Patents by Inventor Jia E. AW

Jia E. AW has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3D PRINTING OF THERMOSET POLYMERS AND COMPOSITES
    Publication number: 20210238330
    Abstract: The present disclosure provides a novel method of 3D printing using frontal polymerization chemistry. This method enables the printing of tough, high quality thermosets in a short time with the option of adding fiber reinforcement. As such, it facilitates fabrication of mechanically robust 3D-printed devices and structures.
    Type: Application
    Filed: January 14, 2021
    Publication date: August 5, 2021
    Applicant: The Board of Trustees of the University of Illinois
    Inventors: Jeffrey S. MOORE, Scott R. WHITE, Ian D. ROBERTSON, Nancy R. SOTTOS, Jia E. AW