Patents by Inventor Ji Sung Lee

Ji Sung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090270590
    Abstract: A surface-modified inorganic material and a preparation method thereof. A surface-modified inorganic material is provided which is obtained by allowing an organosilane compound having allyl or an allyl derivative to react with an inorganic material, particularly solid silica or ITO glass, in the presence of an acid and an organic solvent, to introduce an organic group into the inorganic material even at room temperature, as well as a preparation method thereof. The invention can effectively introduce the organic group into the inorganic material even at room temperature, and thus is very effective in introducing compounds having a thermally sensitive functional group, for example, natural compounds or proteins. It is possible to introduce various organic groups into an inorganic material and to separate and purify organic molecule-bonded organosilane compounds using a silica gel column to effectively bond them to inorganic materials. Accordingly, the invention is very useful in the chemical industry.
    Type: Application
    Filed: May 16, 2006
    Publication date: October 29, 2009
    Applicant: Industry-Academic Cooperation Foundation Yonsei University
    Inventors: Chul-Ho Jun, Ye-Lim Yeon, Ji-Sung Lee, Young-Jun Park
  • Publication number: 20080045035
    Abstract: A metal etching solution may include nitric acid, hydrochloric acid, organic acid and water. A semiconductor product fabricating method may include forming a seed layer on a substrate with a metal pad, forming a sacrificial layer that may have an opening exposing the seed layer on the substrate with the seed layer, forming a gold bump that may fill the opening of the sacrificial layer by performing gold electroplating, removing the sacrificial layer, and etching the seed layer exposed by the gold bump, using an etching solution that may include nitric acid, hydrochloric acid, organic acid and water.
    Type: Application
    Filed: April 13, 2007
    Publication date: February 21, 2008
    Inventors: Ji-Sung Lee, Dong-Min Kang, Young Nam Kim, Young-Sam Lim, Yun-Deok Kang
  • Publication number: 20070287280
    Abstract: A composition for removing a photoresist and a method of forming a bump electrode using the composition are provided. The composition includes an amine compound having a hydroxyl group, a polar organic solvent having a heteroatom, an alkylammonium hydroxide and water. The method of forming the bump electrode includes forming a conductive pattern on a substrate, forming a passivation layer on the substrate, the passivation layer having a first opening that partially exposes the conductive pattern, forming a photoresist pattern on the passivation layer, the photoresist pattern having a second opening that exposes the first opening forming a bump electrode that fills the first opening and the second opening, and removing the photoresist pattern from the substrate using a composition including an amine compound having a hydroxyl group, a polar organic solvent having a heteroatom, an alkylammonium hydroxide and water.
    Type: Application
    Filed: June 12, 2007
    Publication date: December 13, 2007
    Inventors: Dong-Min Kang, Young-Sam Lim, Gi-Jung Kim, Young-Nam Kim, Yun-Deok Kang, Ji-Sung Lee, Ki-Hyeon Kim, Kyoung-Jin Choi
  • Patent number: 6556187
    Abstract: A method for transmitting data of a wireless keyboard device having a track-ball, which transmits track-ball data and keyboard data more effectively, and thereby simplifies the process and reduces the current consumption of the keyboard device. The data transmission method transmits a leader signal composed of five chips including three consecutive low signals followed by a high signal and a low signal, thereafter transmits data that contains track-ball data and keyboard scan data recorded in the same data format, and, instead of check-sum code, allocates the complementary value of the code value of the third byte (Byte3) into the fourth byte (Byte4) and transmits it so that the transmission error can be checked by simply comparing the third byte and the fourth byte.
    Type: Grant
    Filed: July 27, 2000
    Date of Patent: April 29, 2003
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Ji Sung Lee