Patents by Inventor Jia-Huei Hung

Jia-Huei Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20180063966
    Abstract: An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.
    Type: Application
    Filed: May 30, 2017
    Publication date: March 1, 2018
    Inventors: Chih-Hsien Chiu, Chen-Wen Huang, Hsin-Lung Chung, Wen-Jung Tsai, Jia-Huei Hung, Fu-Tang Huang
  • Electronic package structure and method for fabricating the same
    Patent number: 9907186
    Abstract: An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: February 27, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chih-Hsien Chiu, Chen-Wen Huang, Hsin-Lung Chung, Wen-Jung Tsai, Jia-Huei Hung, Fu-Tang Huang
  • ELECTRONIC STACK STRUCTURE HAVING PASSIVE ELEMENTS AND METHOD FOR FABRICATING THE SAME
    Publication number: 20180047711
    Abstract: An electronic stack structure is provided, including a first substrate, a second substrate stacked on the first substrate through a plurality of passive elements, and an electronic element disposed on at least one of the first substrate and the second substrate. As such, the distance between the first substrate and the second substrate is defined by the height and size of the passive elements. The present disclosure further provides a method for fabricating the electronic stack structure.
    Type: Application
    Filed: November 16, 2016
    Publication date: February 15, 2018
    Inventors: Chih-Hsien Chiu, Chi-Liang Shih, Jia-Huei Hung, Chia-Yang Chen, Yueh-Chiung Chang