Patents by Inventor Jia-Tay KUO

Jia-Tay KUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145163
    Abstract: A transformer includes a bobbin and a plurality of coils wound on the bobbin. The plurality of coils includes a first primary coil; a second primary coil, located above the first primary coil and electrically connected to the first primary coil; a secondary coil, located between the first primary coil and the second primary; a first auxiliary coil, located above the second primary coil; and a second auxiliary coil, located on the first auxiliary coil and electrically connected to the first auxiliary coil.
    Type: Application
    Filed: October 20, 2023
    Publication date: May 2, 2024
    Inventors: Chiao FU, Yi-Chao LIN, Yao-Zhong LIU, Jia-Tay KUO
  • Publication number: 20230275073
    Abstract: A package structure is provided herein, which includes a substrate, an integrated transistor, and an encapsulation structure. The integrated transistor is disposed on the substrate and includes a transistor, a capacitor, a resistor, a first Zener diode, and a second Zener diode. The transistor includes a gate, a drain, and a source. The capacitor is electrically connected to the gate, and the resistor is electrically connected to the gate. The first Zener diode includes a first anode and a first cathode electrically connected to the gate. The second Zener diode includes a second anode electrically connected to the first anode and a second cathode electrically connected to the source. The encapsulation structure encapsulates the integrated transistor. The package structure includes a gate terminal, a drain terminal, and a source terminal.
    Type: Application
    Filed: February 24, 2023
    Publication date: August 31, 2023
    Inventors: Jia-Tay KUO, Chiao FU, Sheng-Bo WANG, Chen-Yu WANG, Yao-Zhong LIU
  • Publication number: 20210273138
    Abstract: The present application discloses a light-emitting device comprises a semiconductor light-emitting element, a transparent element covering the semiconductor light-emitting element, an insulating layer which connects to the transparent element, an intermediate layer which connects to the insulating layer; and a conductive adhesive material connecting to the intermediate layer.
    Type: Application
    Filed: May 17, 2021
    Publication date: September 2, 2021
    Inventors: Chien-Liang LIU, Ming-Chi HSU, Shih-An LIAO, Jen-Chieh YU, Min-Hsun HSIEH, Jia-Tay KUO, Yu-His SUNG, Po-Chang CHEN
  • Patent number: 11011681
    Abstract: The present application discloses a light-emitting device comprises a semiconductor light-emitting element, a transparent element covering the semiconductor light-emitting element, an insulating layer which connects to the transparent element, an intermediate layer which connects to the insulating layer; and a conductive adhesive material connecting to the intermediate layer.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: May 18, 2021
    Assignee: Epistar Corporation
    Inventors: Chien-Liang Liu, Ming-Chi Hsu, Shih-An Liao, Jen-Chieh Yu, Min-Hsun Hsieh, Jia-Tay Kuo, Yu-His Sung, Po-Chang Chen
  • Patent number: 10412801
    Abstract: A light-emitting device includes a current source module having a first transistor, a first voltage control module providing a negative voltage and a second voltage control module having a second transistor. The second voltage control module is electrically connected to the current source module and the first voltage control module.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: September 10, 2019
    Assignee: EPISTAR CORPORATION
    Inventors: Chao-Kai Chang, Yi-Chao Lin, Chang-Hseih Wu, Jia-Tay Kuo
  • Publication number: 20150129919
    Abstract: The present application discloses a light-emitting device comprises a semiconductor light-emitting element, a transparent element covering the semiconductor light-emitting element, an insulating layer which connects to the transparent element, an intermediate layer which connects to the insulating layer; and a conductive adhesive material connecting to the intermediate layer.
    Type: Application
    Filed: November 14, 2014
    Publication date: May 14, 2015
    Inventors: Chien-Liang LIU, Ming-Chi HSU, Shih-An LIAO, Jen-Chieh YU, Min-Hsun HSIEH, Jia-Tay KUO, Yu-His SUNG, Po-Chang CHEN