Abstract: An exemplary heat sink includes a plurality of fins interconnected together. Each of the fins includes a main body and at least an engaging portion extending outwardly from the main body. The engaging portions of every two adjacent fins are interlocked with each other. The engaging portion includes a base extending outwardly from the main body, an engaging groove defined at a lateral side of the base, and an inserting rib protruding outwardly from another lateral side of the base opposite to the engaging groove. In the two adjacent fins, the inserting rib of the engaging portion of one fin is fitly inserted into the engaging groove of the engaging portion of another fin.

Abstract: A heat dissipation device includes a first heat sink and a second heat sink. The first heat sink includes a first heat spreader and a plurality of fins. The first heat spreader includes a receiving structure having a first tooth and two second teeth. The first tooth is located between the second teeth to define two first grooves between the first tooth and the second teeth. The second heat sink includes a second heat spreader and a plurality of fins. The second heat spreader includes a protruding structure having two first inserting portions. When the second heat sink is assembled to the first heat sink, the each of the first inserting portions is inserted in the first groove of the first heat spreader and deformed to be firmly engaged in the first groove and clasped by the first tooth.

Abstract: A heat dissipation apparatus adapted for cooling an electronic component received in a metal housing includes a heat sink thermally attached to the electronic component and plural of resilient tabs arranged between the heat sink and the metal housing. The resilient tabs are elastically deformed by the metal housing and thermally contact an inner face of the metal housing.

Abstract: A heat dissipation device includes a first heat sink and a second heat sink connected to each other. Each of the first and second heat sinks includes a base and a plurality of fins extending from the base. The base of the first heat sink forms a rib on a lateral face thereof, and the base of the second heat sink defines a groove in a lateral face thereof. The rib is received in the groove to connect the first heat sink with the second heat sink.

Abstract: A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink defines a receiving portion at a lateral side thereof. The heat pipe includes an evaporating section attached to the first heat sink, a condensing section attached to the second heat sink and a connecting section interconnecting the evaporating section with the condensing section. An engaging portion protrudes from a lateral side of the second heat sink and is firmly embedded in and lockable with the receiving portion of the first heat sink. The heat pipe extends through the engaging portion.

Abstract: A heat dissipation device includes a base and a fin group fixed on the base. The base includes a container, a flattened heat pipe and a solid supporting member. The container includes a baffle plate and a cover engaging with the baffle plate to define a receiving chamber therebetween. The heat pipe and the supporting member are housed in the receiving chamber. Opposite sides of the heat pipe and the supporting member respectively abut against the baffle plate and the cover of the container.

Abstract: An exemplary heat dissipation device includes a base and fasteners. The base includes a bottom plate, a top plate, a heat pipe, and a frame. The heat pipe is sandwiched between peripheries of the bottom plate and the top plate. The frame is sandwiched between the bottom plate and the top plate. The frame surrounds the heat pipe. The fasteners extend through the top plate, the frame and the bottom plate for fixing the heat dissipation device to a heat-generating component.

Abstract: A heat dissipation device includes a base and a fin group placed on the base and a plurality of heat pipes thermally connecting the base and the fin group together. The base includes a substrate and a conducting plate attached to a bottom of the substrate. The heat pipes include evaporating sections and condensing sections extending upwardly from the evaporating sections and through the fin group. The evaporating sections are wholly accommodated in the substrate and in contact with the conducting plate.

Abstract: A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink has a first base which defines a cutout at a lateral side thereof. The second heat sink has a second base. The heat pipe includes an evaporating portion disposed on the base, a condensing portion disposed on the second base and a connecting portion interconnecting the evaporating portion with the condensing portion. An insert portion protrudes from the second base and is engagingly inserted into the cutout. The connecting portion of the heat pipe extends through the insert portion.

Abstract: A heat dissipation device includes a base and a fin group placed on the base and a plurality of heat pipes thermally connecting the base and the fin group together. The base includes a substrate and a conducting plate attached to a bottom of the substrate. The heat pipes include evaporating sections and condensing sections extending upwardly from the evaporating sections and through the fin group. The evaporating sections are wholly accommodated in the substrate and in contact with the conducting plate.

