Patents by Inventor Jia-Wen Chen

Jia-Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7964420
    Abstract: An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: June 21, 2011
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Ping-Chou Yang, Jia-Wen Chen
  • Patent number: 7876593
    Abstract: An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.
    Type: Grant
    Filed: October 1, 2008
    Date of Patent: January 25, 2011
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Ping-Chou Yang, Jia-Wen Chen
  • Publication number: 20110003409
    Abstract: An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.
    Type: Application
    Filed: September 7, 2010
    Publication date: January 6, 2011
    Applicant: HARVATEK CORPORATION
    Inventors: BILY WANG, PING-CHOU YANG, JIA-WEN CHEN
  • Publication number: 20090316315
    Abstract: An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.
    Type: Application
    Filed: October 1, 2008
    Publication date: December 24, 2009
    Applicant: HARVATEK CORPORATION
    Inventors: BILY WANG, PING-CHOU YANG, JIA-WEN CHEN
  • Patent number: 6336931
    Abstract: An automatic bone drilling apparatus for surgery operation uses a computer to control a hand tool drilling device to drill opening in skeleton. The computer has a fuzzy logic software to control the hand tool operation through a control box and a manual-automatic mode switch box. The hand tool drilling device may be securely mounted on the patient. Drilling location and size and depth may be precisely controlled to enhance surgical operation safety. It is particularly useful for drilling patient skeleton for brain surgery operation.
    Type: Grant
    Filed: May 17, 2000
    Date of Patent: January 8, 2002
    Inventors: Yeh-Liang Hsu, Shih-Tseng Lee, Chong-Fai Wang, Jia-Wen Chen, Hao-Wei Lin, Tsung-Cheng Huang
  • Patent number: D595674
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: July 7, 2009
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Chao-Yuan Huang, Ping-Chou Yang, Jia-Wen Chen, Hsiu-Wen Wang
  • Patent number: D595675
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: July 7, 2009
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Chao-Yuan Huang, Ping-Chou Yang, Jia-Wen Chen, Hsiu-Wen Wang