Patents by Inventor Jia Hao Li

Jia Hao Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080007955
    Abstract: A multiple-set heat-dissipating structure for a LED lamp for performing the heat dissipation of the LED set includes a heat-conducting base, a plurality of heat pipes and a plurality of heat-dissipating bodies. On end face of the heat-conducting base is used for adhering to and contacting with the LED set. Each heat pipe has a heat-absorbing end and a heat-releasing end, respectively. The heat-absorbing end is connected to the other end face of the heat-conducting base. Each heat-dissipating body has a hollow cylinder. The outer periphery of the cylinder is formed with a plurality of radial heat-dissipating pieces and is connected on the heat-releasing end of each heat pipe. By dispersing each heat pipe and heat-dissipating body, the heat generated by the operation of the LED set can be conducted and dissipated by each heat pipe and heat-dissipating body at multiple points. In this way, the LED set can be continuously operated under a suitable working temperature and thus its life can be elongated.
    Type: Application
    Filed: July 5, 2006
    Publication date: January 10, 2008
    Inventor: Jia-Hao Li
  • Patent number: 7317616
    Abstract: A mechanism for connecting a loop heat pipe and a method therefore. The mechanism can communicably connect two pipe openings of a loop heat pipe, which includes a connector body. The connector body includes at least a through hole for inserting therein at least two pipe openings. At least one of the through holes is a penetrating hole, which allows at least one unsealed pipe opening to protrude the connector body. In addition, at least a communicable hole is drilled on the connector body perpendicular to the two pipe openings, thereby communicably connecting the two pipe openings. One can access the unsealed pipe opening to clean the inner part of the pipe, so as to fill therein a working fluid. Finally, the unsealed pipe openings and the communicable hole are sealed after exhaustion. Accordingly, a loop heat pipe is obtained.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: January 8, 2008
    Assignee: Jaffe Limited
    Inventor: Jia-Hao Li
  • Publication number: 20070279862
    Abstract: A heat-dissipating structure includes a heat-dissipating body and a heat pipe. The heat-dissipating body includes a first cylinder and a second cylinder provided within the first cylinder. A plurality of heat-dissipating pieces is further connected between the first cylinder and the second cylinder. A heat-dissipating path is formed between each heat-dissipating piece. The heat pipe is accommodated in the second cylinder and tightly connected thereto. With the heat conduction of the heat pipe, the heat generated by the operation of the LED lamp is absorbed and conducted to the second cylinder. Then, the heat is dissipated uniformly to the plurality of heat-dissipating pieces and the first cylinder. With the above arrangement, the present invention achieves the desired heat-dissipating effect and it is easy to grip and assemble the heat-dissipating body.
    Type: Application
    Filed: June 6, 2006
    Publication date: December 6, 2007
    Inventor: Jia-Hao Li
  • Publication number: 20070279909
    Abstract: A heat-dissipating structure having multiple heat pipes for a LED lamp is capable of performing the heat dissipation of the LED lamp. The heat-dissipating structure includes a seat to be heated and a plurality of heat pipes. The bottom surface of the seat to be heated has a surface to be heated for adhering to the LED lamp. The top surface of the seat to be heated has a heat-dissipating surface opposing to the surface to be heated. Each heat pipe has an end to be heated and a condensed end away from the end to be heated. On the heat-dissipating surface of the seat to be heated, a plurality of through holes is provided. The number of the through holes is consistent with that of the heat pipes. The axial direction of the end to be heated of the heat pipe is identical to that of the corresponding through hole, and is substantially perpendicular to the heat-dissipating surface of the seat to be heated.
    Type: Application
    Filed: June 6, 2006
    Publication date: December 6, 2007
    Inventor: Jia-Hao Li
  • Publication number: 20070240853
    Abstract: A multi-layer wick structure of the heat pipe, comprising a hollow heat pipe body and a weave mesh of the wick structure provided on the internal surface of the heat pipe body, wherein the weave mesh of the wick structure is subjected to at least one folding such that the periphery thereof is curled into a circle. By folding the weave mesh of the wick structure, it can be formed into a multi-layer structure. Then, after inserting the multi-layer wick structure and by the shrinking process of the heat pipe body, the wick structure can be tightly attached to the internal surface of the heat pipe body, thereby to increase the capillary force of the heat pipe and the amount of liquid to be delivered.
    Type: Application
    Filed: August 22, 2005
    Publication date: October 18, 2007
    Inventor: Jia-Hao Li
  • Publication number: 20070237202
    Abstract: A method for measuring the temperature of a heat pipe includes the steps of: firstly preparing a thermal couple wire formed at one end thereof with a temperature-sensing head, pressing the temperature-sensing head on the surface of the heat pipe to be measured, and a proper amount of a fluid medium is filled between the temperature-sensing head and the surface of the heat pipe. The fluid medium can be water, oil or flowable paste having lower viscosity. Due to the cohesion of the fluid medium, it can fill the gap between the temperature-sensing head and the surface of the heat pipe. As a result, the stability of the thermal contact resistance between the point-contact of the temperature-sensing head and the heat pipe is increased due to the filling of the fluid medium. Also, the contact effect is greatly enhanced to reduce the thermal contact resistance.
