Abstract: An electrochromic dimming structure and a transportation apparatus are provided. The electrochromic dimming structure includes a substrate, an electrochromic device and a first protective layer. The electrochromic device includes a first electrode layer, an electrochromic layer and a second electrode layer, the first electrode layer is located between the electrochromic layer and the substrate, the first electrode layer and the second electrode layer are full-layer transparent electrode layers, and at least one of the first electrode layer or the second electrode layer includes an oxide material. The electrochromic device further includes a metal electrode located at at least one of a side of the first electrode layer away from the second electrode layer or a side of the second electrode layer away from the first electrode layer, and the metal electrode is electrically connected with at least one of the first electrode layer or the second electrode layer.

Abstract: An electronic printing system includes an imaging apparatus and an electronic paper that can be detached from each other and can be coupled together to perform one or more functionalities. The imaging apparatus includes a first electrode and a first passivation layer. The electronic paper includes a second electrode, an electro-optic layer on the second electrode, and a second passivation layer on a side of the electro-optic layer away from the second electrode. When the imaging apparatus and the electronic paper are coupled together, the first electrode, the first passivation layer, the second passivation layer, the electro-optic layer, and the second electrode are sequentially arranged in a stacked structure, the first electrode and the second electrode being configured to apply an electric field to the electro-optic layer. The first passivation layer and the second passivation layer can be detached from each other.

Abstract: An electrochromic dimming structure and a transportation apparatus are provided. The electrochromic dimming structure includes a substrate, an electrochromic device and a first protective layer. The electrochromic device includes a first electrode layer, an electrochromic layer and a second electrode layer, the first electrode layer is located between the electrochromic layer and the substrate, the first electrode layer and the second electrode layer are full-layer transparent electrode layers, and at least one of the first electrode layer or the second electrode layer includes an oxide material. The electrochromic device further includes a metal electrode located at at least one of a side of the first electrode layer away from the second electrode layer or a side of the second electrode layer away from the first electrode layer, and the metal electrode is electrically connected with at least one of the first electrode layer or the second electrode layer.

Abstract: Provided in the present disclosure are a coating method and a film layer thereof, and a coating chucking appliance and an application thereof. The coating method comprises the steps of: forming a normal film layer on a first component on a substrate surface, and forming at least a thinner film layer on a second component on the substrate surface, wherein the thickness of the normal film layer is greater than the thickness of the thinner film layer. The coating method can prepare a thinner film layer on the surface of some portions or parts on the substrate surface, and prepare a thicker film layer on the surface of other portions or parts, thereby satisfying the requirements of coating a thinner film layer on some electronic components of the substrate, such as circuit interface components, ensuring data transmission performance.

Abstract: The present disclosure provides a micro-fluidic chip and a reaction system. The micro-fluidic chip includes: a base substrate; a micro-cavity defining layer on the base substrate and defining a plurality of micro-reaction chambers; a cover plate on a side of the micro-cavity defining layer away from the base substrate; a heating layer disposed between the micro-cavity defining layer and one of the base substrate and the cover plate, and configured to heat the plurality of micro-reaction chambers. One of the base substrate and the cover plate, which is away from the heating layer, has a first surface and a second surface, the first surface faces the heating layer, the second surface faces away from the heating layer, and a area of the second surface is larger than that of the first surface.

Abstract: Provided in the present disclosure are a coating method and a film layer thereof, and a coating chucking appliance and an application thereof. The coating method comprises the steps of: forming a normal film layer on a first component on a substrate surface, and forming at least a thinner film layer on a second component on the substrate surface, wherein the thickness of the normal film layer is greater than the thickness of the thinner film layer. The coating method can prepare a thinner film layer on the surface of some portions or parts on the substrate surface, and prepare a thicker film layer on the surface of other portions or parts, thereby satisfying the requirements of coating a thinner film layer on some electronic components of the substrate, such as circuit interface components, ensuring data transmission performance.