Abstract: A method of manufacturing a polymer printed circuit board contains in a sequential order steps of: A), B), C), D, and F). In the step A), a material layer consisting of polymer is provided. In the step B), circuit pattern is formed on the material layer. In the step C), metal nanoparticles are deposited on the laser induced graphene (LIG) of the circuit pattern so as to use as a material seed. In the step D) a metal layer on the nanoparticles are deposited and the LIG of the circuit pattern are formed. In the step E), the circuit pattern is pressed. In the step E), the circuit pattern, the material layer, the metal nanoparticles, and the metal layer are pressed in a laminating manner to obtain the polymer printed circuit board.

Abstract: A heat dissipation coating layer contains: a binder and a core-shell heat dissipation filler. The core-shell heat dissipation filler is synthesized in a water bathing process at the temperature within 20° C. to 100° C. The core-shell heat dissipation filler includes a metal core and a shell composed of the mixture of oxide and hydroxide shell. Here the metal core has metal particles, and the shell has a porous structure consisted of a mixture of metal oxide and porous metal hydroxide.

Abstract: A method of manufacturing a hexagonal boron nitride (hBN) laminate on a backside of LED filament contains steps of: a) Preparing a substrate of LED filament array; b) Coating the hBN based slurry on the backside of substrate of LED filament and dried at 100-200° C.; c) Cutting the array to single LED filament. A LED filament with hBN based heat dissipation radiation laminate was obtained after this process. For heat dissipation application, hexagonal boron nitride laminate coating can significantly enhance the performance of LED light bulb.

Abstract: A method of manufacturing a polymer printed circuit board contains steps of: A. providing a material layer consisting of polymer; B. forming circuit pattern on the material layer; C. depositing metal nanoparticles on the LIG of the circuit pattern so as to use as a metal seed; D. pressing the circuit pattern; and E. forming a metal layer on the LIG of the circuit pattern. In the step of B, the circuit pattern includes laser induced graphene, and the laser induced graphene is porous. Thereby, the circuit pattern is adhered on the material layer securely and has outstanding electric conductivity after being pressed in the step D.

Abstract: A method of manufacturing a hexagonal boron nitride (hBN) laminate on a backside of LED filament contains steps of: a) Preparing a substrate of LED filament array; b) Coating the hBN based slurry on the backside of substrate of LED filament and dried at 100-200° C.; c) Cutting the array to single LED filament. A LED filament with hBN based heat dissipation radiation laminate was obtained after this process. For heat dissipation application, hexagonal boron nitride laminate coating can significantly enhance the performance of LED light bulb.

Abstract: A method of manufacturing a polymer printed circuit board contains steps of: A. providing a material layer consisting of polymer; B. forming circuit pattern on the material layer; C. depositing metal nanoparticles on the LIG of the circuit pattern so as to use as a metal seed; D. pressing the circuit pattern; and E. forming a metal layer on the LIG of the circuit pattern. In the step of B, the circuit pattern includes laser induced graphene, and the laser induced graphene is porous. Thereby, the circuit pattern is adhered on the material layer securely and has outstanding electric conductivity after being pressed in the step D.

Abstract: A heat dissipation coating layer contains: a binder and a core-shell heat dissipation filler. The core-shell heat dissipation filler is synthesized in a water bathing process at the temperature within 20° C. to 100° C. The core-shell heat dissipation filler includes a metal core and a shell composed of the mixture of oxide and hydroxide shell. Here the metal core has metal particles, and the shell has a porous structure consisted of a mixture of metal oxide and porous metal hydroxide.

Abstract: A method of forming a copper metal layer on a non-metallic material contains: a. providing a carbon-based electroless-plating inks; b. spraying the carbon-based electroless-plating inks on the non-metallic material; c. dry spraying the carbon-based electroless-plating inks on the non-metallic material; and d. dipping the non-metallic material on which the carbon-based electroless-plating inks dry sprayed in an electroless plating solution. Thereby, the copper metal layer is formed on the carbon-based electroless-plating inks of the non-metallic material.

Abstract: An electroless plating catalyst contains: carbon material powders which include oxygen functional groups, wherein the carbon material powders include oxide of any one of graphene, graphite, carbon nanotube, carbon black, and activated carbon with/without oxidization treatment. Oxygen content of the carbon material powders is 5 wt % to 50 wt % of a total weight of carbon powder material. The carbon material powders include a combination, and the combination is any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), and phosphorus (P), wherein a content of the combination is 1 wt % to 20 wt % of the total weight of the carbon powder material.

Abstract: An electroless plating catalyst contains: carbon material powders which include oxygen functional groups. The oxygen functional groups at least consisting of any one of lactol, ester, hydroxyl, epoxy, and ketone, wherein the carbon material powders include oxide of any one of graphene, graphite, carbon nanotube, carbon black, and activated carbon. Oxygen content of the carbon material powders is 5 wt % to 50 wt % of a total weight of carbon powder material. The carbon material powders include a combination, and the combination is any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), and phosphorus (P), wherein a content of the combination is 1 wt % to 20 wt % of the total weight of the carbon powder material.

Abstract: A RFID security structure for a document contains: a RFID antenna and a RFID chip. The RFID antenna is made of conductive inks printed on the document, and the RFID chip is attached on and is electrically connected with the RFID antenna. When the covering layer is removed from the document, the RFID antenna is broken. Accordingly, a portion of the RFID antenna attaches on the covering layer, and the other portion of the PRID antenna remains on the RFID security document or the substrate, hence the RFID security document is not tampered or is not imitated.

