Abstract: A memory device including a first structure; and a second structure on the first structure, wherein the first structure includes a first substrate; a peripheral circuit on the first substrate; a first insulating layer covering the first substrate and the peripheral circuit; and a first bonding pad on the first insulating layer, the second structure includes a second substrate; a memory cell array on a first surface of the second substrate; a second insulating layer covering the first surface of the second substrate and the memory cell array; a conductive pattern at least partially recessed from a second surface of the second substrate; and a second bonding pad on the second insulating layer, the first bonding pad is in contact with the second bonding pad, and the conductive pattern is spaced apart from the second insulating layer.

Abstract: A semiconductor device includes a first peripheral circuit region comprising a plurality of lower circuitries, a second peripheral circuit region apart from the first peripheral circuit region in a vertical direction, the second peripheral circuit region comprising a plurality of upper circuitries, and a cell region comprising a plurality of word lines, the cell region between the first peripheral circuit region and the second peripheral circuit region in the vertical direction. The plurality of word lines comprise a first word line connected to a first lower circuitry selected from the plurality of lower circuitries and a second word line connected to a first upper circuitry selected from the plurality of upper circuitries.

Abstract: A semiconductor device includes a substrate including first and second regions; a first active fin extending in a first direction on the first region; a second active fin extending in the first direction on the second region; an isolation pattern on the substrate between the first and second regions; a first gate structure on the first active fin, extending in a second direction perpendicular to the first direction, and onto an upper surface of the isolation pattern; and a second gate structure on the second active fin, extending in the second direction, and onto the upper surface of the isolation pattern, wherein the first gate structure includes a first portion having a first width and a second portion having a second width that is less than the first width, and the second gate structure includes a third portion having the first width and a fourth portion having the second width.

Abstract: A semiconductor memory device includes: a semiconductor substrate having a first surface and a second surface opposing each other; a back-side insulating layer below the second surface of the semiconductor substrate; an external input/output conductive pattern below the back-side insulating layer; a circuit device including a gate electrode and a source/drain region, on the first surface of the semiconductor substrate; an internal input/output conductive pattern on the first surface of the semiconductor substrate, the internal input/output conductive pattern having at least a portion disposed on the same level as at least a portion of the gate electrode; a through-electrode structure penetrating through the semiconductor substrate and the back-side insulating layer and electrically connected to the internal input/output conductive pattern and the external input/output conductive pattern; and a memory cell array region disposed on a level higher than the circuit device, on the first surface of the semiconducto

Abstract: The present invention relates to a molded body, a sandwich panel using same as a core layer, and a method for manufacturing same, the molded body having a non-woven fiber aggregate structure comprising two or more non-woven fiber aggregates. The molded body comprises a polyester-based fiber and a polypropylene composite fiber, wherein the polypropylene composite fiber comprises polypropylene and maleic anhydride polyolefin.

Abstract: The present invention relates to a sandwich panel and a method of manufacturing the same. The sandwich panel according to the present invention has high density and improved physical properties such as flexural strength, flexural modulus, bending strength and lightening weighting ratio and is suitable for use in various consumer products or industrial materials.

Abstract: The present disclosure relates to a manufacturing method of a vehicle seatback cover, comprising a lightweight composite manufacturing step of manufacturing a lightweight composite using a reinforcing fiber and a thermoplastic resin fiber, a lightweight composite forming step of forming the lightweight composite into a vehicle seatback cover shape and preparing a vehicle seatback cover material, and a carpet bonding step of bonding the vehicle seatback cover material and a carpet material.

Abstract: The present invention relates to a sandwich panel and a method of manufacturing the same. The sandwich panel according to the present invention has high density and improved physical properties such as flexural strength, flexural modulus, bending strength and lightening weighting ratio and is suitable for use in various consumer products or industrial materials.

Abstract: The present invention relates to a sandwich panel and a method of manufacturing the same. The sandwich panel according to the present invention has high density and improved physical properties such as flexural strength, flexural modulus, bending strength and lightening weighting ratio and is suitable for use in various consumer products or industrial materials.

Abstract: The present invention relates to a sandwich panel and a method of manufacturing the same. The sandwich panel according to the present invention has high density and improved physical properties such as flexural strength, flexural modulus, bending strength and lightening weighting ratio and is suitable for use in various consumer products or industrial materials.

Abstract: The present invention relates to a sandwich panel and a method of manufacturing the same. The sandwich panel according to the present invention has high density and improved physical properties such as flexural strength, flexural modulus, bending strength and lightening weighting ratio and is suitable for use in various consumer products or industrial materials.

Abstract: The present disclosure relates to a manufacturing method of a vehicle seatback cover, comprising a lightweight composite manufacturing step of manufacturing a lightweight composite using a reinforcing fiber and a thermoplastic resin fiber, a lightweight composite forming step of forming the lightweight composite into a vehicle seatback cover shape and preparing a vehicle seatback cover material, and a carpet bonding step of bonding the vehicle seatback cover material and a carpet material.

Abstract: The present invention relates to a sandwich panel and a method of manufacturing the same. The sandwich panel according to the present invention has high density and improved physical properties such as flexural strength, flexural modulus, bending strength and lightening weighting ratio and is suitable for use in various consumer products or industrial materials.

Abstract: The present invention relates to a molded object and a method for manufacturing the same. The molded object according to the present invention has high density and enhanced properties such as flexural strength or tensile strength, has a small weight change caused by moisture absorption even when used for a long period of time, and has small changes in flexural strength, tensile strength and the like, and therefore, is suited to be used as household materials, industrial materials or the like.

Abstract: The present invention relates to a sandwich panel and a method of manufacturing the same. The sandwich panel according to the present invention has high density and improved physical properties such as flexural strength, flexural modulus, bending strength and lightening weighting ratio and is suitable for use in various consumer products or industrial materials.

Abstract: The present invention relates to a sandwich panel and a method of manufacturing the same. The sandwich panel according to the present invention has high density and improved physical properties such as flexural strength, flexural modulus, bending strength and lightening weighting ratio and is suitable for use in various consumer products or industrial materials.

Abstract: The present invention relates to a sandwich panel and a method of manufacturing the same. The sandwich panel according to the present invention has high density and improved physical properties such as flexural strength, flexural modulus, bending strength and lightening weighting ratio and is suitable for use in various consumer products or industrial materials.

Abstract: The present disclosure relates to the display panel and the display device include a first electrode disposed on a substrate, at least one spacer disposed on the bank, the outer edge of the spacer includes a first outer edge portion corresponding to from the bank to a first height above the bank and a second outer edge portion corresponding to a predetermined height from the first height. The first outer edge portion has a second tapering shape, and the second outer edge portion includes a part having a first tapering shape or a part having a convex shape.

Abstract: The present disclosure relates to the display panel and the display device include a first electrode disposed on a substrate, at least one spacer disposed on the bank, the outer edge of the spacer includes a first outer edge portion corresponding to from the bank to a first height above the bank and a second outer edge portion corresponding to a predetermined height from the first height. The first outer edge portion has a second tapering shape, and the second outer edge portion includes a part having a first tapering shape or a part having a convex shape.

Abstract: The present invention relates to a sandwich panel and a method of manufacturing the same. The sandwich panel according to the present invention has high density and improved physical properties such as flexural strength, flexural modulus, bending strength and lightening weighting ratio and is suitable for use in various consumer products or industrial materials.