Abstract: An optical module includes an upper shell, a lower shell, a circuit board, a fixing frame, a light source emitter, a first optical fiber, a modulation chip, and a circuit sub-board. The lower shell is covered with the upper shell to form a mounting cavity. The circuit board is disposed in the mounting cavity. The light source emitter is fixedly connected to the fixing frame and configured to emit a light beam. The modulation chip is connected to the light source emitter through the first optical fiber and configured to load a signal into the light beam emitted by the light source emitter to form an optical signal. The circuit sub-board is disposed on a side of the circuit board proximate to the upper shell and fixedly connected to the fixing frame. The circuit sub-board is electrically connected to the circuit board and the light source emitter.

Abstract: An optical module including: a first circuit board; a second circuit board; a light emitting component, arranged above the first circuit board and electrically connected to a first and a second flexible circuit board and a second flexible circuit board; a light receiving component arranged below the light emitting component and being electrically connected to a third flexible circuit board; the first flexible circuit, with two ends thereof being electrically connected to the light emitting component and a non-high-speed signal pad provided on the second circuit board, respectively; the second flexible circuit board, with two ends thereof being electrically connected to the light emitting component and a first high-speed signal pad provided on the first circuit board, respectively; the third flexible circuit board, with two ends thereof being electrically connected to the light receiving component and a second high-speed signal pad provided on the first circuit board, respectively.

Abstract: An optical module includes a light emitting assembly. The light emitting assembly includes a plurality of lasers, a plurality of wavelength division multiplexers and a lens group. The plurality of lasers emit a plurality of optical signals. The plurality of wavelength division multiplexers multiplex the plurality of optical signals into a plurality of composite optical signals. The lens group includes a first lens, a second lens, and a third lens. The second lens is configured to transmit a first part of the plurality of composite optical signals exited from the first lens, reflect a second part of the plurality of composite optical signals exited from the third lens to the first lens, and transmit the second part of the plurality of composite optical signals reflected by the first lens, so as to multiplex the plurality of composite optical signals into the merge composite optical signal.

Abstract: An optical module includes a light receiving assembly and a first fiber optic adapter. The light receiving assembly includes a first lens group, a plurality of wavelength division demultiplexers and at least one light receiving component. The first lens group is configured to split optical signals transmitted to the first cavity body for a first time according to a wavelength to obtain a first optical signal beam and a second optical signal beam. The plurality of wavelength division demultiplexers include a first wavelength division demultiplexer and a second wavelength division demultiplexer. The first wavelength division demultiplexer is configured to split the first optical signal beam for a second time according to a wavelength. The second wavelength division demultiplexer is configured to split the second optical signal beam for a second time according to a wavelength. The light receiving component includes a plurality of light receiving chips.

Abstract: An optical module, including: a first laser and a first laser chip for driving the first laser; a second laser and a second laser chip for driving the second laser; and a multi-layer circuit board, including a surface layer, a reference layer, and an intermediate layer provided between the surface layer and the reference layer, where a first row of edge connector pins and a second row of edge connector pins are disposed in at least one surface layer; the first row of edge connector pins are disposed to be closer than the second row of edge connector pins to a side edge, of the multi-layer circuit board, that is provided with an edge connector; and a region, of the intermediate layer, that corresponds to a data signal line pin in the second row of edge connector pins is a hollow region.

Abstract: A light emission assembly including: a substrate; at least two channels including: a driving assembly including a driving chip; an EML laser assembly including an EML laser chip; a first magnetic bead; a second magnetic bead; a DC blocking capacitor; a driving multiplexing pad for electrically connecting a first end of the first magnetic bead with a signal pad of the driving chip and a first end of the DC blocking capacitor, a second end of the first magnetic bead being connected to a first supply voltage; an EML multiplexing pad for electrically connecting a first end of the second magnetic bead with the EML laser chip assembly and a second end of the DC blocking capacitor, a second end of the second magnetic bead being connected to a supply voltage of the EML laser chip. The present disclosure also provides an optical module including the light emission assembly.

Abstract: An optical module includes a circuit board and a light emitting assembly. The circuit board includes a first circuit board ground line, a second circuit board ground line and a circuit board signal line. The light emitting assembly is connected to the circuit board, and the light emitting assembly includes a spacer and a laser chip. The spacer includes a first spacer ground line, a second spacer ground line and a spacer signal line. The first spacer ground line is connected to the second spacer ground line through a fourth connection line; or the first spacer ground line is connected to the second circuit board ground line through a fifth connection line; or the second spacer ground line is connected to the first circuit board ground line through a sixth connection line; or the first circuit board ground line is connected to the second circuit board ground line through a seventh connection line.

Abstract: An optical module, including: a first laser and a first laser chip for driving the first laser; a second laser and a second laser chip for driving the second laser; and a multi-layer circuit board, including a surface layer, a reference layer, and an intermediate layer provided between the surface layer and the reference layer, where a first row of edge connector pins and a second row of edge connector pins are disposed in at least one surface layer; the first row of edge connector pins are disposed to be closer than the second row of edge connector pins to a side edge, of the multi-layer circuit board, that is provided with an edge connector; and a region, of the intermediate layer, that corresponds to a data signal line pin in the second row of edge connector pins is a hollow region.