Abstract: The present invention relates to a sawing method for a wafer. The sawing method of the invention comprises: (a) providing a wafer, the wafer having an active surface and a back surface, the active surface having a plurality of sawing lines; (b) coating a protection layer on the active surface and the sawing lines; (c) taping a grinding tape on a surface of the protection layer; (d) grinding the back surface of the wafer to thin the wafer; (e) removing the grinding tape; and (f) sawing the wafer to form a plurality of dice. Whereby, the problems of die cracking, die scratching, die contamination and peeling of the surface of the sawing lines can be avoided.

Abstract: An adhesive pattern for attaching a semiconductor chip onto a non-uniform substrate is disclosed. The adhesive pattern comprises a double-k pattern formed on the substrate. The double-k pattern includes a longest major line and four shorter lines connected to the major line. The non-uniform substrate has a conductive circuit and a solder mask formed on the substrate including the circuit. The substrate has a die covering region for receiving the semiconductor chip. The conductive circuit of the substrate comprises a plurality of conductive traces unequally distributed on the die covering region. The double-k adhesive pattern of the present invention is applied onto the non-uniform substrate by a dispenser in a manner that the area on the substrate defined between the major line and the border of the die covering region has a trace density lower than the other area on the substrate.