Patents by Inventor Ji-Peng Xu

Ji-Peng Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11507152
    Abstract: This disclosure provides storage chassis including base storage sub-assemblies and partitions. Base includes bottom plate, top plate, first side plate and second side plate. Front side of bottom plate is opposite to back side of bottom plate. Bottom plate is located opposite to top plate. First side plate is located opposite to second side plate. First side plate and second side plate are connected to and located between bottom plate and top plate. Storage sub-assemblies are movably disposed between first side plate and second side plate. Partitions are disposed between first side plate and second side plate. Opposite ends of each partition are respectively connected to top plate and bottom plate. Partitions separate storage sub-assemblies from one another so that storage sub-assemblies are respectively located in airflow channels that are independent to one another.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: November 22, 2022
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Shu-Min Wang, Ji-Peng Xu
  • Patent number: 11150707
    Abstract: The disclosure relates to computer technical field, and provides a GPU with specific shape of casing and a host casing hardware configuration. Body of the casing of the GPU includes a rectangle of a notch, the notch is located on a corner of the rectangle and is in a right trapezoid shape. In the host casing hardware configuration, the 2U host casing is divided into front area and rear area; hard disk assembly and fan assembly are disposed on the front area; the rear area is divided into top area and bottom area; 4 GPUs and a GPU tray are disposed on the top area in a staggered relationship, and motherboard and CUP and motherboard connector disposed on the motherboard are disposed on bottom area. The disclosure provides an advantage of improving the arrangement density of the components in the host casing.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: October 19, 2021
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Er-Zhen Song, Yuehong Jin, Ji-Peng Xu
  • Patent number: 11096306
    Abstract: The disclosure provides including a casing, a mother board, a hard disk drive module, a fan module, and an expansion module. The casing has a hard disk drive accommodation area, a fan accommodation area, and a motherboard accommodation area located between the hard disk drive accommodation area and the fan accommodation area. The motherboard is disposed in the motherboard accommodation area. The hard disk drive module includes hard disk drives. The fan module includes fans. The expansion module is selectively disposed in the hard disk drive accommodation area with the hard disk drives, or disposed in the fan accommodation area with the fans.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: August 17, 2021
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ji-Peng Xu, Sheng Guo, Hui Zhu, Zhifa Chen
  • Patent number: 11096308
    Abstract: A processing assembly including cage, partition, two sub-cages, two motherboards, two switch boards and at least one bridge board. Partition is disposed in cage so as to divide inner space of cage into first accommodation space and second accommodation space. Two sub-cages are respectively disposed in first accommodation space and second accommodation space. Two motherboards are respectively disposed on two sub-cages. Two motherboards each include a plate and a plurality of processing units disposed on the plate. Two switch boards are respectively disposed on two sub-cages and respectively electrically connected to two motherboards. Bridge board is electrically connected to two motherboards. One of two motherboards is located between one of two switch boards and bridge board, and another one of two motherboards is located between another one of two switch boards and bridge board.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: August 17, 2021
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ji-Peng Xu, Guang-Zhao Tian, Zhao Geng
  • Publication number: 20210209718
    Abstract: The disclosure relates to computer technical field, and provides a GPU with specific shape of casing and a host casing hardware configuration. Body of the casing of the GPU includes a rectangle of a notch, the notch is located on a corner of the rectangle and is in a right trapezoid shape. In the host casing hardware configuration, the 2U host casing is divided into front area and rear area; hard disk assembly and fan assembly are disposed on the front area; the rear area is divided into top area and bottom area; 4 GPUs and a GPU tray are disposed on the top area in a staggered relationship, and motherboard and CUP and motherboard connector disposed on the motherboard are disposed on bottom area. The disclosure provides an advantage of improving the arrangement density of the components in the host casing.
