Patents by Inventor Ji Wang

Ji Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10255974
    Abstract: An electronic device comprising a semiconductor memory unit that includes a resistance variable element configured to be changed in a resistance value according to a value of data stored therein; a first reference resistance element having a first resistance value; a second reference resistance element having a second resistance value larger than the first resistance value; and a comparison unit configured to receive a voltage corresponding to the resistance value of the resistance variable element through a first input terminal and a second input terminal thereof, a voltage corresponding to the first resistance value of the first reference resistance element through a third input terminal, and a voltage corresponding to the second resistance value of the second reference resistance element through a fourth input terminal, the comparison unit configured to output a result of comparing inputs to the first input terminal and the second input terminal and inputs to the third input terminal and fourth input termi
    Type: Grant
    Filed: September 5, 2016
    Date of Patent: April 9, 2019
    Assignee: SK hynix Inc.
    Inventor: Ji-Wang Lee
  • Publication number: 20190097066
    Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.
    Type: Application
    Filed: November 15, 2016
    Publication date: March 28, 2019
    Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang NG, Simon Gubser, James Eilertsen, Sundar Raman Ghana Sambandam
  • Patent number: 10243111
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: March 26, 2019
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • Publication number: 20190065016
    Abstract: Disclosed are some implementations of systems, apparatus, methods and computer program products for facilitating the presentation of a personalized user history component in a graphical user interface (GUI), where the history component identifies primary tabs and associated sub-tabs that have been recently accessed by the user. Upon selection of one of the primary tabs, information pertaining to data records associated with the selected primary tab is presented using a link that includes identifiers of the selected primary tab and associated sub-tabs. The link may be saved or shared, enabling the primary tab and associated sub-tabs to be accessed by the user or another user.
    Type: Application
    Filed: August 31, 2017
    Publication date: February 28, 2019
    Inventors: Gautam Vasudev, Avaneesh Desai, Megha Tewari, Maxwell Lu, Ji Wang, Nicolas Kruk
  • Publication number: 20190051762
    Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.
    Type: Application
    Filed: February 21, 2017
    Publication date: February 14, 2019
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang NG, Simon Gubser, James Eilertsen, Sundar Raman Gnana Sambandam
  • Patent number: 10199426
    Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: February 5, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Patent number: 10190908
    Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: January 29, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, Sonja Hanselmann
  • Patent number: 10186540
    Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: January 22, 2019
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Publication number: 20190018969
    Abstract: A data input method and apparatus, and user equipment are provided. The method includes: when it is determined that an operation of a user on the user equipment UE is not performed in a preset display area, deliver an event corresponding to the operation to a first operating environment for processing, where the preset display area runs in a second operating environment of the UE, and the second operating environment has a higher security level than the first operating environment. This can better improve security of an event generated when the user operates a program that runs in a Normal World of the user equipment, and can directly operate an event that runs in the Normal World.
    Type: Application
    Filed: September 14, 2018
    Publication date: January 17, 2019
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Peng ZHANG, Ji WANG, Hui LI, Hongliang XIE, Xiaopu WANG
  • Publication number: 20190014634
    Abstract: The invention discloses a switch control device, configured to control a plurality of objects. The switch control device comprises a touch panel and a controller. The touch panel generates a touch signal in response to a user's touch gesture. The controller determines a number of touch points according to the touch signal generated by the touch panel, and controls a corresponding number of the objects. The invention further discloses a switch control method. The switch control device and method of the present disclosure can quickly open a corresponding number of objects, without having to operate specific keys, which is convenient and quick.
    Type: Application
    Filed: December 21, 2015
    Publication date: January 10, 2019
    Inventors: Xinyuan XIA, Rui XU, Songling YANG, Xiang ZOU, Yu ZHOU, Zhanchao LIU, Ji WANG
  • Publication number: 20190007693
    Abstract: The present disclosure relates to a motion compensation matching method and system for video coding. The method comprises: a CPU extracting a current frame image and a reference frame image from a video to be processed and sending the extracted frame images to a GPU; the GPU performing interpolation process at least once on the reference frame image to obtain a plurality of interpolation images; the GPU dividing the current frame image to obtain a plurality of prediction blocks; the GPU, according to each of the prediction blocks, performing block matching search in the reference frame image and each of the interpolation images; according to a result of the block matching search, determining a motion vector of a desired image block of the current frame image. The present disclosure uses GPU to execute large amounts of computation for interpolation and division of the frame images and block matching search, and uses CPU to process a small amount of computation.
    Type: Application
    Filed: September 13, 2016
    Publication date: January 3, 2019
    Inventors: Tao Wang, Jinje Ke, Sibin GU, Baiyu PAN, Ji WANG
  • Patent number: 10146212
    Abstract: A machine tool feed drive design system is provided, which may include a component database, a detection module, a load condition estimation module and a calculation module. The component database may store the specification data of a plurality of feed drive components. The detection module may detect a plurality of operation signals from a machine tool during a period of time when the machine tool had been executing a machining process to a workpiece. The load condition estimation module may calculate a plurality of actual load conditions according to the operation signals and a device specification parameter of a feed drive of the machine tool. The calculation module may select at least one component combination from the feed drive components according to the actual load conditions and the specification data of the feed drive components to serve as an optimized feed drive specification.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: December 4, 2018
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chia-Pei Wang, Chien-Chih Liao, Hsiao-Chen Ho, Jen-Ji Wang
  • Publication number: 20180329175
    Abstract: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure.
