Abstract: Disclosure is a multi-objective semiconductor product capacity planning system and method thereof. The system comprises a data input module, a capacity planning module and a computing module. The machine information of the production stations, the product information and the order information are input by the data input module. According to the demand quantity of order, capacity information and product information, the capacity planning module plans a capacity allocation to determine the satisfied quantity of orders. The capacity allocation information is used to form a gene combination by chromosome encoding method. The computing module calculates the gene combination several times to generate numerous candidate solutions by a multi-objective genetic algorithm. The numerous candidate solutions sorts out and generates a new gene combination, and repeats the calculation to form candidate solution set until stop condition is satisfied.

Abstract: Disclosure is a multi-objective semiconductor product capacity planning system and method thereof. The system comprises a data input module, a capacity planning module and a computing module. The machine information of the production stations, the product information and the order information are input by the data input module. According to the demand quantity of order, capacity information and product information, the capacity planning module plans a capacity allocation to determine the satisfied quantity of orders. The capacity allocation information is used to form a gene combination by chromosome encoding method. The computing module calculates the gene combination several times to generate numerous candidate solutions by a multi-objective genetic algorithm. The numerous candidate solutions sorts out and generates a new gene combination, and repeats the calculation to form candidate solution set until stop condition is satisfied.

Abstract: Disclosure is a resource planning system and method for classification products. The system comprises an input module and a planning module. The input module is used to receive wafer information, manufacturing process information, classification product information and order information. The wafer information comprises a wafer purchasing cost and a wafer inventory cost; the manufacturing process information comprises a production distribution and a production cost for the manufacturing process; the classification product information comprises a classification product inventory cost; the order information comprises a sale amount of customer orders and a penalty cost by unmet orders. The planning module calculates a profit by deducting the wafer purchasing cost, the production cost, the wafer inventory cost, the classification product inventory cost and the penalty cost from the sale amount. The profit gets the maximum value by planning resource allocation of each module.