Patents by Inventor Jia-Chi Ho

Jia-Chi Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10803260
    Abstract: The present disclosure provides a QR code graphic manufacturing device, which comprises a gray-scaled adjusting module, a data-hiding module, and an error-diffusion module. The gray-scaled adjusting module is used to adjust a gray-scaled value of an original image to generate a modified gray-scaled image. The data-hiding module and the error-diffusion module are respectively used to process the modified gray-scaled image and a QR code, and to generate a QR code graphic with a better hidden effect.
    Type: Grant
    Filed: October 22, 2017
    Date of Patent: October 13, 2020
    Assignee: NATIONAL TAIWAN NORMAL UNIVERSITY
    Inventors: Hsi-Chun Wang, Chun-Shien Lu, Jia-Chi Ho, Shan-Hua Yeh, Yu-Mei Wang, Chia-Tsen Sun, Pei-Chun Kuan
  • Publication number: 20190026504
    Abstract: The present disclosure provides a QR code graphic manufacturing device, which comprises a gray-scaled adjusting module, a data-hiding module, and an error-diffusion module. The gray-scaled adjusting module is used to adjust a gray-scaled value of an original image to generate a modified gray-scaled image. The data-hiding module and the error-diffusion module are respectively used to process the modified gray-scaled image and a QR code, and to generate a QR code graphic with a better hidden effect.
    Type: Application
    Filed: October 22, 2017
    Publication date: January 24, 2019
    Inventors: His-Chun WANG, Chun-Shien LU, Jia-Chi HO, Shan-Hua YEH, Yu-Mei WANG, Chia-Tsen SUN, Pei-Chun KUAN
  • Patent number: 7782070
    Abstract: A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer of the probing device from the top side, the outer support member of the rack bears this touchdown stress. When the probes of the probe holder touching down the electronic components of an IC wafer under test, the center support member of the rack bears the reaction force from the IC wafer.
    Type: Grant
    Filed: June 4, 2008
    Date of Patent: August 24, 2010
    Assignee: MJC Probe Incorporated
    Inventors: Wei-Cheng Ku, Chih-Hao Ho, Ho-Hui Lin, Te-Chen Feng, Jun-Liang Lai, Jia-Chi Ho, Chih-Chung Chien, Chien-Huei Huang, Ai-Chuan Chang, Horng-Chuan Sun
  • Publication number: 20090009198
    Abstract: A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer of the probing device from the top side, the outer support member of the rack bears this touchdown stress. When the probes of the probe holder touching down the electronic components of an IC wafer under test, the center support member of the rack bears the reaction force from the IC wafer.
    Type: Application
    Filed: June 4, 2008
    Publication date: January 8, 2009
    Applicant: MJC PROBE INCORPORATION
    Inventors: Wei-Cheng Ku, Chih-Hao Ho, Ho-Hui Lin, Te-Chen Feng, Jun-Liang Lai, Jia-Chi Ho, Chih-Chung Chien, Chien-Huei Huang, Ai-Chuan Chang, Horng-Chuan Sun