Abstract: The present invention discloses a piping system for etch equipment including an exhaust gas tube connected with an etching chamber for conveying exhaust gas out of the chamber. A cooling gas tube connected to the etching chamber allows cooling gas to flow around a back side of the wafer placed in the chamber for cooling the wafer's temperature. A cooling gas bypass tube connected between the cooling gas tube and the exhaust gas tube is used for regulating a gas flow in the cooling gas tube. Moreover, a plurality of heaters are set out of conjunctions of the cooling gas tube and cooling gas bypass tube with the exhaust gas tube so as to retard particle accumulation in the conjunctions of these tubes.

Abstract: A method for preventing corrosion and particulate in a load-lock chamber is disclosed. The load-lock chamber is adjourning with an etching chamber and a wafer transferred module, each time a wafer in the cassette is transferred into the etching chamber for etching by a transfer arm. After that, the etched wafer is withdrawn by the same way to the cassette. The load-lock chamber comprising an outlet of N2-purge tube therein for venting the vacuum in the load-lock chamber to the surrounding. The method comprising at least a step of coupling heating means to the N2-purge tube, or heating N2 gases before injecting into the N2-purge tube so that the temperature of the N2-purge tube will at least not lower than the temperature of an environment within the load-lock chamber.