Patents by Inventor JIA WUN CHEN

JIA WUN CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultrasonic tactile sensor for detecting clamping force
    Patent number: 10239212
    Abstract: An ultrasonic tactile sensor for detecting a clamping force includes an ultrasonic detector and a sensing layer, and the sensing layer includes a first soft layer and a second soft layer, and the first soft layer has plural spherical microstructures arranged in contact with the ultrasonic detector, so that after a pressure is applied to the sensing layer, the ultrasonic detector generates an ultrasonic wave and receives a reflected wave signal, and the signal is provided for identifying the contact area of the spherical microstructures and deriving the force exerted on the tactile sensor.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: March 26, 2019
    Assignee: Southern Taiwan University of Science and Technology
    Inventors: Cheng Hsin Chuang, Jia Wun Chen
  • ULTRASONIC TACTILE SENSOR FOR DETECTING CLAMPING FORCE
    Publication number: 20180099414
    Abstract: An ultrasonic tactile sensor for detecting a clamping force includes an ultrasonic detector and a sensing layer, and the sensing layer includes a first soft layer and a second soft layer, and the first soft layer has plural spherical microstructures arranged in contact with the ultrasonic detector, so that after a pressure is applied to the sensing layer, the ultrasonic detector generates an ultrasonic wave and receives a reflected wave signal, and the signal is provided for identifying the contact area of the spherical microstructures and deriving the force exerted on the tactile sensor.
    Type: Application
    Filed: October 7, 2016
    Publication date: April 12, 2018
    Inventors: CHENG HSIN CHUANG, JIA WUN CHEN
  • Part of lathe
    Patent number: D884756
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: May 19, 2020
    Assignee: BUCCI AUTOMATIONS S.P.A.
    Inventors: Jia Wun Chen, Andrea Drei