Patents by Inventor Ji Yea LEE

Ji Yea LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071070
    Abstract: Provided is an image recognition method including the steps of: for a deep learning network that carries out object recognition on a random image, carrying out quantization corresponding to the number of a plurality of different bits to generate a plurality of quantization models respectively corresponding to the number of bits; receiving image data as an input for the deep learning network; determining the uncertainty of the input image data; selecting any one of the plurality of quantization models on the basis of the determined uncertainty; and recognizing an object from the image data by using the selected quantization model, and outputting, as the result of the object recognition, a label corresponding to the image data.
    Type: Application
    Filed: December 30, 2021
    Publication date: February 29, 2024
    Inventors: Ook Sang YOO, Ji Yea CHON, Hyuk Jae LEE, Kyeong Jong LIM
  • Patent number: 11267934
    Abstract: The present invention relates to a polyester resin composition capable of having an excellent shrinkage rate, being heat-shrunk at a low temperature, and improving adhesion properties, without impairing insulation properties in a state of heat-shrinkable films, and a method for preparing the same. The present polyester resin composition comprises: a copolymerized polyester resin including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexyl methyl 4?-(hydroxymethyl)cyclohexane carboxylate, and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol, an alkali metal compound, and an alkaline earth metal compound, wherein the alkali metal compound and the alkaline earth metal compound are contained in an amount that the content ratio of the alkali metal element/the alkaline earth metal element derived therefrom is 0.01 to 1.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: March 8, 2022
    Inventors: Seol-Hee Lim, Ji Yea Lee, Sung-Gi Kim, Sun Dongbang
  • Patent number: 11203676
    Abstract: There is provided a heat shrinkable film comprising a polyester based copolymer capable of having an excellent shrinkage rate and being heat shrunk at a low temperature. The heat shrinkable film according to an exemplary embodiment of the present invention includes a polyester based copolymer, wherein the polyester based copolymer includes: a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1 and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol represented by the following Chemical Formula 2.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: December 21, 2021
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Seol-Hee Lim, Sung-Gi Kim, Ji Yea Lee
  • Publication number: 20200277459
    Abstract: There is provided a heat shrinkable film comprising a polyester based copolymer capable of having an excellent shrinkage rate and being heat shrunk at a low temperature. The heat shrinkable film according to an exemplary embodiment of the present invention includes a polyester based copolymer, wherein the polyester based copolymer includes: a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1 and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol represented by the following Chemical Formula 2.
    Type: Application
    Filed: May 19, 2020
    Publication date: September 3, 2020
    Inventors: Seol-Hee LIM, Sung-Gi KIM, Ji Yea LEE
  • Patent number: 10696806
    Abstract: A heat shrinkable film comprising a polyester based copolymer is provided.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: June 30, 2020
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Seol-Hee Lim, Sung-Gi Kim, Ji Yea Lee
  • Publication number: 20200109240
    Abstract: The present invention relates to a polyester resin composition capable of having an excellent shrinkage rate, being heat-shrunk at a low temperature, and improving adhesion properties, without impairing insulation properties in a state of heat-shrinkable films, and a method for preparing the same. The present polyester resin composition comprises: a copolymerized polyester resin including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexyl methyl 4?-(hydroxymethyl)cyclohexane carboxylate, and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol, an alkali metal compound, and an alkaline earth metal compound, wherein the alkali metal compound and the alkaline earth metal compound are contained in an amount that the content ratio of the alkali metal element/the alkaline earth metal element derived therefrom is 0.01 to 1.
    Type: Application
    Filed: December 5, 2019
    Publication date: April 9, 2020
    Inventors: Seol-Hee LIM, Ji Yea LEE, Sung-Gi KIM, Sun DONGBANG
  • Patent number: 10550223
    Abstract: The present invention relates to a polyester resin composition capable of having an excellent shrinkage rate, being heat-shrunk at a low temperature, and improving adhesion properties, without impairing insulation properties in a state of heat-shrinkable films, and a method for preparing the same. The present polyester resin composition comprises: a copolymerized polyester resin including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexyl methyl 4?-(hydroxymethyl)cyclohexane carboxylate, and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol, an alkali metal compound, and an alkaline earth metal compound, wherein the alkali metal compound and the alkaline earth metal compound are contained in an amount that the content ratio of the alkali metal element/the alkaline earth metal element derived therefrom is 0.01 to 1.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: February 4, 2020
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Seol-Hee Lim, Ji Yea Lee, Sung-Gi Kim, Sun Dongbang
  • Publication number: 20170275419
    Abstract: The present invention relates to a polyester resin composition capable of having an excellent shrinkage rate, being heat-shrunk at a low temperature, and improving adhesion properties, without impairing insulation properties in a state of heat-shrinkable films, and a method for preparing the same. The present polyester resin composition comprises: a copolymerized polyester resin including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexyl methyl 4?-(hydroxymethyl)cyclohexane carboxylate, and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol, an alkali metal compound, and an alkaline earth metal compound, wherein the alkali metal compound and the alkaline earth metal compound are contained in an amount that the content ratio of the alkali metal element/the alkaline earth metal element derived therefrom is 0.01 to 1.
    Type: Application
    Filed: August 24, 2015
    Publication date: September 28, 2017
    Inventors: Seol-Hee LIM, Ji Yea LEE, Sung-Gi KIM, Sun DONGBANG
  • Publication number: 20160130414
    Abstract: There is provided a heat shrinkable film comprising a polyester based copolymer capable of having an excellent shrinkage rate and being heat shrunk at a low temperature. The heat shrinkable film according to an exemplary embodiment of the present invention includes a polyester based copolymer, wherein the polyester based copolymer includes: a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1 and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol represented by the following Chemical Formula 2.
    Type: Application
    Filed: June 16, 2014
    Publication date: May 12, 2016
    Inventors: Seol-Hee LIM, Sung-Gi KIM, Ji Yea LEE