    Type: Application
    Filed: March 6, 2020
    Publication date: July 8, 2021
    Inventors: Er-Zhen SONG, Yuehong Jin, Ji-Peng XU
  • Patent number: 11039547
    Abstract: The disclosure provides a server, including a casing, a host assembly, a data storage assembly and a power supply assembly. The casing includes a bottom plate, a first side plate, a second side plate and a straight partition. The first side plate, the second side plate and the straight partition are connected to the bottom plate. The first side plate and the second side plate are respectively located at two opposite sides of the bottom plate. The straight partition is located between the first side plate and the second side plate. The host assembly is slidably disposed on the second side plate and the straight partition. The data storage assembly is slidably disposed on the first side plate and the straight partition. The power supply assembly is located between the first side plate and the straight partition and electrically connected to the host assembly and the data storage assembly.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: June 15, 2021
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ji-Peng Xu, Shi-Min Hong
  • Publication number: 20210074331
    Abstract: A server includes a case including a bottom board, a first lateral board and a second lateral board, a riser card provided with opposite two ends respectively disposed on the lateral boards, a HDD backplane electrically connected with the riser card, first HDDs disposed on the HDD backplane, a first main logic board electrically connected with the riser card, and a common carrier. The lateral boards are respectively located on opposite sides of the bottom board, and an accommodation space is formed between the lateral boards. The riser card divides the accommodation space into a two accommodation regions. The HDD backplane is disposed in a first accommodation region. The first main logic board is disposed in a second accommodation region, and the first HDDs is electrically connected with the first main logic board via the riser card. The common carrier is disposed in the second accommodation region.
    Type: Application
    Filed: September 16, 2019
    Publication date: March 11, 2021
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Shu-Min WANG, Ji-Peng XU
  • Patent number: 10945349
    Abstract: A server chassis including a chassis, a motherboard, a processing assembly and a storage assembly. The chassis includes a bottom plate. The bottom plate has a front side and a rear side that are opposite to each other. The chassis has a first area and a second area. The first area is located adjacent to the front side, and the second area is located adjacent to the rear side. The motherboard is disposed on the bottom plate and located between the front side and the rear side. The processing assembly is disposed on the bottom plate and selectively disposed in the first area or the second area. The storage assembly is disposed on the bottom plate and located adjacent to the front side.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: March 9, 2021
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Shu-Min Wang, Jun Li, Hai Ting Chen, Chao Nie, Jia-Bin Wang, Ji-Peng Xu
  • Publication number: 20210068297
    Abstract: A processing assembly including cage, partition, two sub-cages, two motherboards, two switch boards and at least one bridge board. Partition is disposed in cage so as to divide inner space of cage into first accommodation space and second accommodation space. Two sub-cages are respectively disposed in first accommodation space and second accommodation space. Two motherboards are respectively disposed on two sub-cages. Two motherboards each include a plate and a plurality of processing units disposed on the plate. Two switch boards are respectively disposed on two sub-cages and respectively electrically connected to two motherboards. Bridge board is electrically connected to two motherboards. One of two motherboards is located between one of two switch boards and bridge board, and another one of two motherboards is located between another one of two switch boards and bridge board.
    Type: Application
    Filed: September 10, 2019
    Publication date: March 4, 2021
    Inventors: Ji-Peng XU, Guang-Zhao TIAN, Zhao GENG
  • Publication number: 20210068294
    Abstract: The disclosure provides a server, including a casing, a host assembly, a data storage assembly and a power supply assembly. The casing includes a bottom plate, a first side plate, a second side plate and a straight partition. The first side plate, the second side plate and the straight partition are connected to the bottom plate. The first side plate and the second side plate are respectively located at two opposite sides of the bottom plate. The straight partition is located between the first side plate and the second side plate. The host assembly is slidably disposed on the second side plate and the straight partition. The data storage assembly is slidably disposed on the first side plate and the straight partition. The power supply assembly is located between the first side plate and the straight partition and electrically connected to the host assembly and the data storage assembly.
