Abstract: The present technology includes a memory device and a method of manufacturing the same. The memory device includes a source line including a plurality of source layers and a buffer layer, the buffer layer being formed between the plurality of source layers, a stack structure formed on the source line, a cell plug contacting the source line by passing through the stack structure, a slit separating the stack structure, and a source contact formed in the slit and contacting the source line.

Abstract: A method of manufacturing a semiconductor memory device includes forming a preliminary source structure including a source sacrificial layer, forming a preliminary stacked structure including insulating layers and first sacrificial layers over the preliminary source structure, forming a slit passing through the preliminary stacked structure, removing the first sacrificial layers through the slit to define first recess regions between the insulating layers, forming a second sacrificial layer in each of the first recess regions, removing the source sacrificial layer through the slit to define a second recess region, and forming a source channel coupling layer in the second recess region.

Abstract: There are provided a memory device and a manufacturing method of the memory device. The memory device includes: a source line; a stack structure formed on the source line; a cell plug penetrating the stack structure and contacting the source line; a slit separating the stack structure; a source contact formed in the slit, the source contact in contact with the source line; and a compensation plug formed below the cell plug in the source line, wherein the compensation plug contains an impurity that has a higher concentration than an impurity that is contained in the source line.

Abstract: A method for manufacturing an electronic device includes forming a first source layer including a trench, forming a first sacrificial layer in the trench, forming a first structure over the first source layer, wherein the first structure includes first material layers and second material layers which are alternately stacked over the each other, forming first openings passing through the first structure and extending to the first sacrificial layer, forming first channel layers in the first openings, forming a slit passing through the first structure and extending to the first sacrificial layer, forming a second opening by removing the first sacrificial layer through the slit, and forming a second source layer in the second opening, wherein the second source layer is coupled to the first channel layers.

Abstract: A method for manufacturing an electronic device includes forming a first source layer including a trench, forming a first sacrificial layer in the trench, forming a first structure over the first source layer, wherein the first structure includes first material layers and second material layers which are alternately stacked over the each other, forming first openings passing through the first structure and extending to the first sacrificial layer, forming first channel layers in the first openings, forming a slit passing through the first structure and extending to the first sacrificial layer, forming a second opening by removing the first sacrificial layer through the slit, and forming a second source layer in the second opening, wherein the second source layer is coupled to the first channel layers.

Abstract: A prescription with alternative medications purchasable in a residing country of a patient receiving a telemedicine service, based on a prescription issued by a hospital or doctor of a country providing the telemedicine service, is provided to the patient such that the patient receives suitable and stable subsequent treatment through medications in the residing country after receiving the telemedicine service.

Abstract: The present invention relates to a pharmaceutical composition for preventing or treating CMT disease, comprising histone deacetylase 6 inhibitor. The pharmaceutical composition according to the present invention has histone deacetylase 6 (HDAC6) inhibitory activity and thus is effective in preventing or treating CMT disease.

Abstract: A touch screen and a display device having the same are disclosed. The touch screen includes an insulating substrate including a sensing region and a peripheral region, a plurality of sensing electrodes disposed in the sensing region, a plurality of wirings disposed in the peripheral region and electrically connected to the plurality of sensing electrodes, a plurality of pads disposed in the peripheral region and electrically connected to the plurality of wirings, an optical film disposed on an upper portion of the plurality of sensing electrodes, a flexible circuit board electrically connected to the plurality of pads, and a reinforcing member disposed on the flexible circuit board corresponding to the plurality of pads, wherein a first height measured from the insulating substrate to an upper surface of the reinforcing member is equal to a second height measured from the insulating substrate to an upper surface of the optical film.

Abstract: A method for manufacturing an electronic device includes forming a first source layer including a trench, forming a first sacrificial layer in the trench, forming a first structure over the first source layer, wherein the first structure includes first material layers and second material layers which are alternately stacked over the each other, forming first openings passing through the first structure and extending to the first sacrificial layer, forming first channel layers in the first openings, forming a slit passing through the first structure and extending to the first sacrificial layer, forming a second opening by removing the first sacrificial layer through the slit, and forming a second source layer in the second opening, wherein the second source layer is coupled to the first channel layers.

Abstract: A method for manufacturing an electronic device includes forming a first source layer including a trench, forming a first sacrificial layer in the trench, forming a first structure over the first source layer, wherein the first structure includes first material layers and second material layers which are alternately stacked over the each other, forming first openings passing through the first structure and extending to the first sacrificial layer, forming first channel layers in the first openings, forming a slit passing through the first structure and extending to the first sacrificial layer, forming a second opening by removing the first sacrificial layer through the slit, and forming a second source layer in the second opening, wherein the second source layer is coupled to the first channel layers.

Abstract: The present invention relates to a material for aggregating blood cells, used in the preparation of a paraffin block for diagnosing circulating tumor cells (CTCs), and a method for preparing a paraffin block using the same, and more specifically, to a method for detecting CTCs present in the blood through blood sample collection in the preparation of a paraffin block from CTCs, which are present in a very small amount in the blood. The present invention is non-invasive and simple, and thus is very useful for the diagnosis of cancer recurrence and metastatic cancer and for prognosis prediction, and can be a remarkable breakthrough in cancer treatment through the analysis of the onset, metastasis and recurrence mechanisms of cancer.

