Abstract: An output pad control logic comprises an output buffer including a plurality of transistors connected to drive signals for an output pad. Each of the plurality of transistors includes an n-well. An n-well generator connects a first voltage to the n-wells of the plurality of transistors of the output buffer in a first mode of operation when a system rail voltage exceeds a pad voltage applied to the output pad. The n-well generator connects the pad voltage to the n-wells of the plurality of transistors of the output buffer in a second mode of operation when the pad voltage applied to the output buffer exceeds the system rail voltage. A switching circuit is responsive to at least one control signal to connect the system rail voltage as the first voltage when the output pad is not driving an LCD display and to connect a larger of the system rail voltage and an LCD drive voltage as the first voltage when the output pad is driving the LCD display.

Abstract: An electrical contact used in an electrical connector adapted for electrically connecting with an IC package and a printed circuit board is provided. Each contact comprises a base section, an upper resilient arm and a lower elastic arm extending from two opposite ends of the base section, respectively. The electrical connector comprises an insulative housing and a plurality of contacts retained in the insulative housing. The insulative housing includes a mating surface, a mounting surface, and a plurality of contact passageways passing through the mating surface and the mounting surface. The lower elastic arm of the contact at least partially projects below the mounting surface of the insulative housing. The lower elastic arm includes a first resisting portion for guiding the contact to be inserted into a via of the printed circuit board and resisting against inner wall of the via of the printed circuit board.

Abstract: An electrical contact material includes a base material, a first number of plating layers forming a contact section and a second number of plating layers forming a soldering section, respectively. The second number of plating layers is provided on the base material and includes a Ni-plating layer directly on the base material and an organic antioxidant-plating layer on said Ni-plating layer.

Abstract: The present invention relates to an electrical socket comprising a plurality of wafers arranged with one another in a first direction in a parallel relation, and a constraining device holding the wafers in position so as to maintain the wafers in a parallel manner. Each wafer is molded by an injected art with a number of contacts molded therein.

Abstract: An electrical contact comprises a blade serving a number of retaining portions thereon; and a spring arm extending parallel to the blade and attached to the blade by a curved portion so that a contacting space is formed between the spring arm and the blade for receiving and engaging with a pin leg of an electronic component. The electrical contact has a lower profile. The electrical socket incorporated with such contacts is benefited with low profile suitable for compact and thin applications.

Abstract: An electrical connector (100) includes an insulative housing (1) and a contact terminal (2). The insulative housing includes a first and a second primary faces (13, 12), and a passageway (11) extending between the first and second primary faces. The passageway defines a first opening (112) at the first primary face and a second opening (111) at the second primary face. The contact terminal is inserted into the passageway through the first opening. The contact terminal is formed with a contact section (24) having a pair of blocking portions (25) projecting along a transversal direction of the first opening.

Abstract: An LGA socket used for connecting a chip module and a print circuit board includes an insulative housing and a number of terminals received in the housing. The housing has a top surface and a bottom surface opposite to each other. Each of the terminals includes an upper arm extending beyond the top surface of the housing and a lower arm extending beyond the bottom surface of the housing. The upper arms and the lower arms of the terminals extend from the base portion with different lengths so as to form different pitches at top and bottom surfaces of the housing.

Abstract: An electrical contact (1) includes an upper extending portion (11), a lower extending portion (12) and a bridge portion (13). The upper extending portion includes a first contact portion (111), a C-shaped connecting portion (1121) connecting with the first contact portion and a tail portion (1122) extending downwardly from a free end of the C-shaped connecting portion. The lower extending portion includes a second contact portion (121), a vertical portion (1222) and an inclined portion (1221) connecting with the second contact portion and the vertical portion. The bridge portion is integrally formed between the tail portion and the vertical portion. One of the upper extending portion and the lower extending portion is rotated around the bridge portion to form an angular relationship between the planes of the upper and lower portions.

Abstract: A CPU socket (1) mounted on a PCB (2) includes a metallic cover (10) and an insulative housing (20). The insulative housing has an installation section (30). The metallic cover has a main portion (11), a locking portion (13) and a resilient portion (12). The resilient portion is rotatably assembly to the installation section. The metallic cover is able to rotate around the resilient portion. The locking portion and the resilient portion extend from opposite sides of the main portion, respectively. The locking portion is able to be locked and released to a locking member (32) which is fixed to the PCB. The locking portion is driven by a screwdriver (5) to release or lock to the locking member (32). The CPU socket provides a solution for locking or releasing from the PCB without a lever, which is used to lock or release the metallic cover.

Abstract: The single chip microcontroller unit includes a processing unit having normal power mode of operation and a low power mode of operation. Analog circuitry and digital circuitry are connected to the processing unit. Monitoring circuitry determines if a chip supply voltage level exceeds a threshold level necessary to maintain operation of the digital circuitry.

