Patents by Inventor Jia-Wei Pan

Jia-Wei Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC PACKAGE
    Publication number: 20210280530
    Abstract: Provided is an electronic package, including a multi-chip packaging body with a plurality of electronic elements and a stress buffer layer disposed on the multi-chip packaging body. The stress buffer layer is in contact with the plurality of electronic elements so as to cause stresses to be evenly distributed in the stress buffer layer instead of being concentrated in specific areas, thereby preventing structural stresses from being concentrated in corners of the electronic elements.
    Type: Application
    Filed: May 18, 2020
    Publication date: September 9, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chi-Jen Chen, Chih-Hsun Hsu, Chee-Key Chung, Jia-Wei Pan, Chang-Fu Lin
  • Electronic package and semiconductor substrate
    Patent number: 9899309
    Abstract: A semiconductor substrate is provided, including a substrate body having a lateral surface, and a protruding structure extending outward from the lateral surface. The semiconductor substrate distributes stresses generated during a manufacturing process through the protruding structure, and is thus prevented from delamination or being cracked. An electronic package having the semiconductor substrate is also provided.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: February 20, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Shih-Ching Chen, Shih-Liang Peng, Chieh-Lung Lai, Jia-Wei Pan, Chang-Lun Lu
  • ELECTRONIC PACKAGE AND SEMICONDUCTOR SUBSTRATE
    Publication number: 20170256481
    Abstract: A semiconductor substrate is provided, including a substrate body having a lateral surface, and a protruding structure extending outward from the lateral surface. The semiconductor substrate distributes stresses generated during a manufacturing process through the protruding structure, and is thus prevented from delamination or being cracked. An electronic package having the semiconductor substrate is also provided.
    Type: Application
    Filed: March 30, 2016
    Publication date: September 7, 2017
    Inventors: Shih-Ching Chen, Shih-Liang Peng, Chieh-Lung Lai, Jia-Wei Pan, Chang-Lun Lu