Patents by Inventor Jia Chun Chen

Jia Chun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for Improving Adhesion of Films to Process Kits
    Publication number: 20100089744
    Abstract: A method includes providing a process chamber including a target, wherein the target has a first coefficient of thermal expansion (CTE); selecting a process kit including a surface layer having a second CTE close to the first CTE; and installing the process kit in the process chamber with the surface layer exposed to the process chamber. A ratio of a difference between the first CTE and the second CTE is less than about 35 percent.
    Type: Application
    Filed: September 29, 2009
    Publication date: April 15, 2010
    Inventors: Chia-Liang Chueh, Chang-Hui Chao, Jiun-Rong Pai, Yeh-Chieh Wang, Chihchous Chuang, Jia Chun Chen