Patents by Inventor Ji-Tai Seo

Ji-Tai Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor apparatus
    Patent number: 9484344
    Abstract: A semiconductor apparatus includes a reservoir capacitor, and the reservoir capacitor includes a plurality of MOS capacitors serially coupled to one another. The plurality of MOS capacitors are arranged in one well.
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: November 1, 2016
    Assignee: SK hynic Inc.
    Inventors: Ji Tai Seo, Yeon Ok Kim
  • SEMICONDUCTOR APPARATUS, MANUFACTURING METHOD THEREOF AND TESTING METHOD THEREOF
    Publication number: 20150187680
    Abstract: A semiconductor apparatus includes one or more semiconductor chips. Each semiconductor chip includes a semiconductor substrate formed with a through-silicon via, and a bottom wiring layer with a first dielectric layer formed on a bottom of the semiconductor substrate. A first opening is defined in the first dielectric layer.
    Type: Application
    Filed: March 13, 2014
    Publication date: July 2, 2015
    Applicant: SK hynix Inc.
    Inventor: Ji Tai SEO
  • SEMICONDUCTOR APPARATUS
    Publication number: 20150155278
    Abstract: A semiconductor apparatus includes a reservoir capacitor, and the reservoir capacitor includes a plurality of MOS capacitors serially coupled to one another. The plurality of MOS capacitors are arranged in one well.
    Type: Application
    Filed: February 21, 2014
    Publication date: June 4, 2015
    Applicant: SK hynix Inc.
    Inventors: Ji Tai SEO, Yeon Ok KIM
  • Semiconductor integrated circuit
    Patent number: 8242606
    Abstract: A semiconductor integrated circuit includes a semiconductor chip. The semiconductor chip includes a well arranged to receive a first well bias voltage from a well biasing region, a through-chip-via arranged to penetrate the well, and a guard region disposed around the through-chip-via with space in-between and arranged to apply a second well bias voltage to the well.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: August 14, 2012
    Assignee: Hynix Semiconductor Inc.
    Inventors: Ji-Tai Seo, Yun Song
  • SEMICONDUCTOR CHIP AND MULTI-CHIP PACKAGE HAVING THE SAME
    Publication number: 20120193746
    Abstract: A semiconductor chip includes: a semiconductor substrate; an interface member formed through the semiconductor substrate and electrically coupled to an external signal transfer terminal; and a backward diode formed between the semiconductor substrate and the interface member.
    Type: Application
    Filed: August 27, 2011
    Publication date: August 2, 2012
    Applicant: HYNIX SEMICONDUCTOR INC.
    Inventor: Ji Tai SEO
  • SEMICONDUCTOR INTEGRATED CIRCUIT
    Publication number: 20110260329
    Abstract: A semiconductor integrated circuit includes a through-chip via passing through a semiconductor chip, and an insulator arranged inside the through-chip via to electrically divide the through-chip via. Here, the divided through-chip vias may transmit different signals.
    Type: Application
    Filed: July 9, 2010
    Publication date: October 27, 2011
    Inventor: Ji-Tai Seo
  • SEMICONDUCTOR INTEGRATED CIRCUIT
    Publication number: 20110260330
    Abstract: A semiconductor integrated circuit includes a semiconductor chip. The semiconductor chip includes a well arranged to receive a first well bias voltage from a well biasing region, a through-chip-via arranged to penetrate the well, and a guard region disposed around the through-chip-via with space in-between and arranged to apply a second well bias voltage to the well.
    Type: Application
    Filed: July 9, 2010
    Publication date: October 27, 2011
    Inventors: Ji-Tai Seo, Yun Song