Patents by Inventor Jia Tow

Jia Tow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150037593
    Abstract: There is a method for forming a laminated product having a first substrate and a second substrate. The method may comprise applying a liquid adhesive on a surface of the first substrate for bonding the first substrate to the second substrate. The liquid adhesive located on a circumferential periphery of the first substrate for limiting movement of the liquid adhesive within the circumferential adhesive wall structure. Pressure may be applied on a bond area between the first substrate and the second substrate in a vacuum environment to incrementally increase the bond area between the first substrate and the second substrate to incrementally bond the first substrate to the second substrate. The liquid adhesive may be cured to bond the first and second substrates.
    Type: Application
    Filed: November 22, 2012
    Publication date: February 5, 2015
    Applicants: 3M Innovative Properties Company, Trimech Technology PTE. LTD.
    Inventors: Wee Hock Chan, Xinhe Chen, Jia Tow, Chin Teong Ong, Yi Lin Sim