Abstract: The single chip microcontroller unit includes a processing unit having normal power mode of operation and a low power mode of operation. Analog circuitry and digital circuitry are connected to the processing unit. A power management unit controls power operations of the processing unit, the analog circuitry and the digital circuitry. Power monitoring circuitry provides power control signals to the power management unit. The power monitoring circuitry further includes a system voltage monitoring circuit for generating a system voltage control signal responsive to a system voltage level with respect to a predetermined level. The power monitoring circuitry also includes a supply monitoring circuit for determining if a chip supply voltage level exceeds a threshold level.

Abstract: An LCD controller includes a charge pump for generating a charge voltage responsive to an external voltage and a clock signal. The controller further includes an oscillator for generating the clock signal responsive to an oscillator control signal. An LCD driver voltage circuit generates a plurality of LCD driver voltages for driving segments of an associated LCD display. A loop control circuit within the LCD controller monitors an LCD driver voltage from the LCD driver voltage circuit and generates the oscillator control signal responsive thereto to enable and disable the oscillator.

Abstract: An LCD controller includes a charge pump circuit for generating a charge voltage responsive to an external voltage and a clock signal. An oscillator generates the clock signal responsive to at least one bias voltage. The oscillator has a high power mode of operation and a low power mode of operation. Bias circuitry for applies the at least one bias voltage to the oscillator. The at least one bias voltage is applied to the oscillator from an external source in the high power mode of operation and the at least one bias voltage is applied to the oscillator from a source within the oscillator in the low power mode of operation. An LCD driver voltage circuit generates a plurality of LCD driver voltages for driving segments of an LCD display responsive to the charge voltage.

Abstract: An LCD controller includes a charge pump circuit for generating a charge voltage responsive to an external voltage and a clock signal. An oscillator generates the clock signal responsive to at least one bias voltage. The oscillator has a high power mode of operation and a low power mode of operation. Bias circuitry for applies the at least one bias voltage to the oscillator. The at least one bias voltage is applied to the oscillator from an external source in the high power mode of operation and the at least one bias voltage is applied to the oscillator from a source within the oscillator in the low power mode of operation. An LCD driver voltage circuit generates a plurality of LCD driver voltages for driving segments of an LCD display responsive to the charge voltage.

Abstract: The electrical connector has an insulative housing and a number of contacts embedded in the housing and distributed in rows and columns. Each of the contact has a pair of contacting arms with a contacting portion thereon for electrically connecting with a pad of the electronic package. The contacting portions of the contacts are arranged in a pattern of contact portions of two adjacent contacts in same row can engage with a same pad on the electronic package when the electrical connector is coupled with the electronic package, such that the contacts of the row are coupled with each other in series. By way above mentioned, pitch between two adjacent contacts can be reduced and a high density of the contacts can be achieved.

Abstract: An apparatus comprises a band gap voltage generator circuit for generating a band gap voltage. A temperature invariant current generator is located within the band gap voltage generator circuit for generating a temperature invariant current. A temperature invariant current correction circuit is located within the band gap voltage generator circuit and adjusts the output voltage responsive to the temperature invariant current without altering temperature characteristics of the temperature invariant current.

Abstract: An LGA socket used for connecting a chip module and a print circuit board includes an insulative housing and a number of terminals received in the housing. The housing has a top surface and a bottom surface opposite to each other. Each of the terminals includes an upper arm extending beyond the top surface of the housing and a lower arm extending beyond the bottom surface of the housing. The upper arms and the lower arms of the terminals extend from the base portion with different lengths so as to form different pitches at top and bottom surfaces of the housing.

Abstract: An electrical connector (100) includes a first insulative housing (1), a second insulative housing (2), a soldering contact (4) positioned in the second insulative housing (2) for electrically connecting with a circuit substrate and an electrical contact (3) made of wire, the electrical contact (3) comprising a first retention portion (31) positioned in the first insulative housing (1) with a contacting portion (311) extending beyond the first insulative housing (1) for electrically connecting to an electronic package, a spring portion (32) and a second retention portion (33) positioned in the second insulative housing (2) connected with the soldering contact (4), when the electrical contact (3) is pressed down by the electronic package, the spring portion (32) expanded outwardly and the electrical contact (3) only moves along up-to-down direction, thus make the contacting portion (311) engages with the electronic package with minimal wiping length.

Abstract: An electrical connector comprises an insulative housing and a plurality of contacts. Each contact comprises an upper contact and a lower contact. The upper contact has a retention portion and a contact portion. The lower contact has a soldering portion and a planar board extending upwardly from the soldering portion. The lower contacts fixed to different parts of upper contacts, respectively, so as to have a larger neighbor distance than that of the upper contacts.

Abstract: An electrical connector (100) includes an insulative housing (1) and a contact terminal (2). The insulative housing includes a first and a second primary faces (13, 12), and a passageway (11) extending between the first and second primary faces. The passageway defines a first opening (112) at the first primary face and a second opening (111) at the second primary face. The contact terminal is inserted into the passageway through the first opening. The contact terminal is formed with a contact section (24) having a pair of blocking portions (25) projecting along a transversal direction of the first opening.