Abstract: The present invention provides an array substrate and a manufacturing method thereof. Etching stop patterns or auxiliary conductive patterns of a patterned auxiliary conductive layer are disposed corresponding to heavily doped regions of a patterned semiconductor layer, and source/drain electrodes may be electrically connected to the heavily doped regions via the etching stop patterns or the auxiliary conductive patterns. The production yield and the uniformity of electrical properties may be enhanced accordingly.

Abstract: A display module substrate and a manufacturing method thereof are provided. The display module substrate includes a substrate body and a plurality of signal circuits. The substrate body has a supporting surface. The supporting surface includes a viewing area and a signal circuit area on one side of the viewing area. The signal circuits are disposed on the supporting surface and located at the signal circuit area. The signal circuit area has a plurality of apertures running through the substrate body, wherein the apertures are not shielded by the signal circuits. In a manufacturing thereof, the substrate body is disposed on a transparent carrier plate. When high-energy light is applied through the transparent carrier plate to etch a bottom surface of the substrate body to separate the substrate body and the transparent carrier plate, the resulting gas leaves through the apertures.

Abstract: The present invention provides a manufacturing method of a display module, including a step of disposing a substrate on a transparent carrier plate, wherein the substrate has a bottom surface and a supporting surface opposite to the bottom surface; the bottom surface is attached to the transparent carrier plate and includes a first area and a second area. A step of performing a display elements manufacturing process on the supporting surface. A step of etching the first area by a first energy having a first energy density passing through the transparent carrier plate to separate the first area from the transparent carrier plate. A step of etching the second area by a second energy having a second energy density passing through the transparent carrier plate to separate the second area from the transparent carrier plate, wherein the second energy density is greater than the first energy density. A step of separating the substrate from the transparent carrier plate.

Abstract: The present invention provides an array substrate and a manufacturing method thereof. Etching stop patterns or auxiliary conductive patterns of a patterned auxiliary conductive layer are disposed corresponding to heavily doped regions of a patterned semiconductor layer, and source/drain electrodes may be electrically connected to the heavily doped regions via the etching stop patterns or the auxiliary conductive patterns. The production yield and the uniformity of electrical properties may be enhanced accordingly.

Abstract: A display module substrate and a manufacturing method thereof are provided. The display module substrate includes a substrate body and a plurality of signal circuits. The substrate body has a supporting surface. The supporting surface includes a viewing area and a signal circuit area on one side of the viewing area. The signal circuits are disposed on the supporting surface and located at the signal circuit area. The signal circuit area has a plurality of apertures running through the substrate body, wherein the apertures are not shielded by the signal circuits. In a manufacturing thereof, the substrate body is disposed on a transparent carrier plate. When high-energy light is applied through the transparent carrier plate to etch a bottom surface of the substrate body to separate the substrate body and the transparent carrier plate, the resulting gas leaves through the apertures.

Abstract: A display module substrate and a manufacturing method thereof are provided. The display module substrate includes a substrate body and a plurality of signal circuits. The substrate body has a supporting surface. The supporting surface includes a viewing area and a signal circuit area on one side of the viewing area. The signal circuits are disposed on the supporting surface and located at the signal circuit area. The signal circuit area has a plurality of apertures running through the substrate body, wherein the apertures are not shielded by the signal circuits. In a manufacturing thereof, the substrate body is disposed on a transparent carrier plate. When high-energy light is applied through the transparent carrier plate to etch a bottom surface of the substrate body to separate the substrate body and the transparent carrier plate, the resulting gas leaves through the apertures.

Abstract: The present invention provides a manufacturing method of a display module, including a step of disposing a substrate on a transparent carrier plate, wherein the substrate has a bottom surface and a supporting surface opposite to the bottom surface; the bottom surface is attached to the transparent carrier plate and includes a first area and a second area. A step of performing a display elements manufacturing process on the supporting surface. A step of etching the first area by a first energy having a first energy density passing through the transparent carrier plate to separate the first area from the transparent carrier plate. A step of etching the second area by a second energy having a second energy density passing through the transparent carrier plate to separate the second area from the transparent carrier plate, wherein the second energy density is greater than the first energy density. A step of separating the substrate from the transparent carrier plate.

Abstract: The present invention provides a manufacturing method of a display module, including a step of disposing a substrate on a transparent carrier plate, wherein the substrate has a bottom surface and a supporting surface opposite to the bottom surface; the bottom surface is attached to the transparent carrier plate and includes a first area and a second area. A step of performing a display elements manufacturing process on the supporting surface. A step of etching the first area by a first energy having a first energy density passing through the transparent carrier plate to separate the first area from the transparent carrier plate. A step of etching the second area by a second energy having a second energy density passing through the transparent carrier plate to separate the second area from the transparent carrier plate, wherein the second energy density is greater than the first energy density. A step of separating the substrate from the transparent carrier plate.

Abstract: A display module substrate and a manufacturing method thereof are provided. The display module substrate includes a substrate body and a plurality of signal circuits. The substrate body has a supporting surface. The supporting surface includes a viewing area and a signal circuit area on one side of the viewing area. The signal circuits are disposed on the supporting surface and located at the signal circuit area. The signal circuit area has a plurality of apertures running through the substrate body, wherein the apertures are not shielded by the signal circuits. In a manufacturing thereof, the substrate body is disposed on a transparent carrier plate. When high-energy light is applied through the transparent carrier plate to etch a bottom surface of the substrate body to separate the substrate body and the transparent carrier plate, the resulting gas leaves through the apertures.

Abstract: The present invention provides a manufacturing method of a display module, including a step of disposing a substrate on a transparent carrier plate, wherein the substrate has a bottom surface and a supporting surface opposite to the bottom surface; the bottom surface is attached to the transparent carrier plate and includes a first area and a second area. A step of performing a display elements manufacturing process on the supporting surface. A step of etching the first area by a first energy having a first energy density passing through the transparent carrier plate to separate the first area from the transparent carrier plate. A step of etching the second area by a second energy having a second energy density passing through the transparent carrier plate to separate the second area from the transparent carrier plate, wherein the second energy density is greater than the first energy density. A step of separating the substrate from the transparent carrier plate.