    Type: Application
    Filed: April 7, 2006
    Publication date: October 11, 2007
    Inventor: Jia-Hao Li
  • Publication number: 20070175616
    Abstract: A loop heat pipe includes an evaporator and a sealed pipe. The evaporator includes an evaporator body made of a heat conductive material. The evaporator body has at least two retaining holes and at least a channel hole penetrating the retaining holes. In addition, the sealed pipe includes at least two sealed ends. The two sealed ends are securely fastened to the two retaining holes of the evaporator. Meanwhile, at least one of the two retaining holes is a through hole, which penetrates through two sides of the evaporator body, and at least one of the sealed ends protrudes the evaporator via the penetrable retaining hole.
    Type: Application
    Filed: January 30, 2006
    Publication date: August 2, 2007
    Inventor: Jia-Hao Li
  • Publication number: 20070175613
    Abstract: A loop heat pipe includes an evaporator and a closed loop. The evaporator includes an evaporator body made of a heat conductive material. The evaporator body has at least two retaining holes and at least a channel hole penetrating the retaining holes. In addition, the closed loop includes a first pipe body and at least a second pipe body. One end of the first and the second pipe bodies is a heat reception end, which are securely fastened to the two retaining holes of the evaporator. The other end of the first and the second pipe bodies is a heat reception end, thereby sequentially forming a circulating loop. Meanwhile, a flattened liquid seal region is formed between the heat reception end and the connection end of the first pipe body.
    Type: Application
    Filed: January 30, 2006
    Publication date: August 2, 2007
    Inventor: Jia-Hao Li
  • Publication number: 20070177353
    Abstract: A mechanism for connecting a loop heat pipe and a method therefore. The mechanism can communicably connect two pipe openings of a loop heat pipe, which includes a connector body. The connector body includes at least a through hole for inserting therein at least two pipe openings. At least one of the through holes is a penetrating hole, which allows at least one unsealed pipe opening to protrude the connector body. In addition, at least a communicable hole is drilled on the connector body perpendicular to the two pipe openings, thereby communicably connecting the two pipe openings. One can access the unsealed pipe opening to clean the inner part of the pipe, so as to fill therein a working fluid. Finally, the unsealed pipe openings and the communicable hole are sealed after exhaustion. Accordingly, a loop heat pipe is obtained.
    Type: Application
    Filed: January 30, 2006
    Publication date: August 2, 2007
    Inventor: Jia-Hao Li
  • Publication number: 20070175614
    Abstract: A loop heat exchange apparatus for dissipating heat generated from a plurality of heat sources includes at least a first heat pipe having a heat reception portion, a plurality of second heat pipes each having a condensation portion, a plurality of evaporators disposed on the first heat pipe for contacting the heat source, and a connection mechanism. One end of the second heat pipes is inserted in the evaporator, while the other end of the second heat pipes is inserted to the connection mechanism of the first heat pipe. The evaporator and the connection mechanism are drilled, cleaned, filled with working fluid, evacuated and sealed. In this manner, the first heat pipe and the second heat pipes can form a tightly sealed loop heat exchange apparatus, which can perform heat exchange simultaneously with a plurality of heat sources.
    Type: Application
    Filed: January 30, 2006
    Publication date: August 2, 2007
    Inventor: Jia-Hao Li
  • Publication number: 20070175615
    Abstract: A loop heat pipe includes an evaporator, a liquid seal container and a closed loop. The evaporator includes an evaporator body made of a heat conductive material. The evaporator body includes at least two retaining holes and at least a channel hole penetrating the retaining holes. The liquid seal container is secured fastened to one of the retaining holes of the evaporator. A capillary structure is adhered to the inner wall of the liquid seal container. One end of the liquid seal container forms a liquid seal region using the capillary structure. The closed loop includes at least two closed ends. One of the closed ends is securely fastened to the other retaining hole of the evaporator, while the other closed end is communicably connected to the liquid seal region of the liquid seal container.
    Type: Application
    Filed: January 30, 2006
    Publication date: August 2, 2007
    Inventor: Jia-Hao Li
  • Patent number: 7225861
    Abstract: A bubble cycling heat exchanger includes a closed fluid loop in contact with a heat absorbing source through a heat conducting block. The loop has a bubble generator. An expanding area for generating bubbles is installed at the loop. The loop is also formed with a radiator and a guide region from which bubbles are easily separable. The heat conducting block is connected to the heat absorbing source. Since the overheating of the heat absorbing source will cause the loop to generate bubbles by an unequilibrium formed at the guide region of the loop, the bubbles will separate from the guide region so that the liquid in the loop flows for transferring heat and so that heat is radiated by the fins or other elements of the radiator from the primary element of a computer at the heat absorbing source. The loop operates continuously until a thermal equilibrium is achieved.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: June 5, 2007
    Inventor: Jia Hao Li
  • Patent number: 7143817
    Abstract: A support structure of a heat-pipe multi-layer wick structure, having a hollow heat-pipe tube and multiple separate layers of weaving mesh wick structure overlaying on an interior surface of the heat-pipe tube. The wick structure has a curly circular shape. The outermost layer of the wick structure has lower melting point compared to the inner layers of thereof. Thereby, the capillary force of the heat pipe is enhanced, while the mesh at the inner layers with higher melting point provides better support to the outer layers of the wick structure.
