Patents by Inventor Jia En AW

Jia En AW has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3D printing of thermoset polymers and composites
    Patent number: 10920002
    Abstract: The present disclosure provides a novel method of 3D printing using frontal polymerization chemistry. This method enables the printing of tough, high quality thermosets in a short time with the option of adding fiber reinforcement. As such, it facilitates fabrication of mechanically robust 3D-printed devices and structures.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: February 16, 2021
    Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
    Inventors: Jeffrey S. Moore, Scott R. White, Ian D. Robertson, Nancy R. Sottos, Jia En Aw
  • 3D PRINTING OF THERMOSET POLYMERS AND COMPOSITES
    Publication number: 20180327531
    Abstract: The present disclosure provides a novel method of 3D printing using frontal polymerization chemistry. This method enables the printing of tough, high quality thermosets in a short time with the option of adding fiber reinforcement. As such, it facilitates fabrication of mechanically robust 3D-printed devices and structures.
    Type: Application
    Filed: May 14, 2018
    Publication date: November 15, 2018
    Applicant: The Board of Trustees of the University of Illinois
    Inventors: Jeffrey S. MOORE, Scott R. White, Ian D. Robertson, Nancy R. Sottos, Jia En AW