    Type: Application
    Filed: September 10, 2019
    Publication date: March 4, 2021
    Inventors: Ji-Peng Xu, Shi-Min Hong
  • Publication number: 20200409434
    Abstract: This disclosure provides storage chassis including base storage sub-assemblies and partitions. Base includes bottom plate, top plate, first side plate and second side plate. Front side of bottom plate is opposite to back side of bottom plate. Bottom plate is located opposite to top plate. First side plate is located opposite to second side plate. First side plate and second side plate are connected to and located between bottom plate and top plate. Storage sub-assemblies are movably disposed between first side plate and second side plate. Partitions are disposed between first side plate and second side plate. Opposite ends of each partition are respectively connected to top plate and bottom plate. Partitions separate storage sub-assemblies from one another so that storage sub-assemblies are respectively located in airflow channels that are independent to one another.
    Type: Application
    Filed: August 15, 2019
    Publication date: December 31, 2020
    Inventors: Shu-Min WANG, Ji-Peng XU
  • Publication number: 20200389993
    Abstract: A server chassis including a chassis, a motherboard, a processing assembly and a storage assembly. The chassis includes a bottom plate. The bottom plate has a front side and a rear side that are opposite to each other. The chassis has a first area and a second area. The first area is located adjacent to the front side, and the second area is located adjacent to the rear side. The motherboard is disposed on the bottom plate and located between the front side and the rear side. The processing assembly is disposed on the bottom plate and selectively disposed in the first area or the second area. The storage assembly is disposed on the bottom plate and located adjacent to the front side.
    Type: Application
    Filed: July 17, 2019
    Publication date: December 10, 2020
    Inventors: Shu-Min Wang, Jun Li, Hai Ting Chen, Chao Nie, Jia-Bin Wang, Ji-Peng Xu
  • Patent number: 10743434
    Abstract: The invention provides server including a casing. The casing has back panel area. The back panel area is located at air outlet of the server. Package substrate, up HDD back panel and down HDD back panel are horizontally disposed on the back panel area. Motherboard of the server is communicatively connected to the package substrate via first connector. The package substrate is communicatively connected to the up HDD back panel via second connector. The up HDD back panel is communicatively connected to the down HDD back panel via third connector. The server of the invention has high dense storage devices, very high space utilization, and innovative heat dissipation channels design. The server has high configuration flexibility and expansibility, can be operated in a simple manner, and can support apparatus that are power-consuming and operating in standby mode.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: August 11, 2020
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ji-Peng Xu, Ying Qian, Xiaogang Lu, Fang-Jie Chu, Li-Hong Huang, Peng Zhan
  • Publication number: 20190343026
    Abstract: The present application discloses a liquid cooling system for a cabinet server, which includes a primary side liquid circulation pipe, a distribution control device, and a secondary side liquid circulation pipe, and the primary side liquid circulation pipe is connected to the water filling device. The distribution control device is connected to the primary side liquid circulation pipe, and the secondary side liquid circulation pipe is connected to the distribution control device and at least one cabinet server. The liquid cooling system of the present application cools the cabinet server by liquid cooling, and the energy efficiency ratio of the liquid cooling system is below 1.3, there is almost no noise, no low filling water temperature is needed, natural cooling source is fully utilized, and the cooling tower can be used to meet the heat dissipation requirement.
    Type: Application
    Filed: September 26, 2018
    Publication date: November 7, 2019
    Applicants: Inventec (Pudong) Technology Corporation, Inventec Corporation
    Inventors: Xiu-Hua Zhao, Ji-Peng Xu, Jia-Bin Wang, Dong-Rui Xue, Lian-Fei Zhang, Pin-Yi Xiang
  • Patent number: 10314195
    Abstract: A server includes a casing, a storage module and a motherboard. The casing includes a chassis and two side plates. The two side plates stand on the chassis. The storage module is disposed on the chassis. The motherboard includes a circuit board, at least one central processing unit, a first amplifier, a second amplifier, a riser card and a third amplifier. The circuit board is disposed on the chassis. The at least one central processing unit, the first amplifier and the second amplifier are disposed on the circuit board. The riser card is disposed on the second amplifier. The third amplifier is disposed on the riser card.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: June 4, 2019
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ji-Peng Xu, Jia-Bin Wang, Chao Nie
  • Publication number: 20180359878
    Abstract: A server system includes a server frame, a host server, a GPU expander board, a first fan module and a power supply. The server frame has a host server accommodating space and a graphic processing module space. The graphic processing module space is located above the host server accommodating space. The host server is removably disposed in the host server accommodating space. The GPU expander board is located in the graphic processing module space and located above the host server. The first fan module is located in the graphic processing module space, is located at a side of the GPU expander board, and is located above the host server. The power supply unit is located in the graphic processing module space, is located above another side of the GPU expander board, and is configured to provide electricity to the first fan module and the GPU expander board.
