Patents by Inventor Ji Won Pack

Ji Won Pack has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8367780
    Abstract: A block or graft copolymer including a thermoplastic resin segment and as an aliphatic polyester segment is provided. The copolymer can be used as a compatibilizer for a resin alloy comprising polylactic acid, which can reduce the consumption of petroleum raw materials.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: February 5, 2013
    Assignee: Cheil Industries Inc.
    Inventors: Ji Won Pack, Byeong Do Lee, Chang Do Jung, Hyung Tak Lee
  • Patent number: 8232343
    Abstract: An environmentally-friendly polylactic acid resin composition includes (A) a mixed resin including (a1) a polylactic acid (PLA) resin and (a2) a polycarbonate resin, and (B) a compatibilizer capable of forming a stereo-complex with the polylactic acid resin. According to the present invention, the polylactic acid resin composition is environmentally-friendly and has excellent appearance and improved welding impact strength, as well as improved mechanical strength and heat resistance. Accordingly, it can be used for manufacturing various molded products requiring heat resistance and mechanical strength, for example electronic parts, office machines, miscellaneous goods, and the like.
    Type: Grant
    Filed: May 1, 2009
    Date of Patent: July 31, 2012
    Assignee: Cheil Industries Inc.
    Inventors: Young-Mi Chung, Chang-Do Jung, Young-Jun Lee, Ji-Won Pack, Young-Chul Kwon, Hyung-Tak Lee, Jin-Kyung Cho
  • Publication number: 20100152362
    Abstract: A block or graft copolymer including a thermoplastic resin segment and as an aliphatic polyester segment is provided. The copolymer can be used as a compatibilizer for a resin alloy comprising polylactic acid, which can reduce the consumption of petroleum raw materials.
    Type: Application
    Filed: December 4, 2009
    Publication date: June 17, 2010
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Ji Won PACK, Byeong Do LEE, Chang Do JUNG, Hyung Tak LEE
  • Publication number: 20100056700
    Abstract: An environmentally-friendly polylactic acid resin composition includes (A) a mixed resin including (a1) a polylactic acid (PLA) resin and (a2) a polycarbonate resin, and (B) a compatibilizer capable of forming a stereo-complex with the polylactic acid resin. According to the present invention, the polylactic acid resin composition is environmentally-friendly and has excellent appearance and improved welding impact strength, as well as improved mechanical strength and heat resistance. Accordingly, it can be used for manufacturing various molded products requiring heat resistance and mechanical strength, for example electronic parts, office machines, miscellaneous goods, and the like.
    Type: Application
    Filed: May 1, 2009
    Publication date: March 4, 2010
    Applicant: Cheil Industries Inc.
    Inventors: Young-Mi Chung, Chang-Do Jung, Young-Jun Lee, Ji-Won Pack, Young-Chul Kwon, Hyung-Tak Lee, Jin-Kyung Cho
  • Patent number: 6913826
    Abstract: In polymerizing biodegradable polymer material, a compressed gas is used as a reaction solvent for a solution-polymerization, in order to prepare biodegradable polyester homopolymer and copolymer with a high molecular weight in a fine powder form with a particle size of 0.01˜1000 ?m.
    Type: Grant
    Filed: October 8, 2003
    Date of Patent: July 5, 2005
    Assignee: Korea Institute of Science and Technology
    Inventors: Youn-Woo Lee, Soo Hyun Kim, Young Ha Kim, Jong Sung Lim, Jong Min Park, Ji Won Pack
  • Publication number: 20040072985
    Abstract: In polymerizing biodegradable polymer material, a compressed gas is used as a reaction solvent for a solution-polymerization, in order to prepare biodegradable polyester homopolymer and copolymer with a high molecular weight in a fine powder form with a particle size of 0.01˜1000 &mgr;m.
    Type: Application
    Filed: October 8, 2003
    Publication date: April 15, 2004
    Applicant: Korea Institute of Science and Technology
    Inventors: Youn-Woo Lee, Soo Hyun Kim, Young Ha Kim, Jong-Sung Lim, Jong Min Park, Ji Won Pack