath the hitting mat (110) so as to measure hitting of a club head (H), which is transferred through the hitting mat (110), through sensors arranged in an array type; a control portion (130) for calculating information regarding hitting of the club head (H) sensed by the divot-detecting sensor array portion (120); a golf ball position designating portion (150) installed on a side surface of the rear side of the hitting mat (110) so as to designate the position of the golf ball (B); and a display portion (140) for displaying the information regarding hitting of the club head (H) and the position of the golf ball (B).

Abstract: A semiconductor integrated circuit test system can include a first semiconductor integrated circuit tester configured to conduct a first test of a first characteristic of one of a plurality of semiconductor integrated circuits, wherein the first test is completed by the first semiconductor integrated circuit tester within a first test time. A second semiconductor integrated circuit tester, can be coupled to the first semiconductor integrated circuit tester, where the second semiconductor integrated circuit tester can be configured to conduct a second test of a second characteristic of each of the plurality of the semiconductor integrated circuits simultaneously, wherein the second test is completed within a second test time that is at least about two orders of magnitude more than the first test time.

Abstract: Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

Abstract: A semiconductor integrated circuit test system can include a first semiconductor integrated circuit tester configured to conduct a first test of a first characteristic of one of a plurality of semiconductor integrated circuits, wherein the first test is completed by the first semiconductor integrated circuit tester within a first test time. A second semiconductor integrated circuit tester, can be coupled to the first semiconductor integrated circuit tester, where the second semiconductor integrated circuit tester can be configured to conduct a second test of a second characteristic of each of the plurality of the semiconductor integrated circuits simultaneously, wherein the second test is completed within a second test time that is at least about two orders of magnitude more than the first test time.

Abstract: The present invention relates to a divot-detecting golf swing mat and, more particularly, to a divot-detecting golf swing mat (100) characterized by comprising: a hitting mat (110) having artificial turf (111) formed on the upper side thereof such that a golf ball (B) can be seated thereon; a divot-detecting sensor array portion (120) installed beneath the hitting mat (110) so as to measure hitting of a club head (H), which is transferred through the hitting mat (110), through sensors arranged in an array type; a control portion (130) for calculating information regarding hitting of the club head (H) sensed by the divot-detecting sensor array portion (120); a golf ball position designating portion (150) installed on a side surface of the rear side of the hitting mat (110) so as to designate the position of the golf ball (B); and a display portion (140) for displaying the information regarding hitting of the club head (H) and the position of the golf ball (B).

Abstract: Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

Abstract: A semiconductor integrated circuit test system can include a first semiconductor integrated circuit tester configured to conduct a first test of a first characteristic of one of a plurality of semiconductor integrated circuits, wherein the first test is completed by the first semiconductor integrated circuit tester within a first test time. A second semiconductor integrated circuit tester, can be coupled to the first semiconductor integrated circuit tester, where the second semiconductor integrated circuit tester can be configured to conduct a second test of a second characteristic of each of the plurality of the semiconductor integrated circuits simultaneously, wherein the second test is completed within a second test time that is at least about two orders of magnitude more than the first test time.

Abstract: A test system including a test device configured to transmit an input signal and a control signal to at least one complementary metal-oxide semiconductor (CMOS) image sensor via a probe card, and an interface board configured to map the probe card and the test device. The interface board includes an output receiver configured to receive an image signal from the at least one CMOS image sensor and transform the image signal into image data.