Patent number: 12284793
Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
Type:
Grant
Filed:
December 23, 2020
Date of Patent:
April 22, 2025
Assignee:
Intel Corporation
Inventors:
Ritu Bawa, Ruander Cardenas, Kathiravan D, Jia Yan Go, Chin Kung Goh, Jeff Ku, Prakash Kurma Raju, Baomin Liu, Twan Sing Loo, Mikko Makinen, Columbia Mishra, Juha Paavola, Prasanna Pichumani, Daniel Ragland, Kannan Raja, Khal Ern See, Javed Shaikh, Gokul Subramaniam, George Baoci Sun, Xiyong Tian, Hua Yang, Mark Carbone, Vivek Paranjape, Nehakausar Pinjari, Hari Shanker Thakur, Christopher Moore, Gustavo Fricke, Justin Huttula, Gavin Sung, Sammi Wy Liu, Arnab Sen, Chun-Ting Liu, Jason Y. Jiang, Gerry Juan, Shih Wei Nien, Lance Lin, Evan Kuklinski
Publication number: 20250110072
Abstract: Disclosed are a doped colloidal metal oxide quantum wire and a preparation method thereof, a gas sensor, a gas sensor array, and use thereof, which relate to the technical field of gas sensors. In the preparation method, a main metal precursor, a doped metal precursor, an alcohol solvent, and a fatty acid surfactant are mixed, and a resulting mixture is subjected to a solvothermal reaction, to obtain the doped colloidal metal oxide quantum wire, wherein a main metal element in the main metal precursor is selected from Sn, Zn, W, In, Mo, Fe, Co, Ni, and Cu; a doped metal element in the doped metal precursor is selected from V, Nb, Ta, Cr, Mo, W, Mn, Fe, Co, Ni and Cu; the doped metal element is different from the main metal element; and the solvothermal reaction is performed at a temperature of 150-300° C.
Type:
Application
Filed:
March 28, 2023
Publication date:
April 3, 2025
Applicant:
JIANGSU UNIVERSITY
Inventors:
Zhilong SONG, Jia YAN, Hui XU, Huaming LI
Publication number: 20230337406
Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
Type:
Application
Filed:
December 23, 2020
Publication date:
October 19, 2023
Inventors:
Ritu BAWA, Ruander CARDENAS, Kathiravan D, Jia Yan GO, Chin Kung GOH, Jeff KU, Prakash Kurma RAJU, Baomin LIU, Twan Sing LOO, Mikko MAKINEN, Columbia MISHRA, Juha PAAVOLA, Prasanna PICHUMANI, Daniel RAGLAND, Kannan RAJA, Khai Ern SEE, Javed SHAIKH, Gokul SUBRAMANIAM, George Baoci SUN, Xiyong TIAN, Hua YANG, Mark CARBONE, Vivek PARANJAPE, Nehakausar PINJARI, Hari Shanker THAKUR, Christopher MOORE, Gustavo FRICKE, Justin HUTTULA, Gavin SUNG, Sammi WY LIU, Arnab SEN, Chun-Ting LIU, Jason Y. JIANG, Gerry JUAN, Shih Wei NIEN, Lance LIN, Evan KUKLINSKI