Abstract: A heat dissipation assembly has a containment apparatus preventing unwanted migration of a thermal interface material to surrounding areas on a top surface of a heat sink. The containment apparatus includes a cap correspondingly covering the thermal interface material and an annular frame extending downwardly from a bottom end of the cap and attached to a periphery of a top of the heat sink. The cap includes a ceiling and a plurality of inclined sidewalls extending downwardly and outwardly from edges of the ceiling, thereby forming a protective space within the cap combining with the top surface of the heat sink to enclose the thermal interface material. Two ears extend outwardly from the frame and accommodate opposite ends of an abutting body of a wire clip therein.

Abstract: A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink defines a receiving portion at a lateral side thereof. The heat pipe includes an evaporating section attached to the first heat sink, a condensing section attached to the second heat sink and a connecting section interconnecting the evaporating section with the condensing section. An engaging portion protrudes from a lateral side of the second heat sink and is firmly embedded in and lockable with the receiving portion of the first heat sink. The heat pipe extends through the engaging portion.

Abstract: A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink has a first base which defines a cutout at a lateral side thereof. The second heat sink has a second base. The heat pipe includes an evaporating portion disposed on the base, a condensing portion disposed on the second base and a connecting portion interconnecting the evaporating portion with the condensing portion. An insert portion protrudes from the second base and is engagingly inserted into the cutout. The connecting portion of the heat pipe extends through the insert portion.

Abstract: A heat dissipation assembly has a containment apparatus preventing unwanted migration of a thermal interface material to surrounding areas on a top surface of a heat sink. The containment apparatus includes a cap correspondingly covering the thermal interface material and an annular frame extending downwardly from a bottom end of the cap and attached to a periphery of a top of the heat sink. The cap includes a ceiling and a plurality of inclined sidewalls extending downwardly and outwardly from edges of the ceiling, thereby forming a protective space within the cap combining with the top surface of the heat sink to enclose the thermal interface material. Two ears extend outwardly from the frame and accommodate opposite ends of an abutting body of a wire clip therein.

Abstract: A heat dissipation device includes a heat sink including a heat conducting portion and a plurality of fins extending from the heat conducting portion. The heat conducting portion has a base portion for contacting a heat generating device, and two wing portions extending from the base portion. The heat sink has two slits extending through two opposite sides thereof. A fan holder having a fan mounted thereon is attached to a face of the heat sink. The fan holder includes two brackets each having a rib engaged in a corresponding slit of the heat sink to thereby attach the fan holder to the heat sink, and a faceplate having the fan thereon. The faceplate has an ear secured to a corresponding wing portion of the heat sink by a screw and a tab extending upwardly beyond a top end of the heat sink.

Abstract: A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at two sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The heat sink defines a slot at a side thereof, the guiding member extends at least a fixing arm fixed to the heat sink and a tongue embedded into the slot of the heat sink, thereby attaching the guiding member to the heat sink.

Abstract: A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at two sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The heat sink defines a slot at a side thereof, the guiding member extends at least a fixing arm fixed to the heat sink and a tongue embedded into the slot of the heat sink, thereby attaching the guiding member to the heat sink.

Abstract: A heat dissipation device includes a heat sink including a heat conducting portion and a plurality of fins extending from the heat conducting portion. The heat conducting portion has a base portion for contacting a heat generating device, and two wing portions extending from the base portion. The heat sink has two slits extending through two opposite sides thereof. A fan holder having a fan mounted thereon is attached to a face of the heat sink. The fan holder includes two brackets each having a rib engaged in a corresponding slit of the heat sink to thereby attach the fan holder to the heat sink, and a faceplate having the fan thereon. The faceplate has an ear secured to a corresponding wing portion of the heat sink by a screw and a tab extending upwardly beyond a top end of the heat sink.

Abstract: A heat dissipation device for an electronic unit includes a heat sink (10), a pair of first heat pipes (20) and a pair of second heat pipes (30). The heat sink includes a base (12) for contacting with the electronic unit (42), a plate (14) spaced from the base, and a plurality of fins (16) arranged between the base and the plate. The first heat pipes are attached to the heat sink and include evaporating portions (22) sandwiched between the base and a bottom portion (162) of the fins for absorbing heat from the base, and condensing portions (24) thermally sandwiched between a top portion (164) of the fins and the plate. The second heat pipes are attached to the heat sink and sandwiched between the base and the bottom portion of the fins.

Abstract: A back plate assembly for a motherboard includes a back plate, four posts and four plastic rings. The back plate abuts against an underside of the motherboard. The posts extend from the back plate and pass through the motherboard. The rings engage with the posts respectively and elastically abut against an upside of the motherboard.