Abstract: A method of forming a three dimensional integrated circuit (3DIC) structure includes forming a first inter-layer via which connects at a location of a first device layer, wherein the first inter-layer via has a footprint that is at least one factor of ten smaller than a footprint of a first circuit region. The method further includes forming a first conductive segment in a second device layer, different from the first device layer, wherein the first conductive segment electrically connects to the first inter-layer via.

Abstract: A method (of forming a three dimensional integrated circuit (3DIC) structure) includes: forming an interconnection layer including forming a first inter-layer via which connects at a first predetermined location to a first circuit region of a first device layer and which has a footprint that is at least one factor of ten smaller than a footprint of the first circuit region; and forming a first conductive segment in a first metallization layer of a second device layer so as to align with and thereby connect to the first inter-layer via.

Abstract: A method (of forming a three dimensional integrated circuit (3DIC) structure) includes: forming an interconnection layer including forming a first inter-layer via which connects at a first predetermined location to a first circuit region of a first device layer and which has a footprint that is at least one factor of ten smaller than a footprint of the first circuit region; and forming a first conductive segment in a first metallization layer of a second device layer so as to align with and thereby connect to the first inter-layer via.

Abstract: A system (including a processor and memory with computer program code) that is configured to execute a method which includes generating the layout diagram including: selecting a circuit cell which includes an active element; bundling, for purposes of placement, the circuit cell and an inter-layer via together as an integral unit; placing the integral unit of the circuit cell and the inter-layer via in a first device layer of the layout diagram; and placing a metal pattern in a second device layer of the layout diagram; and wherein the placing the integral unit of the circuit cell and the inter-layer via forms a direct electrical connection channel between the circuit cell and the metal pattern.

Abstract: A system (including a processor and memory with computer program code) that is configured to execute a method which includes generating the layout diagram including: selecting a circuit cell which includes an active element; bundling, for purposes of placement, the circuit cell and an inter-layer via together as an integral unit; placing the integral unit of the circuit cell and the inter-layer via in a first device layer of the layout diagram; and placing a metal pattern in a second device layer of the layout diagram; and wherein the placing the integral unit of the circuit cell and the inter-layer via forms a direct electrical connection channel between the circuit cell and the metal pattern.

Abstract: A computer implemented layout method for an integrated circuit (IC) structure and IC structure are provided. Such a method includes: placing a power supply rail pattern in a first device layer of the IC; bundling, for purposes of placement, a voltage level shifter and one or more inter-layer vias together as an integral unit; and placing the integral unit in the first device layer of the IC design such that one or more metal line patterns in the voltage level shifter are located parallel to albeit without overlapping the power supply rail pattern. The placing the integral unit forms a direct electrical connection channel between the voltage level shifter and a metal pattern in a second device layer of the IC design. At least one of the placing operations is performed using a layout generating machine.

Abstract: A computer implemented layout method for an integrated circuit (IC) structure and IC structure are provided. Such a method includes: placing a power supply rail pattern in a first device layer of the IC; bundling, for purposes of placement, a voltage level shifter and one or more inter-layer vias together as an integral unit; and placing the integral unit in the first device layer of the IC design such that one or more metal line patterns in the voltage level shifter are located parallel to albeit without overlapping the power supply rail pattern. The placing the integral unit forms a direct electrical connection channel between the voltage level shifter and a metal pattern in a second device layer of the IC design. At least one of the placing operations is performed using a layout generating machine.

Abstract: A computer implemented layout method for an integrated circuit (IC) structure and IC structure are provided. The layout method can include placing a circuit cell and an inter-layer via together in a first device layer of the IC structure, and placing a metal pattern in a second device layer of the IC structure. The inter-layer via and the metal pattern may be configured to form a direct connection channel for the circuit cell and the metal pattern.

Abstract: A computer implemented layout method for an integrated circuit (IC) structure and IC structure are provided. The layout method can include placing a circuit cell and an inter-layer via together in a first device layer of the IC structure, and placing a metal pattern in a second device layer of the IC structure. The inter-layer via and the metal pattern may be configured to form a direct connection channel for the circuit cell and the metal pattern.

Abstract: Disclosed herein is a method for dividing an integrated circuit (IC) design into several circuit partitions, each including one or more circuit modules, and then separately carrying out placement and routing for each circuit partition, with each partition being implemented within a separate area of an IC substrate. The method initially generates a whole-chip trial placement that tends to cluster cells of each circuit module together. An IC substrate floor plan assigning modules to various partitions is prepared, with the size, shape and relative position of each partition being determined by size, shape and relative position of areas of the substrate occupied by those modules in the trial floor plan. A trial routing is also performed with information on which to base a pin assignment plan for each module. A detailed placement and routing process is then independently performed for each partition, with placement and routing of cells within each partition constrained by the floor plan and pin assignment plan.