Patents by Inventor JIA-JHEN CHEN

JIA-JHEN CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor manufacturing apparatus and method thereof
    Patent number: 9768080
    Abstract: A semiconductor manufacturing method includes several operations. One operation is catching an image of a predetermined location on a surface of a pad installed in a chemical mechanical polishing (CMP) apparatus by a surface detector. One operation is transferring the image of the predetermined location to a processor. One operation is calculating a surface roughness value of the predetermined location from the image. One operation is comparing the surface roughness value with a threshold value by the processor to determine if the surface roughness condition at the predetermined location is smaller than the threshold value, and the surface is configured for polishing a to-be-polished surface of a wafer.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: September 19, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD
    Inventors: Jia-Jhen Chen, Sheng-Chen Wang, Feng-Inn Wu
  • SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD THEREOF
    Publication number: 20150170978
    Abstract: A semiconductor manufacturing method includes several operations. One operation is catching an image of a predetermined location on a surface of a pad installed in a chemical mechanical polishing (CMP) apparatus by a surface detector. One operation is transferring the image of the predetermined location to a processor. One operation is calculating a surface roughness value of the predetermined location from the image. One operation is comparing the surface roughness value with a threshold value by the processor to determine if the surface roughness condition at the predetermined location is smaller than the threshold value, and the surface is configured for polishing a to-be-polished surface of a wafer.
    Type: Application
    Filed: December 18, 2013
    Publication date: June 18, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD
    Inventors: JIA-JHEN CHEN, SHENG-CHEN WANG, FENG-INN WU