Abstract: A touch screen and a display device having the same are disclosed. The touch screen includes an insulating substrate including a sensing region and a peripheral region, a plurality of sensing electrodes disposed in the sensing region, a plurality of wirings disposed in the peripheral region and electrically connected to the plurality of sensing electrodes, a plurality of pads disposed in the peripheral region and electrically connected to the plurality of wirings, an optical film disposed on an upper portion of the plurality of sensing electrodes, a flexible circuit board electrically connected to the plurality of pads, and a reinforcing member disposed on the flexible circuit board corresponding to the plurality of pads, wherein a first height measured from the insulating substrate to an upper surface of the reinforcing member is equal to a second height measured from the insulating substrate to an upper surface of the optical film.

Abstract: A method for manufacturing an electronic device includes forming a first source layer including a trench, forming a first sacrificial layer in the trench, forming a first structure over the first source layer, wherein the first structure includes first material layers and second material layers which are alternately stacked over the each other, forming first openings passing through the first structure and extending to the first sacrificial layer, forming first channel layers in the first openings, forming a slit passing through the first structure and extending to the first sacrificial layer, forming a second opening by removing the first sacrificial layer through the slit, and forming a second source layer in the second opening, wherein the second source layer is coupled to the first channel layers.

Abstract: A method for manufacturing an electronic device includes forming a first source layer including a trench, forming a first sacrificial layer in the trench, forming a first structure over the first source layer, wherein the first structure includes first material layers and second material layers which are alternately stacked over the each other, forming first openings passing through the first structure and extending to the first sacrificial layer, forming first channel layers in the first openings, forming a slit passing through the first structure and extending to the first sacrificial layer, forming a second opening by removing the first sacrificial layer through the slit, and forming a second source layer in the second opening, wherein the second source layer is coupled to the first channel layers.

Abstract: A method for manufacturing an electronic device includes forming a first source layer including a trench, forming a first sacrificial layer in the trench, forming a first structure over the first source layer, wherein the first structure includes first material layers and second material layers which are alternately stacked over the each other, forming first openings passing through the first structure and extending to the first sacrificial layer, forming first channel layers in the first openings, forming a slit passing through the first structure and extending to the first sacrificial layer, forming a second opening by removing the first sacrificial layer through the slit, and forming a second source layer in the second opening, wherein the second source layer is coupled to the first channel layers.

Abstract: An apparatus for sensing a touch pressure includes: a substrate; a touch sensor provided on one surface of the substrate; a first pressure sensing electrode provided on the other surface opposite to the one surface of the substrate; a protective layer provided on the first pressure sensing electrode, the protective layer including a first opening area through which a portion of the first pressure sensing electrode is exposed; a flexible circuit board electrically connecting the touch sensor and the first pressure sensing electrode to each other; and a conductive member disposed in the first opening area, the conductive member electrically connecting the first pressure sensing electrode and the flexible circuit board to each other.

Abstract: A method for manufacturing an electronic device includes forming a first source layer including a trench, forming a first sacrificial layer in the trench, forming a first structure over the first source layer, wherein the first structure includes first material layers and second material layers which are alternately stacked over the each other, forming first openings passing through the first structure and extending to the first sacrificial layer, forming first channel layers in the first openings, forming a slit passing through the first structure and extending to the first sacrificial layer, forming a second opening by removing the first sacrificial layer through the slit, and forming a second source layer in the second opening, wherein the second source layer is coupled to the first channel layers.

Abstract: A method for manufacturing an electronic device includes forming a first source layer including a trench, forming a first sacrificial layer in the trench, forming a first structure over the first source layer, wherein the first structure includes first material layers and second material layers which are alternately stacked over the each other, forming first openings passing through the first structure and extending to the first sacrificial layer, forming first channel layers in the first openings, forming a slit passing through the first structure and extending to the first sacrificial layer, forming a second opening by removing the first sacrificial layer through the slit, and forming a second source layer in the second opening, wherein the second source layer is coupled to the first channel layers.

Abstract: A method for manufacturing an electronic device includes forming a first source layer including a trench, forming a first sacrificial layer in the trench, forming a first structure over the first source layer, wherein the first structure includes first material layers and second material layers which are alternately stacked over the each other, forming first openings passing through the first structure and extending to the first sacrificial layer, forming first channel layers in the first openings, forming a slit passing through the first structure and extending to the first sacrificial layer, forming a second opening by removing the first sacrificial layer through the slit, and forming a second source layer in the second opening, wherein the second source layer is coupled to the first channel layers.

Abstract: An apparatus for sensing a touch pressure includes: a substrate; a touch sensor provided on one surface of the substrate; a first pressure sensing electrode provided on the other surface opposite to the one surface of the substrate; a protective layer provided on the first pressure sensing electrode, the protective layer including a first opening area through which a portion of the first pressure sensing electrode is exposed; a flexible circuit board electrically connecting the touch sensor and the first pressure sensing electrode to each other; and a conductive member disposed in the first opening area, the conductive member electrically connecting the first pressure sensing electrode and the flexible circuit board to each other.