Patents by Inventor Ji Xiao Yu

Ji Xiao Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CLAMPING COMPONENT FOR CLAMPING A CHIP MODULE
    Publication number: 20190027418
    Abstract: A clamping component is provided to clamp a chip module, which has a circuit board and a protruding portion protruding upward from an upper surface thereof. In a left-right direction, a width of a first region from a left side of the circuit board to a left side of the protruding portion is greater than that of a second region from a right side of the circuit board to a right side of the protruding portion. Two abutting surfaces respectively abut the left and the right sides of the circuit board. A stopping block is located at a left side of an opening, and extends rightward to the left side of the protruding portion and beyond the left side of the circuit board. When the chip module is installed in the clamping component and the circuit board abuts the abutting surfaces, the stopping block is located above the first region.
    Type: Application
    Filed: January 11, 2018
    Publication date: January 24, 2019
    Inventors: Gui Bin Lin, Ji Xiao Yu
  • Clamping component for clamping a chip module
    Patent number: 10186469
    Abstract: A clamping component is provided to clamp a chip module, which has a circuit board and a protruding portion protruding upward from an upper surface thereof. In a left-right direction, a width of a first region from a left side of the circuit board to a left side of the protruding portion is greater than that of a second region from a right side of the circuit board to a right side of the protruding portion. Two abutting surfaces respectively abut the left and the right sides of the circuit board. A stopping block is located at a left side of an opening, and extends rightward to the left side of the protruding portion and beyond the left side of the circuit board. When the chip module is installed in the clamping component and the circuit board abuts the abutting surfaces, the stopping block is located above the first region.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: January 22, 2019
    Assignee: LOTES CO., LTD
    Inventors: Gui Bin Lin, Ji Xiao Yu