Abstract: The simulation system for predicting heating and cooling loads of a building comprises the collection unit collecting measurement data of a target building from a BEMS, the identification unit identifying indoor and outdoor temperature, humidity, and insolation measured in the building in real time based on RTS method, the correlation derivation unit deriving a correlation between energy usage based on the BEMS measurement data collected by the collection unit and the cooling and heating loads according to indoor and outdoor temperature, humidity, and insolation identified by the identification unit, the simulation unit predicting a change in cooling and heating loads according to a change in at least one of pieces of measurement data based on the correlation derived from the correlation derivation unit to perform a simulation, and the information provision unit providing a simulation result from the simulation unit in a visible form to a user terminal.

Abstract: A semiconductor memory device includes a first stacked structure, a first supporter layer, a second stacked structure, a block cut structure, and a second supporter layer on the second stacked structure and separated by a second cut pattern. The first stacked structure includes a first and second stack, the second stacked structure includes a third stack separated by the block cut structure and a fourth stack, the first supporter layer is on the first stack and the second stack, the second supporter layer is on the third stack and the fourth stack, the first cut pattern includes a first connection on the block cut structure and connecting the first supporter layer and the second stack, and the second cut pattern of the second supporter layer includes a second connection on the block cut structure and connecting the second supporter layer placed on the third stack and the fourth stack.

Abstract: A semiconductor device includes first and second substrates connected to each other. The second substrate includes a plate layer having first and second faces. Gate electrode layers are disposed on the first face of the plate layer. Channel structures extend through the gate electrode layers. Word-line cutting structures extend through the gate electrode layers and are spaced apart from each other. Via structures are disposed on the second face of the plate layer. Via connecting structures are disposed on the top face of the via structures. A width of the bottom face of each of the via structures is greater than a width of the top face of each of the via structures. A width of the bottom face of each of the via connecting structures is less than a width of the top face of each of the via connecting structures.

Abstract: A folder type mobile terminal comprising a main body, a folder rotatably connected to the main body, a hinge connection part formed between the main body and the folder for rotatably connecting the folder to the main body, and a movement preventing part formed at the hinge connection part for preventing movement of the folder from the main body in a horizontal direction.

Abstract: A mobile communications terminal for transmitting data frames via a mobile communications terminal in a wireless LAN and a method thereof, the method including: storing data frames to be transmitted in a memory and determining transmission of the stored data frames based on the number of the stored data frames; and consecutively transmitting the stored data frames in a burst to an AP (Access Point) when transmission of the stored data frames is determined and occupancy of a transmission channel is granted.

Abstract: A folder type mobile terminal comprising a main body, a folder rotatably connected to the main body, a hinge connection part formed between the main body and the folder for rotatably connecting the folder to the main body, and a movement preventing part formed at the hinge connection part for preventing movement of the folder from the main body in a horizontal direction.