Abstract: A memory device includes a channel element, a memory element, and an electrode element. The channel element includes a first channel portion, a second channel portion, and a middle channel portion between the first channel portion and the second channel portion. The first channel portion has a first sidewall channel surface and a second sidewall channel surface opposing to the first sidewall channel surface. The middle channel portion has a third sidewall channel surface and a fourth sidewall channel surface opposing to the third sidewall channel surface. The first sidewall channel surface and the second sidewall channel surface of the first channel portion are outside the third sidewall channel surface and the fourth sidewall channel surface of the middle channel portion respectively. A memory cell is defined in the memory element between the channel element and the electrode element.

Abstract: A memory device and a method for manufacturing the same are provided. A memory device includes a drain pillar structure, a source pillar structure, a charge trapping structure, a vertical channel structure and a gate structure. The drain pillar structure is formed in a first opening. The source pillar structure is formed in a second opening. The vertical channel structure and the vertical channel structure are formed in a hole partially overlapping the first opening and the second opening. The vertical channel structure is divided into two arc channel parts by the drain pillar structure and the source pillar structure. The gate structure surrounds the drain pillar structure, the source pillar structure and the vertical channel structure.

Abstract: A memory device includes a channel element, a memory element, and an electrode element. The channel element has an open ring shape. A memory cell is defined in the memory element between the channel element and the electrode element.

Abstract: A memory device and a method for manufacturing the same are provided. A memory device includes a drain pillar structure, a source pillar structure, a charge trapping structure, a vertical channel structure and a gate structure. The drain pillar structure is formed in a first opening. The source pillar structure is formed in a second opening. The vertical channel structure and the vertical channel structure are formed in a hole partially overlapping the first opening and the second opening. The vertical channel structure is divided into two arc channel parts by the drain pillar structure and the source pillar structure. The gate structure surrounds the drain pillar structure, the source pillar structure and the vertical channel structure.

Abstract: A stack of sacrificial layers is formed in a set of N levels. A first etch-trim mask having spaced apart first and second open etch regions is formed over the set. Two levels are etched through using the first etch-trim mask in each of M etch-trim cycles, where M is (N?1)/2 when N is odd and (N/2)?1 when N is even. One level is etched through using the first etch-trim mask in one etch-trim cycle when N is even. The first etch-trim mask is trimmed to increase the size of the first and second open etch regions, in each of etch-trim cycles C(i) for i going from 1 to T?1, where T is (N?1)/2 when N is odd and N/2 when N is even. A second etch mask is formed over the set, covering one of the open etch regions. One level is etched through using the second etch mask.

Abstract: A memory device includes a channel element, a memory element, and an electrode element. The channel element has an open ring shape. A memory cell is defined in the memory element between the channel element and the electrode element.

Abstract: A memory device includes a channel element, a memory element, and an electrode element. The channel element includes a first channel portion, a second channel portion, and a middle channel portion between the first channel portion and the second channel portion. The first channel portion has a first sidewall channel surface and a second sidewall channel surface opposing to the first sidewall channel surface. The middle channel portion has a third sidewall channel surface and a fourth sidewall channel surface opposing to the third sidewall channel surface. The first sidewall channel surface and the second sidewall channel surface of the first channel portion are outside the third sidewall channel surface and the fourth sidewall channel surface of the middle channel portion respectively. A memory cell is defined in the memory element between the channel element and the electrode element.

Abstract: A 3D memory device includes a substrate, a plurality of conductive layers, a plurality of insulating layers, a memory layer and a channel layer. The insulating layers are alternately stacked with the conductive layers on the substrate to form a multi-layers stacking structure, wherein the multi-layers stacking structure has at least one trench penetrating through the insulating layers and the conductive layers. The memory layer covers on the multi-layers stacking structure and at least extends onto a sidewall of the trench. The cannel layer covers on the memory layer and includes an upper portion adjacent to an opening of the trench, a lower portion adjacent to a bottom of the trench and a string portion disposed on the sidewall, wherein the string portion connects the upper portion with the lower portion and has a doping concentration substantially lower than that of the upper portion and lower portion.

Abstract: A 3D memory device includes a substrate, a plurality of conductive layers, a plurality of insulating layers, a memory layer and a channel layer. The insulating layers are alternately stacked with the conductive layers on the substrate to form a multi-layers stacking structure, wherein the multi-layers stacking structure has at least one trench penetrating through the insulating layers and the conductive layers. The memory layer covers on the multi-layers stacking structure and at least extends onto a sidewall of the trench. The cannel layer covers on the memory layer and includes an upper portion adjacent to an opening of the trench, a lower portion adjacent to a bottom of the trench and a string portion disposed on the sidewall, wherein the string portion connects the upper portion with the lower portion and has a doping concentration substantially lower than that of the upper portion and lower portion.

Abstract: A memory device and a manufacturing method for the same are provided. The memory device comprises a NAND memory string. The NAND memory string includes a U-shape channel, a first inversion gate electrode and a second inversion gate electrode. The U-shape channel includes a bottom channel surface, a first outer channel sidewall and a second outer channel sidewall. The bottom channel surface is between the first outer channel sidewall and the second outer channel sidewall opposing to the first outer channel sidewall. The first inversion gate electrode is electrically coupled to the U-shape channel and is disposed under bottom channel surface. The second inversion gate electrode is electrically coupled to the U-shape channel and is disposed outside the first outer channel sidewall, and separated from the first inversion gate electrode.