    Type: Application
    Filed: June 27, 2017
    Publication date: December 13, 2018
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ji-Peng XU, Hui ZHU
  • Patent number: 9954293
    Abstract: A circuit board assembly includes a circuit board, at least one metal sheet, at least one bus and at least one fixed member. The circuit board has at least one electrical connecting area. The metal sheet is adapted to solder to the electrical connecting area and has at least one metal sheet hole. The bus has a connecting portion. The connecting portion is corresponding to the metal sheet. The bus has at least one fixed screwing hole. The fixed screwing hole is corresponding to the metal sheet hole. The circuit board and the bus is locked by the fixed member.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: April 24, 2018
    Assignees: Inventec (Pudong) Technology Corporation, Inventec Corporation
    Inventors: Ji-Peng Xu, Guang-Zhao Tian, Yang-Qiu Lai, Xiang-Biao Sha
  • Patent number: 9918399
    Abstract: A server adapted to a server rack. The server rack has a first and a second connectors at a rear end of the server rack. The server comprises a tray, a motherboard, an expansion board, an adaption board, a system board, a docking module and a first cable. The motherboard comprises a central processing unit. The motherboard, the expansion, the adaption board and the system board are disposed on the tray. The docking module comprises a third and a fourth connectors. The fourth connector is configured for electrically connected to the first connector, and the third connector is configured for electrically connected to the second connector. One end of the first cable is connected to one end of the third connector, and the other end of the first cable is connected to the adaption board. The first cable is electrically connected to the third connector and the adaption board.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: March 13, 2018
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Jian-Jun Deng, Ji-Peng Xu, Yang-Qiu Lai
  • Patent number: 9785207
    Abstract: A server includes a main board, a plurality of first expanding modules, a plurality of second expanding modules, a plurality of third expanding modules and a management controlling board. The main board has a first edge, a second edge corresponding to the first edge, a first plane, a second plane corresponding to the first plane. The main board includes a plurality of hardware connectors disposed on the first plane and between the first edge and the second edge. The plurality of first expanding modules, the plurality of second expanding modules and the plurality of third expanding modules are all disposed on the second edge and on the first plane. Each of the first expanding modules has a first Ethernet connector and a plurality of first ports configured to connect to a first external server. Each of the second expanding modules has a plurality of second ports configured to connect to a second external server. The management controlling board is disposed on the second edge and on the second plane.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: October 10, 2017
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ji-Peng Xu, Jia-Bin Wang, Hui Zhu, Shu-Min Wang
  • Patent number: 9763362
    Abstract: A server adapted to server cabinet having a fan assembly and a power supply. The server includes a chassis, a main board module, a data storage, a signal-transferring module and a docking module. The chassis has a bottom plate, a first side plate and a second side plate disposed on the bottom plate. The main board module is placed along the first side plate. The data storage module is placed along the second side plate. The signal-transferring module is placed along the first side plate. The signal-transferring module is located at the back of the main board module. The signal-transferring module is connected between the main board module and the data storage module. The docking module is disposed on the bottom plate. The docking module is connected to the data storage module and the signal-transferring module. The docking module is connectable to the power supply and the fan assembly.
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: September 12, 2017
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ji-Peng Xu, Jian-Jun Deng