Patents by Inventor Jia-Chang LIN

Jia-Chang LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12237418
    Abstract: A semiconductor device includes a semiconductor layer. A gate structure is disposed over the semiconductor layer. A spacer is disposed on a sidewall of the gate structure. A height of the spacer is greater than a height of the gate structure. A liner is disposed on the gate structure and on the spacer. The spacer and the liner have different material compositions.
    Type: Grant
    Filed: August 4, 2023
    Date of Patent: February 25, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Huan-Chieh Su, Chih-Hao Wang, Kuo-Cheng Chiang, Wei-Hao Wu, Zhi-Chang Lin, Jia-Ni Yu, Yu-Ming Lin, Chung-Wei Hsu
  • Patent number: 12205819
    Abstract: A semiconductor device includes a first transistor and a second transistor. The first transistor includes: a first source and a first drain separated by a first distance, a first semiconductor structure disposed between the first source and first drain, a first gate electrode disposed over the first semiconductor structure, and a first dielectric structure disposed over the first gate electrode. The first dielectric structure has a lower portion and an upper portion disposed over the lower portion and wider than the lower portion. The second transistor includes: a second source and a second drain separated by a second distance greater than the first distance, a second semiconductor structure disposed between the second source and second drain, a second gate electrode disposed over the second semiconductor structure, and a second dielectric structure disposed over the second gate electrode. The second dielectric structure and the first dielectric structure have different material compositions.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: January 21, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Huan-Chieh Su, Zhi-Chang Lin, Ting-Hung Hsu, Jia-Ni Yu, Wei-Hao Wu, Yu-Ming Lin, Chih-Hao Wang
  • Patent number: 9860930
    Abstract: An electronic device includes a processor and a wireless communication module, The processor transmits one or more touch link messages via at least one transmitting electrode of a touch panel device to another electronic device in proximity to the electronic device and receives one or more touch link messages via at least one receiving electrode of the touch panel device from the other electronic device to obtain essential information for establishing a wireless communication connection with the other electronic device. The wireless communication module establishes a wireless communication connection with the other electronic device according to the essential information.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: January 2, 2018
    Assignee: MEDIATEK INC.
    Inventors: Tsung-Yueh Chiang, Jia-Chang Lin, Jing-Kuang Huang, Yu-Chieh Chien
  • Publication number: 20160345372
    Abstract: An electronic device includes a processor and a wireless communication module, The processor transmits one or more touch link messages via at least one transmitting electrode of a touch panel device to another electronic device in proximity to the electronic device and receives one or more touch link messages via at least one receiving electrode of the touch panel device from the other electronic device to obtain essential information for establishing a wireless communication connection with the other electronic device. The wireless communication module establishes a wireless communication connection with the other electronic device according to the essential information.
    Type: Application
    Filed: February 17, 2015
    Publication date: November 24, 2016
    Inventors: Tsung-Yueh CHIANG, Jia-Chang LIN, Jing-Kuang HUANG, Yu-Chieh CHIEN
  • Publication number: 20090135584
    Abstract: A light emitting module includes a back plate, at least one fluorescent lamp, a circuit board and a transforming unit. The fluorescent lamp is disposed on a surface of the back plate and has an electrode wire. The circuit board is disposed on the other surface of the back plate. The transforming unit is disposed on the circuit board and has at least one pin. The electrode wire connects with the pin directly.
    Type: Application
    Filed: November 19, 2008
    Publication date: May 28, 2009
    Inventor: Jia-Chang LIN