Patents by Inventor JIA-RUEI CHANG

JIA-RUEI CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure for ultraviolet light-emitting diode
    Patent number: 10153412
    Abstract: The present embodiment discloses a package structure for ultraviolet LED, which comprises a substrate, an ultraviolet light-emitting diode (LED), and an optical device. The wavelength of the light emitted by the ultraviolet LED is between 200 and 400 nm. The optical device includes amorphous silicon dioxide, and thus enabling the transmittivity of ultraviolet light greater than 80%. In addition, by including a reflective ring and a metal film, the material aging problem of the sealing material can be prevented by blocking direct ultraviolet-light illumination. The package structure according to the present invention overcomes the limitation on planar packaging, so that the applications of backend processes can be extended.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: December 11, 2018
    Assignee: Institute of Nuclear Energy Research, Atomic Energy Council, Executive Yuan, R.O.C.
    Inventors: Zun-Hao Shih, Kai-Hsiang Yang, Jia-Ruei Chang, Hwen-Fen Hong
  • PACKAGE STRUCTURE FOR ULTRAVIOLET LIGHT-EMITTING DIODE
    Publication number: 20180047881
    Abstract: The present embodiment discloses a package structure for ultraviolet LED, which comprises a substrate, an ultraviolet light-emitting diode (LED), and an optical device. The wavelength of the light emitted by the ultraviolet LED is between 200 and 400 nm. The optical device includes amorphous silicon dioxide, and thus enabling the transmittivity of ultraviolet light greater than 80%. In addition, by including a reflective ring and a metal film, the material aging problem of the sealing material can be prevented by blocking direct ultraviolet-light illumination. The package structure according to the present invention overcomes the limitation on planar packaging, so that the applications of backend processes can be extended.
    Type: Application
    Filed: August 11, 2016
    Publication date: February 15, 2018
    Inventors: ZUN-HAO SHIH, KAI-HSIANG YANG, JIA-RUEI CHANG, HWEN-FEN HONG