Abstract: Automated material welding including starting a welding operation, scanning a weld in-progress, creating a simulation of the weld in-progress, detecting a flaw in the weld in-progress according to the scanning and the simulation, remediating the weld in-progress, and completing the welding operation.

Abstract: A driver device may comprise a housing and a hole located on the housing. The hole may comprise a sealing lip. The driver device may comprise a bit holder located within the housing, and a bit socket located on the bit holder. The bit socket may be aligned with the hole, such that inserting a bit into the bit socket also inserts the bit into the hole. The driver device may comprise a spring located within the bit socket. The spring may cause an inserted bit to partially exit the hole in the absence of an external force pushing the it against the spring. The driver device may comprise a vacuum component connected to the housing, and a vacuum chamber within the housing.

Abstract: A method of forming solder paste on an object is provided. The method includes providing a multilayered stencil, each stencil layer having an aperture formed therethrough from a top surface of the respective stencil layer to a bottom surface of the stencil layer. The method also includes applying the stencil to a surface of the object. The method also includes filling a void space formed by a combination of the apertures in the stencil layers with solder paste. The method also includes removing the stencil layers in a sequential manner to leave the solder paste.

Abstract: A driver device comprises a housing and a driving-bit socket in the housing. The driver device may comprise a first guide-leg track on the housing. A first guide leg may be inserted into the first guide leg track. The driver device may also comprise a first guide-leg foot at an end of the first guide leg. The first guide-leg foot may be configured to interface with a surface of the driving recipient. The first guide leg may retract into the first guide-leg track as the driver device drives a driving object into the driving recipient.

Abstract: A driver device comprises a housing and a driving-bit socket in the housing. The driver device may comprise a first guide-leg track on the housing. A first guide leg may be inserted into the first guide leg track. The driver device may also comprise a first guide-leg foot at an end of the first guide leg. The first guide-leg foot may be configured to interface with a surface of the driving recipient. The first guide leg may retract into the first guide-leg track as the driver device drives a driving object into the driving recipient.

Abstract: A driver device may comprise a housing and a hole located on the housing. The hole may comprise a sealing lip. The driver device may comprise a bit holder located within the housing, and a bit socket located on the bit holder. The bit socket may be aligned with the hole, such that inserting a bit into the bit socket also inserts the bit into the hole. The driver device may comprise a spring located within the bit socket. The spring may cause an inserted bit to partially exit the hole in the absence of an external force pushing the it against the spring. The driver device may comprise a vacuum component connected to the housing, and a vacuum chamber within the housing.

Abstract: A method of forming solder paste on an object is provided. The method includes providing a multilayered stencil, each stencil layer having an aperture formed therethrough from a top surface of the respective stencil layer to a bottom surface of the stencil layer. The method also includes applying the stencil to a surface of the object. The method also includes filling a void space formed by a combination of the apertures in the stencil layers with solder paste. The method also includes removing the stencil layers in a sequential manner to leave the solder paste.

Abstract: Automated material welding including starting a welding operation, scanning a weld in-progress, creating a simulation of the weld in-progress, detecting a flaw in the weld in-progress according to the scanning and the simulation, remediating the weld in-progress, and completing the welding operation.

Abstract: Technical solutions are described for testing a light emitting diode (LED) device. An example method includes driving, by a controller, a filter unit to filter a light from the LED device using a first filter. The method further includes, in response to a sensor not receiving a measurable signal because of the first filter, driving, by the controller, the filter unit to filter the light using a second filter. Further, in response to the sensor not receiving the measureable signal because of the second filter, the method includes outputting an indication that the LED device is rejected. Further, in response to the sensor receiving the measureable signal, the method includes outputting an indication that the LED device is of a color representative of the second filter.

Abstract: Technical solutions are described for testing a light emitting diode (LED) device. An example method includes driving, by a controller, a filter unit to filter a light from the LED device using a first filter. The method further includes, in response to a sensor not receiving a measurable signal because of the first filter, driving, by the controller, the filter unit to filter the light using a second filter. Further, in response to the sensor not receiving the measureable signal because of the second filter, the method includes outputting an indication that the LED device is rejected. Further, in response to the sensor receiving the measureable signal, the method includes outputting an indication that the LED device is of a color representative of the second filter.