Abstract: A method of manufacturing a polymer printed circuit board contains steps of: A. providing a material layer consisting of polymer; B. forming circuit pattern on the material layer; C. depositing metal nanoparticles on the LIG of the circuit pattern so as to use as a metal seed; D. pressing the circuit pattern; and E. forming a metal layer on the LIG of the circuit pattern. In the step of B, the circuit pattern includes laser induced graphene, and the laser induced graphene is porous. Thereby, the circuit pattern is adhered on the material layer securely and has outstanding electric conductivity after being pressed in the step D.

Abstract: A heat dissipation coating layer contains: a heat dissipation filler and a binder which are synthesized in a water bathing manner. The heat dissipation filler includes a metal core formed on a central portion of the heat dissipation filler, and the heat dissipation filler also includes a metal shell surrounding the metal core, wherein the metal core has metal particles, and the metal shell has porous metal oxide particles and porous metal hydroxide particles, a size of each of the porous metal oxide particles and the porous metal hydroxide particles is less than 500 nm.

Abstract: A printed graphene-based laminate for wireless wearable communications can be processed at low temperature so that it is compatible with heat-sensitive flexible materials like papers and textiles. The printed graphene-based laminate is of high conductivity, high flexibility, light weight and low cost, making it perfect candidate for wireless wearable devices. As a proof of concept, printed graphene-based laminate enabled transmission lines (TLs) and antennas were designed, fabricated and characterized. To explore its potentials in wearable communications applications, mechanically flexible transmission lines and antennas under various bended cases were experimentally studied. The measurement results demonstrate that the printed graphene laminate can be used for RF signal transmitting, radiating and receiving, which represents some of the essential functionalities of RF signal processing in wireless wearable communications systems.

Abstract: A highly porous heat dissipation coating by graphene-rich baking varnish consists of: graphene nanoflakes, at least one dispersants, binders, and carriers. The amount of graphene-rich nanoflakes accounts for 10 to 70 wt % of solid composition of a graphene baking varnish. The at least one dispersant is non-ionic or ionic dispersant. The binder is made of thermoplastic polymers. The carrier is selected from aqueous liquids, organic solvents, or a combination thereof. A post-baking treatment at relative high temperature (100 to 400° C.) is applied for enhancing the adhesion of heat dissipation coating on metal surface. Accordingly, the graphene-rich baking varnish enhances adhesion and improves heat dissipation rate by convection and radiation.

Abstract: A method of manufacturing a hexagonal boron nitride laminate contains steps of: a) Dissolve dielectric polymers in solvent. b) Mixing h-BN powder to form a well-mixed h-BN coating slurry. c) Coating slurry on substrates and dried at 100-150° C. The substrates can directly be etched or processed to form electric circuits. Substrates can also be completely etched or detached to attain a free standing laminate. Thereby, a hexagonal boron nitride laminate exhibit thermal conductivity of 10 to 40 W/m·K, which is significantly larger than that currently used in thermal management. In addition, thermal conductivity of hexagonal boron nitride laminates increases with the increasing mass density, which opens a way of fine tuning of its thermal properties. For heat dissipation application, hexagonal boron nitride laminate coating can significantly enhance the performance of LED light bulb.

Abstract: A method of manufacturing hexagonal boron nitride laminates contains steps of: a) Dissolving dielectric polymers in solvent. b) Mixing h-BN powder to form a well-mixed h-BN coating slurry. c) Coating slurry on substrates and dried at 100 to 150° C. d-1) For free standing h-BN film, peel off h-BN dielectric polymer layer from substrate in water batch by roll to roll process. d-2) For h-BN film on substrates, heat compression of the substrates and hBN laminates at 100 to 250° C. for multi-layer structures. Thereby, hexagonal boron nitride laminates exhibit thermal conductivity of 10 to 40 W/m·K, which is significantly larger than that currently used in thermal management. In addition, thermal conductivity of hexagonal boron nitride laminates increases with the increasing mass density, which opens a way of fine tuning of its thermal properties.

Abstract: A graphene baking varnish consists of: graphene, fillers, at least one dispersants, binders, and solvent. The graphene includes graphene nanoflakes and accounts for 20 to70 wt % of solid composition of a graphene baking varnish. The fillers are heat dissipation filler including natural graphite, carbon black, boron nitride, copper (Cu), tin (Sn), iron (Fe), zinc (Zn), nickel (Ni), and sliver (Ag). The at least one dispersant is non-ionic or ionic dispersant. The binder is made of thermoplastic polymers. The solvent possesses one or more carriers. Accordingly, the graphene baking varnish enhances adhesion and improves heat dissipation rate by convection and radiation.

Abstract: A printed graphene-based laminate for wireless wearable communications can be processed at low temperature so that it is compatible with heat-sensitive flexible materials like papers and textiles. The printed graphene-based laminate is of high conductivity, high flexibility, light weight and low cost, making it perfect candidate for wireless wearable devices. As a proof of concept, printed graphene-based laminate enabled transmission lines (TLs) and antennas were designed, fabricated and characterized. To explore its potentials in wearable communications applications, mechanically flexible transmission lines and antennas under various bended cases were experimentally studied. The measurement results demonstrate that the printed graphene laminate can be used for RF signal transmitting, radiating and receiving, which represents some of the essential functionalities of RF signal processing in wireless wearable communications systems.

Abstract: A printed radio frequency sensor structure contains: a substrate, a RF antenna arranged on a top surface of the substrate, and a protection layer covering on the RF antenna arranged, wherein plural sensing materials are directly introduced into a RF antenna mixture of the RF antenna. A method of preparing a RFID sensor tag comprising steps of: A). Printing conductive sensing ink/glue on substrate; B. Drying, curing and compressing the conductive sensing ink/glue to form a conductive antenna mixture with plural sensing materials; C). Bonding a chip on a RFID sensing antenna to form a RFID sensor tag; and D). Coating a protection layer on a top of the RFID sensor tag. Here note protection coating can fully, partially or no cover the conductive sensing antenna.