Patents by Inventor Jia-Hung Lai

Jia-Hung Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240020243
    Abstract: In an example in accordance with the present disclosure, a method is described. According to the method, boundary values for a setting for a signal between a compute device and a peripheral device are determined. A target value for the setting is determined. The target value is a value between determined boundary values. The setting for the signal is adjusted to match the target value.
    Type: Application
    Filed: April 29, 2020
    Publication date: January 18, 2024
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Cheng-Yan Chiang, James L. Mondshine, Charles Shaver, Khoa Huynh, Jia-Hung Lai, Bing-Hao Cheng, Kuang-Che Teng, Chin-Yu Wang
  • Publication number: 20230121942
    Abstract: Examples disclosed herein provide an enclosure of a computing device. One example enclosure includes a cover to provide access to components within the enclosure, and the cover is coupled to the enclosure via a shape memory material (SMM) structure. As an example, the SMM structure is to provide for removability of the cover according to a temperature of a heat generating component disposed within the enclosure.
    Type: Application
    Filed: March 27, 2020
    Publication date: April 20, 2023
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Yao-Wen Fan, Yu-Wei Tan, Jia-Hung Lai, Yi-Hsieh Chiu