Patents by Inventor Jia-Ming LEE

Jia-Ming LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240174716
    Abstract: The present invention relates to transporter peptides that can bind to a transferrin receptor (TfR). The transporter peptides can be conjugated covalently or noncovalently to an effector agent to form a transporter peptide conjugate, or a nucleic acid encoding the transporter peptides and an effector agent is expressed to form a recombinant transporter peptide conjugate. The transporter peptide conjugate and the recombinant transporter peptide conjugate deliver the effector agent to a target by binding to a TfR. Binding of the transporter peptides to transferrin receptors on cells of a tissue barrier induces transcytosis of the cells, thereby transporting the transporter peptide conjugate across the tissue barrier. The transporter peptides can serve as a drug delivery system and used for treatment of central nervous system (CNS) diseases.
    Type: Application
    Filed: November 6, 2023
    Publication date: May 30, 2024
    Inventors: Jia-Ming CHANG, Yi-RU LEE
  • Patent number: 11967504
    Abstract: A method includes removing a first dummy gate structure to form a recess around a first nanostructure and a second nanostructure; depositing a sacrificial layer in the recess with a flowable chemical vapor deposition (CVD); and patterning the sacrificial layer to leave a portion of the sacrificial layer between the first nanostructure and the second nanostructure. The method further include depositing a first work function metal in first recess; removing the first work function metal and the portion of the sacrificial layer from the recess; depositing a second work function metal in the recess, wherein the second work function metal is of an opposite type than the first work function metal; and depositing a fill metal over the second work function metal in the recess.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsin-Yi Lee, Jia-Ming Lin, Kun-Yu Lee, Chi On Chui
  • Patent number: 11946569
    Abstract: An actuating and sensing module is disclosed and includes a bottom plate, a gas pressure sensor, a thin gas transportation device and a cover plate. The bottom plate includes a pressure relief orifice, a discharging orifice and a communication orifice. The gas pressure sensor is disposed on the bottom plate and seals the communication orifice. The thin gas transportation device is disposed on the bottom plate and seals the pressure relief orifice and the discharging orifice. The cover plate is disposed on the bottom plate and covers the gas pressure sensor and the thin gas-transportation device. The cover plate includes an intake orifice. The thin gas transportation device is driven to inhale gas through the intake orifice, the gas is then discharged through the discharging orifice by the thin gas transportation device, and a pressure change of the gas is sensed by the gas pressure sensor.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: April 2, 2024
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Shih-Chang Chen, Jia-Yu Liao, Hung-Hsin Liao, Chung-Wei Kao, Chi-Feng Huang, Yung-Lung Han, Chang-Yen Tsai, Wei-Ming Lee
  • Patent number: 10879054
    Abstract: A processing apparatus is provided. The processing apparatus includes a wafer processing chamber. The processing apparatus further includes a pump configured to evacuate the wafer processing chamber. The pump includes an inlet port located on a lower boundary plane. The processing apparatus also includes an exhaust conduit placed in fluid communication with the gas outlet of the wafer processing chamber and the inlet port of the pump. The exhaust conduit includes a sacrificial tube structure. The sacrificial tube structure is arranged in such a way that a projection of the sacrificial tube structure on the lower boundary plane overlaps the inlet port of the pump.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: December 29, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shian-Hung Su, Chen-Yung Wang, Jia-Ming Lee
  • Publication number: 20190157050
    Abstract: A processing apparatus is provided. The processing apparatus includes a wafer processing chamber. The processing apparatus further includes a pump configured to evacuate the wafer processing chamber. The pump includes an inlet port located on a lower boundary plane. The processing apparatus also includes an exhaust conduit placed in fluid communication with the gas outlet of the wafer processing chamber and the inlet port of the pump. The exhaust conduit includes a sacrificial tube structure. The sacrificial tube structure is arranged in such a way that a projection of the sacrificial tube structure on the lower boundary plane overlaps the inlet port of the pump.
    Type: Application
    Filed: April 27, 2018
    Publication date: May 23, 2019
    Inventors: Shian-Hung SU, Chen-Yung WANG, Jia-Ming LEE
  • Publication number: 20180366605
    Abstract: A solar power sunroof device having a low reflectance is for receiving and reflecting a solar ray and a visible ray. A substrate is illuminated by the solar ray. A front contact layer has a first upper connecting surface and a first lower connecting surface. The first upper connecting surface is connected to the substrate. A photoelectric conversion layer is connected between the first lower connecting surface and a back contact layer. A low reflective layer has a third upper connecting surface and a third lower connecting surface. The third upper connecting surface is connected to the back contact layer, and the third lower connecting surface has a visible light reflectance. The visible ray illuminates the third lower connecting surface of the low reflective layer, and the third lower connecting surface scatters or absorbs the visible ray so as to decrease the visible light reflectance.
    Type: Application
    Filed: June 13, 2018
    Publication date: December 20, 2018
    Inventors: Yung-Lin CHEN, Jia-Ming LEE, Chia-Ling LEE, Cheng-Yi CHOU
  • Publication number: 20180062010
    Abstract: An arc-bending translucent assembly is disclosed in the present disclosure. The arc-bending translucent assembly includes a first substrate and a second substrate. The first substrate has a first thickness and a second thickness at two sides thereof. The first substrate further includes a first arc surface and a second arc surface, in which a third thickness exists between a first top of the first arc surface and a second top of the second arc surface. The third thickness is larger than the first thickness or the second thickness. The second substrate is bent and disposed close to the second arc surface of the first substrate.
    Type: Application
    Filed: August 30, 2017
    Publication date: March 1, 2018
    Inventors: Chia-Ling LEE, Yung-Lin CHEN, Jia-Ming LEE