Abstract: A floral lighting system that combines creative floral arrangements with lights is revealed. The floral lighting system includes a carrier, at least one floral unit, at least one light emitting diode (LED) module and a power supply. The floral unit is connected to the carrier to form a creative floral arrangement. The LED module includes at least one wire unit that is wound around or inserted into the floral unit for integrally connected to the floral unit. An external electronic device is used to control functions of the LED module such as light color, power on/off, lighting pattern, etc. wirelessly so that the LED module arranged at the creative floral arrangement on the carrier provides various kinds of dynamic lighting. The floral lighting system overcomes the shortcomings of conventional flower lights such as limited styles, dull lighting, etc.

Abstract: A method for packaging a wafer is provided, which includes: providing a bare wafer; forming a plurality of through silicon vias across through the bare wafer, the through silicon vias being filled with a conducting metal; forming a redistribution layer on the bare wafer, the redistribution layer being connected to each of the through silicon vias; performing a chemical mechanical polishing process to planarize a surface of the bare wafer; performing a wafer forming process to treat the planarized bare wafer; forming a metal layer on the wafer after processed; forming a plurality of connection pads on the metal layer, the connection pads being respectively electrically connected to their corresponding through silicon vias; forming a passivation layer on the metal layer; and forming a plurality of solder balls or metal bumps on a backside surface of the wafer through which the processed wafer is electrically connected to a substrate.

Abstract: A method of preventing oxidation of a metal is disclosed. The method includes: placing a metal piece in a vacuum container; injecting hydrogen gas into the vacuum container; heating the metal piece placed in the vacuum container up to 200° C.; cooling the vacuum container and discharging the hydrogen gas; removing the metal piece from the vacuum container; and placing the metal piece in an oxygen-containing environment. An additional inorganic film or organic film is not needed to be used for blocking the oxygen from contacting the metal.

Abstract: A light emitting diode display device includes a circuit board and a plurality of pixel units. Each pixel unit includes a light emitting diode assembly positioned on and electrically connected to the circuit board, and a light-mixed component positioned on a side of the light emitting diode assembly configured for mixing lights emitted from the light emitting diode assembly to generate a mixed light beam.

Abstract: A display apparatus includes a display system and a control system. The display system includes pixel units and a network interface based on a network protocol. The pixel units are arranged in a matrix and each of the pixel units includes solid state light emitting elements. The control system includes a control module, an input module, and an output module. The output module is electronically coupled to the network interface. The control system is configured to receive an input signal through the input module, generate a corresponding control signal by the control module, and output the control signal by the output module to the display system via the network interface according to the network protocol to control the display contents of the display system.