Abstract: A 3D memory device includes a substrate, a multi-layers stack and a dielectric material. The substrate has a concave portion extending along a first direction into the substrate from a surface thereof. The multi-layers stack includes a plurality of conductive layers and a plurality of insulating layers alternatively stacked along the first direction on a bottom of the concave portion. The multi-layers stack also has at least one recess passing through the conductive layers and the insulating layers along the first direction, wherein the recess has a cross-sectional bottom profile and a cross-sectional opening profile perpendicular to the first direction and the cross-sectional bottom profile has a size substantially greater than that of the cross-sectional opening profile. The dielectric material is at least partially filled in the recess.

Abstract: A three-dimensional (3D) semiconductor device is provided, comprising a substrate having an array area and a staircase area adjacent to the array area, wherein the staircase area comprises N steps, N is an integer one or greater; a stack having multi-layers on the substrate, and the multi-layers comprising active layers alternating with insulating layers on the substrate, the stack comprising sub-stacks formed on the substrate and the sub-stacks disposed in relation to the N steps of the staircase area to form respective contact regions, wherein an uppermost active layer of each of the sub-stacks in the respective contact regions comprises a silicide layer; and multilayered connectors, formed in the respective contact regions and extending downwardly to electrically connect the silicide layer in each of the sub-stacks.

Abstract: A stack of sacrificial layers is formed in a set of N levels. A first etch-trim mask having spaced apart first and second open etch regions is formed over the set. Two levels are etched through using the first etch-trim mask in each of M etch-trim cycles, where M is (N?1)/2 when N is odd and (N/2)?1 when N is even. One level is etched through using the first etch-trim mask in one etch-trim cycle when N is even. The first etch-trim mask is trimmed to increase the size of the first and second open etch regions, in each of etch-trim cycles C(i) for i going from 1 to T?1, where T is (N?1)/2 when N is odd and N/2 when N is even. A second etch mask is formed over the set, covering one of the open etch regions. One level is etched through using the second etch mask.

Abstract: A 3D memory device includes a substrate, a multi-layers stack and a dielectric material. The substrate has a concave portion extending along a first direction into the substrate from a surface thereof. The multi-layers stack includes a plurality of conductive layers and a plurality of insulating layers alternatively stacked along the first direction on a bottom of the concave portion. The multi-layers stack also has at least one recess passing through the conductive layers and the insulating layers along the first direction, wherein the recess has a cross-sectional bottom profile and a cross-sectional opening profile perpendicular to the first direction and the cross-sectional bottom profile has a size substantially greater than that of the cross-sectional opening profile. The dielectric material is at least partially filled in the recess.

Abstract: A method for forming a semiconductor structure includes the following steps. First, a preliminary structure is provided. The preliminary structure has an array region. The preliminary structure includes a plurality of first stacks in the array region. Then, a first dielectric layer is formed on the first stacks. A first hard mask layer is formed on the first dielectric layer. An insulating material is formed on the first hard mask layer. Then, a planarization process stopped on the first hard mask layer is conducted. Thereafter, the first hard mask layer is removed. A second hard mask layer is formed on the first dielectric layer. A second dielectric layer is formed on the second hard mask layer. A plurality of contacts are formed through the second dielectric layer, the second hard mask layer and the first dielectric layer to the preliminary structure.

Abstract: A three-dimensional (3D) semiconductor device is provided, comprising a substrate having an array area and a staircase area adjacent to the array area, wherein the staircase area comprises N steps, N is an integer one or greater; a stack having multi-layers on the substrate, and the multi-layers comprising active layers alternating with insulating layers on the substrate, the stack comprising sub-stacks formed on the substrate and the sub-stacks disposed in relation to the N steps of the staircase area to form respective contact regions, wherein an uppermost active layer of each of the sub-stacks in the respective contact regions comprises a silicide layer; and multilayered connectors, formed in the respective contact regions and extending downwardly to electrically connect the silicide layer in each of the sub-stacks.

Abstract: A 3D memory device includes a multi-layer stack, a first contact layer, a memory layer, a cannel layer. The multi-layer stack includes a plurality of conductive layers, a first opening and a second opening. The conductive layers are vertical stacked and insulated with each other. The first opening and the second opening respectively penetrate through at least two adjacent ones of the conductive layers. The first contact layer is disposed in the first opening and electrically connecting the conductive layers penetrated by the first opening. The memory layer is disposed in the second opening. The channel layer covers on the memory layer, wherein a plurality of memory cells are formed at cross points of the channel layer, the memory layer and the conductive layers penetrated by the second opening.

Abstract: A method for forming a semiconductor structure includes the following steps. First, a preliminary structure is provided. The preliminary structure has an array region. The preliminary structure includes a plurality of first stacks in the array region. Then, a first dielectric layer is formed on the first stacks. A first hard mask layer is formed on the first dielectric layer. An insulating material is formed on the first hard mask layer. Then, a planarization process stopped on the first hard mask layer is conducted. Thereafter, the first hard mask layer is removed. A second hard mask layer is formed on the first dielectric layer. A second dielectric layer is formed on the second hard mask layer. A plurality of contacts are formed through the second dielectric layer, the second hard mask layer and the first dielectric layer to the preliminary structure.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a plurality of first stacked structures and two second stacked structures disposed on the substrate. Each of the first stacked structures includes alternately stacked metal layers and oxide layers. Each of the second stacked structures includes alternately stacked silicon nitride layers and oxide layers. The first stacked structures are disposed between the two second stacked structures.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a plurality of first stacked structures and two second stacked structures disposed on the substrate. Each of the first stacked structures includes alternately stacked metal layers and oxide layers. Each of the second stacked structures includes alternately stacked silicon nitride layers and oxide layers. The first stacked structures are disposed between the two second stacked structures.