Abstract: A computer system and a processing method thereof of sound signal are provided. The computer system includes a platform path controller (PCH), a high-definition audio (HDA) codec, and a digital microphone. The HDA codec is coupled to the PCH. The digital microphone is coupled to the PCH and the HDA codec. The digital microphone is used to generate sound signal. The HDA codec processes the sound signal from the digital microphone. Accordingly, the audio recording with high quality could be provided.

Abstract: An identifying method of a sound watermark and a sound watermark identifying apparatus are provided. The method includes the following. A synthesized sound signal is received through a network. Noise interference transferred through the network in the synthesized sound signal is determined according to a reflection-cancelling sound signal. A coding threshold is determined according to the noise interference. A sound watermark signal in the synthesized sound signal is identified according to the coding threshold.

Abstract: A marking method on image combined with sound signal, a terminal apparatus, and a server are provided. In the method, a first image is displayed. A selection command is detected. A target sound signal is embedded into a speech signal so as to generate a combined sound signal. The combined sound signal is transmitted. The selection command corresponds to a target region in the first image, and the selection command is generated selecting the target region through an input operation. The target sound signal corresponds to the target region of the selection command, and the speech signal is obtained by receiving sound. Accordingly, all attendants in the video conference are able to make makings on a shared screen.

Abstract: An electronic system includes a fan module, an embedded controller, a reference microphone, a stereo speaker module, a beam-forming control module and an ANC controller. The beam-forming control module controls the orientation of the stereo speaker module, which provides a noise cancellation signal according to a speaker control signal. The reference microphone outputs a wide-band noise signal associated with the operation of the fan module. A virtual microphone module in the active noise cancellation controller outputs a virtual error signal according to a first transfer function between the reference microphone and a physical error microphone at a predetermined fan speed, a second transfer function between the stereo speaker module and the physical error microphone when the fan module is not in operation and the wide-band noise signal. The ANC controller provides the speaker control signal according to a synchronization signal, the wide-band noise signal and the virtual error signal.

Abstract: An amplifier DC bias protection circuit includes an amplifier module, a filter module and a comparator module. The amplifier module converts an input signal into a non-inverting signal and an inverting signal. The filter module blocks AC signals in the non-inverting signal and the inverting signal, thereby providing a first DC bias signal and a second DC bias signal accordingly. The comparator module is configured to determine whether the absolute value of a DC bias difference signal is greater than a predetermined value, and output a determination signal for deactivating the amplifier module when the absolute value of the DC bias difference signal is greater than the predetermined value. The DC bias difference signal is associated with the voltage difference between the first DC bias signal and the second DC bias signal.

Abstract: A conference terminal and an embedding method of audio watermarks are provided. In the method, a first speech signal and a first audio watermark signal are received respectively. The first speech signal relates to a speaker corresponding to another conference terminal, and the first audio watermark signal corresponds to the another conference terminal. The first speech signal is assigned to a host path to output a second speech signal. The first audio watermark signal is assigned to an offload path to output a second audio watermark signal. The host path provides more digital signal processing (DSP) effects than the offload path. The second speech signal and the second audio watermark signal are synthesized to output a synthesized audio signal. The synthesized audio signal is adapted for audio playback. A completed audio watermark signal is outputted accordingly.

Abstract: A manufacturing method of the ESD protection device includes the following steps. A surface treatment is performed on the substrate. A link layer is formed on the substrate after the surface treatment, wherein a material of the link layer includes a metal material. A progressive layer is formed on the link layer, wherein a material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. A composite layer is formed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×107 to 1×108 ?/sq.

Abstract: A manufacturing method of the ESD protection device includes the following steps. A surface treatment is performed on the substrate. A link layer is formed on the substrate after the surface treatment, wherein a material of the link layer includes a metal material. A progressive layer is formed on the link layer, wherein a material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. A composite layer is formed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×107 to 1×108 ?/sq.

Abstract: An ESD protection composite structure includes a link layer, a progressive layer, and a composite layer. The link layer is used for disposing the ESD protection composite structure on a substrate, wherein a material of the link layer includes a metal material. The progressive layer is disposed on the link layer, wherein the material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. The composite layer is disposed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×107 ?/sq to 1×108 ?/sq.

Abstract: An ESD protection composite structure includes a link layer, a progressive layer, and a composite layer. The link layer is used for disposing the ESD protection composite structure on a substrate, wherein a material of the link layer includes a metal material. The progressive layer is disposed on the link layer, wherein the material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. The composite layer is disposed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×107 ?/sq to 1×108 ?/sq.

