Patents by Inventor Jia JUIN CHAN

Jia JUIN CHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11701903
    Abstract: A printer has a lower module and upper module. The lower module has a paper feed unit and a printing unit. A back of the upper module is hinged to lower module. A paper handling part holds paper after printing by the printing unit. A discharge unit in the upper module moves the paper out of the upper module while maintaining a hold on a rear portion of the paper and to draw the paper back into the upper module after an elapse of time. A container includes a support member that rotates into contact with and moves away from a lower part of the upper module. The container configured to receive and store the paper that has been drawn back by the discharge unit. The paper is stored in a region between the support member and the lower part of the upper module.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: July 18, 2023
    Assignee: Toshiba Tec Kabushiki Kaisha
    Inventors: Kok Wei Lee, Kenji Eoka, Ting Yee Chin, Jia Juin Chan
  • Publication number: 20230001716
    Abstract: A printer has a lower module and upper module. The lower module has a paper feed unit and a printing unit. A back of the upper module is hinged to lower module. A paper handling part holds paper after printing by the printing unit. A discharge unit in the upper module moves the paper out of the upper module while maintaining a hold on a rear portion of the paper and to draw the paper back into the upper module after an elapse of time. A container includes a support member that rotates into contact with and moves away from a lower part of the upper module. The container configured to receive and store the paper that has been drawn back by the discharge unit. The paper is stored in a region between the support member and the lower part of the upper module.
    Type: Application
    Filed: April 20, 2022
    Publication date: January 5, 2023
    Inventors: Kok WEI LEE, Kenji EOKA, Ting YEE CHIN, Jia JUIN CHAN