    Type: Application
    Filed: November 4, 2016
    Publication date: November 15, 2018
    Inventors: Ji Wang, Kam Wah Leong, Bojan Tesanovic, Qichuan Yu, Tobias Senn, Nicola Spring, Robert Lenart
  • Patent number: 10116071
    Abstract: An electrical connector includes an insulative housing defining a top surface and a bottom surface opposite to each other and a plurality of electrical contacts received in the insulative housing. Each electrical contact is formed by stamping a metal plate and includes a contacting portion exposed to the top surface, a mounting portion extending out of the bottom surface and an elastic portion disposed between the contacting portion and the mounting portion and in the insulative housing, wherein the elastic portion includes a first elastic portion and a second elastic portion disposed on two opposite sides of the contacting portion.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: October 30, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Xin-Tian Li, Wei Yin, Ji-Wang Jin, Bin Peng, Zhi-Jian Chen
  • Patent number: 10114413
    Abstract: The present disclosure provides an electronic bag. The electronic bag includes a bag body equipped with a strap. The electronic bag further includes a display screen and a first touch panel which is configured to control the display screen to display different patterns. The display screen is arranged on an external surface of the bag body. The first touch panel is arranged on the strap. A method for controlling the electronic bag is also disclosed.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: October 30, 2018
    Assignee: SHENZHEN ROYOLE TECHNOLOGIES CO., LTD.
    Inventors: Fan Yang, Chao Jiang, Zhanchao Liu, Ji Wang, Chao Han, He Li
  • Publication number: 20180301863
    Abstract: A quantum memory system includes a chalcogenide optical fiber link, a magnetic field generation unit and a pump laser. The chalcogenide optical fiber link includes a photon receiving end opposite a photon output end and is positioned within a magnetic field of the magnetic field generation unit when the magnetic field generation unit generates the magnetic field. The pump laser is optically coupled to the photon receiving end of the chalcogenide optical fiber link. The chalcogenide optical fiber link includes a core doped with a rare-earth element dopant. The rare-earth element dopant is configured to absorb a storage photon traversing the chalcogenide optical fiber link upon receipt of a first pump pulse output by the pump laser. Further, the rare-earth element dopant is configured to release the storage photon upon receipt of a second pump pulse output by the pump laser.
    Type: Application
    Filed: June 18, 2018
    Publication date: October 18, 2018
    Inventors: Bruce Gardiner Aitken, Stuart Gray, Daniel Aloysius Nolan, Ji Wang, Jun Yang
  • Publication number: 20180292603
    Abstract: The disclosure relates to a rear cover of backlight module, a backlight module and a display module. The rear cover includes a bottom plate and one or more side plates, wherein an accommodating cavity is formed by the side plates and the bottom plate, an inner surface of a side plate is provided with a protrusion protruding toward inside of the accommodating cavity, and a groove used to accommodate the backlight source and fix a light guide plate is formed between the protrusion and the bottom plate. The backboard, the plastic central frame and the front frame of a display module such as television are integrated into one. This dramatically reduces the components or the key materials for the display module, thereby shortening the supply chain and saving the cost for the materials. Several key materials are integrated into one, so that the cost may be lowered.
    Type: Application
    Filed: September 13, 2016
    Publication date: October 11, 2018
    Inventors: Yajun Yu, Qian CAO, Wenhua SU, Jian YAO, Baivu PAN, Ji WANG
  • Publication number: 20180281153
    Abstract: The present disclosure relates to an abrasive article including a body having a bond material including metal and a micro-porosity within the bond material with an average pore size (D50) of not greater than 10 microns and a pore size standard deviation of at least 0.2 microns, and the body further includes abrasive particles contained within the bond material and having an ellipticity of not greater than 1.18 or an average toughness of at least 11257 cycles.
    Type: Application
    Filed: March 29, 2018
    Publication date: October 4, 2018
    Inventors: Jiashu LI, Kelley McNEAL, Srinivasan RAMANATH, Cecile O. MEJEAN, Ji WANG
  • Publication number: 20180266877
    Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.
    Type: Application
    Filed: May 18, 2018
    Publication date: September 20, 2018
    Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, Sonja Hanselmann
  • Publication number: 20180255265
    Abstract: The present disclosures relates to a TV main board apparatus, a connection apparatus, a TV, and a TV system. The TV main board apparatus comprises: a casing having at least one opening; and a TV main board accommodated in the casing and having a first interface and a second interface that are exposed outside the casing via their respective openings, wherein the first interface is capable of connecting to an power supply so as to receive first electric power, and wherein the second interface is capable of connecting to a TV so as to transmit a multimedia signal and the first electric power to the TV and receive second electric power from the TV.
    Type: Application
    Filed: September 12, 2016
    Publication date: September 6, 2018
    Inventors: Tingming Ren, Wenhua SU, Shenhua AN, Jian YAO, Baiyu PAN, Ji WANG