Abstract: A hydrophobic alloy film and a manufacturing method thereof are provided. The hydrophobic alloy film includes Al, Cu, O, and at least one selected from the group consisting of Fe, Co, Ni, and Cr, or Ti, Zr, O, and at least one selected from the group consisting of Fe, Co, Ni, and Cr. The content of each of Al and Ti is in the range of 40 at. % to 70 at. %. The content of each of Cu and Zr is in the range of 10 at. % to 40 at. %. The total content of at least one selected from the group consisting of Fe, Co, Ni, and Cr is in the range of 10 at. % to 30 at. %. The content of O is in the range of 10 at. % to 30 at. %. The hydrophobic alloy film has a quasicrystal structure and nanoparticles.

Abstract: An iron-based biodegradable component includes an iron element of 60 to 99.5 parts by weight and modifying material of 0.5 to 40 parts by weight, wherein the modifying material includes at least one of a zinc element of 0.1 to 5 parts by weight and a biodegradable ceramic material of 0.1 to 40 parts by weight.

Abstract: A protected active metal electrode and a device with the electrode are provided. The protected active metal electrode includes an active metal substrate and a protection layer on a surface of the active metal substrate. The protection layer at least includes a metal thin film covering the surface of the active metal substrate and an electrically-conductive thin film covering a surface of the metal thin film. A material of the metal thin film is Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, or W. A material of the electrically-conductive thin film is selected from nitride of a metal in the metal thin film, carbide of a metal in the metal thin film, a diamond-like carbon (DLC), and a combination thereof.

Abstract: A hydrophobic alloy film and a manufacturing method thereof are provided. The hydrophobic alloy film includes Al, Cu, O, and at least one selected from the group consisting of Fe, Co, Ni, and Cr, or Ti, Zr, O, and at least one selected from the group consisting of Fe, Co, Ni, and Cr. The content of each of Al and Ti is in the range of 40 at. % to 70 at. %. The content of each of Cu and Zr is in the range of 10 at. % to 40 at. %. The total content of at least one selected from the group consisting of Fe, Co, Ni, and Cr is in the range of 10 at. % to 30 at. %. The content of O is in the range of 10 at. % to 30 at. %. The hydrophobic alloy film has a quasicrystal structure and nanoparticles.

Abstract: A heat dissipation module adapted to perform heat dissipation on a heat generating component is provided. The heat dissipation module includes a graphite sheet and an insulating and heat conducting layer. The graphite sheet includes a plurality of through holes, an attaching surface and a heat dissipating surface opposite to the attaching surface, wherein the attaching surface is configured to be attached to the heat generating component. Each of the through holes penetrates the graphite sheet, so the attaching surface and the heat dissipating surface are connected via the through holes. The insulating and heat conducting layer covers the graphite sheet. The insulating and heat conducting layer least covers the attaching surface, the heat dissipating surface and inner walls of the through holes.

Abstract: A protected active metal electrode and a device with the electrode are provided. The protected active metal electrode includes an active metal substrate and a protection layer on a surface of the active metal substrate. The protection layer at least includes a metal thin film covering the surface of the active metal substrate and an electrically-conductive thin film covering a surface of the metal thin film. A material of the metal thin film is Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, or W. A material of the electrically-conductive thin film is selected from nitride of a metal in the metal thin film, carbide of a metal in the metal thin film, a diamond-like carbon (DLC), and a combination thereof.

Abstract: A structural material of diamond like carbon (DLC) composite layers is provided. The structural material includes a composite material which is consisted of a metal layer, a first metal nitride layer, and a DLC thin film. The metal layer includes aluminum (Al), copper (Cu), zirconium (Zr), nickel (Ni), or vanadium (V). The first metal nitride layer includes aluminum nitride (Al—N), zirconium nitride (Zr—N), vanadium nitride (V—N), or nickel nitride (Ni—N). The DLC thin film of the structural material of DLC composite layers has high quality tetragonally bonded amorphous carbon (ta-C) with a sp3(C—C) bonding ratio of more than 30%. Therefore, it is suitable for the work pieces in the mechanical, chemical, electricity, photoelectric, and heat transfer fields.

Abstract: A structural material of diamond like carbon (DLC) composite layers is provided. The structural material includes a composite material which is consisted of a metal layer, a first metal nitride layer, and a DLC thin film. The metal layer includes aluminum (Al), copper (Cu), zirconium (Zr), nickel (Ni), or vanadium (V). The first metal nitride layer includes aluminum nitride (Al—N), zirconium nitride (Zr—N), vanadium nitride (V—N), or nickel nitride (Ni—N). The DLC thin film of the structural material of DLC composite layers has high quality tetragonally bonded amorphous carbon (ta-C) with a sp3(C—C) bonding ratio of more than 30%. Therefore, it is suitable for the work pieces in the mechanical, chemical, electricity, photoelectric, and heat transfer fields.