    Type: Grant
    Filed: December 28, 2004
    Date of Patent: December 5, 2006
    Inventor: Jia-Hao Li
  • Publication number: 20060201657
    Abstract: A heat-dissipating fin set in combination with thermal pipe includes a plurality of fin plates and each of the fin plates has at least one closed through hole at same location. Each of the thermal pipe passes through the through hole. Each of the fin plate has an accommodating section atop the through hole and used for accommodating a heat-conducting material. The heat-conducting material is placed into the accommodating section. The heat-conducting material is molten after heating the heat-dissipating fin set and the molten heat-conducting material fills a gap between the through hole and the thermal pipe, whereby a thermal conductance is provided between the through hole and the thermal pipe.
    Type: Application
    Filed: May 31, 2006
    Publication date: September 14, 2006
    Inventor: Jia-Hao Li
  • Publication number: 20060150647
    Abstract: A method and gas removing apparatus removes non-condensate gas from a heat pipe. The gas removing apparatus includes at least one heating unit, a sealing unit and a height-adjusting unit. The heating unit heats the heat pipe and includes a clip to clamp the heat pipe. The sealing unit is placed atop the heating unit and outside an opening of the heat pipe. The height-adjusting unit supports the heating unit and adjusts a height of the heating unit according to the length of the heat pipe, whereby the clip clamps on a lower portion of the heat pipe. During the removing operation of the non-condensate gas, the heating unit only heats a bottom portion of the heat pipe.
    Type: Application
    Filed: December 28, 2004
    Publication date: July 13, 2006
    Inventor: Jia-Hao Li
  • Publication number: 20060144230
    Abstract: An apparatus and a method for removing non-condensing gas in heat pipe are disclosed, In this method, a resilient pad is abutted against an opening of a pipe body of the heat pipe after a working fluid is filled into the heat pipe. The heat pipe is then heated to remove the non-condensing gas by pressure difference.
    Type: Application
    Filed: January 5, 2005
    Publication date: July 6, 2006
    Inventor: Jia-Hao Li
  • Publication number: 20060137857
    Abstract: A support structure of a heat-pipe multi-layer wick structure, having a hollow heat-pipe tube and multiple separate layers of weaving mesh wick structure overlaying on an interior surface of the heat-pipe tube. The wick structure has a curly circular shape. The outermost layer of the wick structure has finer mesh compared to the inner layers of thereof. Thereby, the capillary force of the heat pipe is enhanced, while the coarse mesh at the inner layers provide better support to the outer layers of the wick structure.
    Type: Application
    Filed: December 28, 2004
    Publication date: June 29, 2006
    Inventor: Jia-Hao Li
  • Publication number: 20060137858
    Abstract: A support structure of a heat-pipe multi-layer wick structure, having a hollow heat-pipe tube and multiple separate layers of weaving mesh wick structure overlaying on an interior surface of the heat-pipe tube. The wick structure has a curly circular shape. The outermost layer of the wick structure has lower melting point compared to the inner layers of thereof. Thereby, the capillary force of the heat pipe is enhanced, while the mesh at the inner layers with higher melting point provides better support to the outer layers of the wick structure.
    Type: Application
    Filed: December 28, 2004
    Publication date: June 29, 2006
    Inventor: Jia-Hao Li
  • Publication number: 20060137182
    Abstract: A method for fabricating a multi-layer wick structure of a heat pipe includes providing a first and a second weaving meshes, overlaying and winding the first and the second weaving meshes to form an open circular structure with the first weaving mesh encircling the second weaving mesh, inserting the open circular structure into a tubular member of the heat pipe, pressing the tubular member towards an central axis thereof such that the open circuit structure is forced into a close circular wick structure, and melting the first waving mesh to be attached on an interior surface of the tubular member.
    Type: Application
    Filed: December 28, 2004
    Publication date: June 29, 2006
    Inventor: Jia-Hao Li
  • Publication number: 20060137524
    Abstract: A method and gas removing apparatus removes non-condensate gas from a heat pipe. The gas removing apparatus includes a liquid container, a heating unit, and a sealing unit. The liquid container contains a heating liquid heated by the heating unit. The sealing unit is placed atop the heating unit and outside an opening of the heat pipe. The sealing unit comprises a sealing die and a sealing mechanism for opening and closing the sealing die. The heat pipe can be heated and the non-condensate gas can be removed therefrom by thermal conduction of the heating liquid.
    Type: Application
    Filed: December 28, 2004
    Publication date: June 29, 2006
    Inventor: Jia-Hao Li