Patents by Inventor Jia Hao YE

Jia Hao YE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10032652
    Abstract: The present disclosure relates to semiconductor packages and methods of manufacturing the same. In an embodiment, the semiconductor package includes a substrate, a semiconductor element, at least one connecting element, and an encapsulant. The semiconductor element is mounted to the substrate. The connecting element is disposed on the substrate and adjacent to the semiconductor element. The encapsulant covers at least a portion of the semiconductor element and at least a portion of the connecting element and defines at least one first groove surrounding the connecting element.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: July 24, 2018
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wen Tsung Hsu, Cheng-Hsien Yu, Chun Yuan Tsai, Tzung Shiou Tsai, Jia Hao Ye, Kuang Yi Hou
  • Publication number: 20160163612
    Abstract: The present disclosure relates to semiconductor packages and methods of manufacturing the same. In an embodiment, the semiconductor package includes a substrate, a semiconductor element, at least one connecting element, and an encapsulant. The semiconductor element is mounted to the substrate. The connecting element is disposed on the substrate and adjacent to the semiconductor element. The encapsulant covers at least a portion of the semiconductor element and at least a portion of the connecting element and defines at least one first groove surrounding the connecting element.
    Type: Application
    Filed: December 5, 2014
    Publication date: June 9, 2016
    Inventors: Wen Tsung HSU, Cheng-Hsien YU, Chun Yuan TSAI, Tzung Shiou TSAI, Jia Hao YE, Kuang Yi HOU