Patents by Inventor Jia-Rung HO

Jia-Rung HO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package
    Patent number: 11075186
    Abstract: A semiconductor package includes a substrate, a semiconductor chip and a heat dissipation structure. The semiconductor chip includes a first surface, a second surface opposite to the first surface, and at least one chip pad disposed adjacent to the first surface. The chip pad is electrically connected to the substrate. The heat dissipation structure is disposed adjacent to the second surface of the semiconductor chip and a portion of the substrate. An area of the heat dissipation structure is greater than an area of the semiconductor chip.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: July 27, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ian Hu, Jia-Rung Ho, Jin-Feng Yang, Chih-Pin Hung, Ping-Feng Yang
  • SEMICONDUCTOR PACKAGE
    Publication number: 20180226320
    Abstract: A semiconductor package includes a substrate, a semiconductor chip and a heat dissipation structure. The semiconductor chip includes a first surface, a second surface opposite to the first surface, and at least one chip pad disposed adjacent to the first surface. The chip pad is electrically connected to the substrate. The heat dissipation structure is disposed adjacent to the second surface of the semiconductor chip and a portion of the substrate. An area of the heat dissipation structure is greater than an area of the semiconductor chip.
    Type: Application
    Filed: February 9, 2017
    Publication date: August 9, 2018
    Inventors: Ian HU, Jia-Rung HO, Jin-Feng YANG, Chih-Pin HUNG, Ping-Feng YANG