Patents by Inventor Ji Young Yim

Ji Young Yim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DETECTION OF SEED LAYERS ON A SEMICONDUCTOR DEVICE
    Publication number: 20090289172
    Abstract: A device and/or method which detects a seed layer and a device and/or method of forming layers on a semiconductor device. The device which forms layers on the semiconductor device may include a metal layer forming unit (which forms a metal layer on a wafer), a copper seed layer forming unit (which forms a copper seed layer on the metal layer), a wafer alignment device (which includes a wafer alignment unit which aligns the wafer to a predetermined position), a copper seed layer detecting unit (which is positioned above the wafer alignment unit to detect the copper seed layer formed on the wafer), and a plating unit (which forms a copper interconnection layer on the copper seed layer).
    Type: Application
    Filed: July 30, 2009
    Publication date: November 26, 2009
    Inventors: Ji Young YIM, Jae Hong KIM
  • Detection of seed layers on a semiconductor device
    Patent number: 7586597
    Abstract: A device and/or method which detects a seed layer and a device and/or method of forming layers on a semiconductor device. The device which forms layers on the semiconductor device may include a metal layer forming unit (which forms a metal layer on a wafer), a copper seed layer forming unit (which forms a copper seed layer on the metal layer), a wafer alignment device (which includes a wafer alignment unit which aligns the wafer to a predetermined position), a copper seed layer detecting unit (which is positioned above the wafer alignment unit to detect the copper seed layer formed on the wafer), and a plating unit (which forms a copper interconnection layer on the copper seed layer).
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: September 8, 2009
    Assignee: Dongbu HiTek Co., Ltd.
    Inventors: Ji Young Yim, Jae Hong Kim
  • DETECTION OF SEED LAYERS ON A SEMICONDUCTOR DEVICE
    Publication number: 20070087530
    Abstract: A device and/or method which detects a seed layer and a device and/or method of forming layers on a semiconductor device. The device which forms layers on the semiconductor device may include a metal layer forming unit (which forms a metal layer on a wafer), a copper seed layer forming unit (which forms a copper seed layer on the metal layer), a wafer alignment device (which includes a wafer alignment unit which aligns the wafer to a predetermined position), a copper seed layer detecting unit (which is positioned above the wafer alignment unit to detect the copper seed layer formed on the wafer), and a plating unit (which forms a copper interconnection layer on the copper seed layer).
    Type: Application
    Filed: October 11, 2006
    Publication date: April 19, 2007
    Inventors: Ji Young Yim, Jae Kim